High-Performance MEMS: Synergy in Design, Innovative Manufacturing, and Emerging Applications

Topic Information

Dear Colleagues,

Given the large number of MEMS-specific issues currently being published, what exactly is the focus of this “High-Performance MEMS” Topic? We attempt to propose the following challenging perspectives:

1. Could MEMS continue to shrink? For advanced silicon-based IC technology with 2 nm or smaller nodes, continued shrinkage is very difficult, but for most MEMS technologies whose sizes are still above 180 nm, there is obviously still plenty of room for shrinkage. How can we narrow the size gap between MEMS and IC fab technology?
2. Could CMOS MEMS become more popular in the world? There is obviously no difficulty in patterning CMOS MEMS devices using mature commercial IC fab technology, but why are there so few such research attempts? Is it because the foundry service cost is too high? Is there no corresponding 8-inch or 12-inch wafer processing equipment for MEMS post processing? Or is it because of other reasons? Can CMOS MEMS foundry technology freely design and manufacture the geometry of various transducers? What are the limiting barriers?
3. Regarding the high-performance MEMS, incorporating reliability and field validation metrics is also mandatory. It includes sensitivity, resolution, response time, long-term stability, thermal drift, humidity resistance, chemical corrosion resistance, mechanical fatigue and packaging reliability. It is crucial especially in the areas of semiconductor equipment, battery technology, green energy and smart manufacturing. With the promising ubiquitous sensing data provided by MEMS and the corresponding AI edge computing or digital twin, the traditional data measurement concept could be expanded into a real-time diagnostic and decision support platform for the above application domains.

It is believed that by addressing the above concerns, we can lower the barrier to move forward to the next-generation MEMS devices/systems and naturally nourish more emerging and cross-boundary applications.

This Topic welcomes submissions of innovative related ideas. The paper category is not limited to general articles and reviews, nor is it necessary to complete the component production and testing before submitting. Short letters or tutorials are also welcome. Nevertheless, innovative ideas are always the most valuable.

Prof. Dr. Lung-Jieh Yang
Prof. Dr. Chi-Yuan Lee
Topic Editors

Keywords

Participating Journals

Journal Name	Impact Factor	CiteScore	Launched Year	First Decision (median)	APC
Electronics electronics	2.9	7.0	2012	14.8 Days	CHF 2400	Submit
Eng eng	3.5	4.1	2020	18.8 Days	CHF 1400	Submit
Micro micro	2.4	4.0	2021	20.4 Days	CHF 1200	Submit
Micromachines micromachines	3.5	7.1	2010	16.6 Days	CHF 2100	Submit
Sensors sensors	4.0	9.4	2001	17.8 Days	CHF 2600	Submit

Preprints.org is a multidisciplinary platform offering a preprint service designed to facilitate the early sharing of your research. It supports and empowers your research journey from the very beginning.

MDPI Topics is collaborating with Preprints.org and has established a direct connection between MDPI journals and the platform. Authors are encouraged to take advantage of this opportunity by posting their preprints at Preprints.org prior to publication:

1. Share your research immediately: disseminate your ideas prior to publication and establish priority for your work.
2. Safeguard your intellectual contribution: Protect your ideas with a time-stamped preprint that serves as proof of your research timeline.
3. Boost visibility and impact: Increase the reach and influence of your research by making it accessible to a global audience.
4. Gain early feedback: Receive valuable input and insights from peers before submitting to a journal.
5. Ensure broad indexing: Web of Science (Preprint Citation Index), Google Scholar, Crossref, SHARE, PrePubMed, Scilit and Europe PMC.

Published Papers