Search Results (28)

Diamond, renowned for its exceptional electrical, physical, and chemical properties, including ultra-wide bandgap, superior hardness, high thermal conductivity, and unparalleled stability, serves as an ideal candidate for next-generation high-power and high-temperature electronic devices. Among diamond-based devices, Schottky barrier diodes (SBDs) have garnered significant attention due to their simple architecture and superior rectifying characteristics. This review systematically summarizes recent advances in diamond SBDs, focusing on both metal–semiconductor (MS) and metal–interlayer–semiconductor (MIS) configurations. For MS structures, we critically analyze the roles of single-layer metals (including noble metals, transition metals, and other metals) and multilayer metals in modulating Schottky barrier height (SBH) and enhancing thermal stability. However, the presence of interface-related issues such as high densities of surface states and Fermi level pinning often leads to poor control of the SBH, limiting device performance and reliability. To address these challenges and achieve high-quality metal/diamond interfaces, researchers have proposed various interface engineering strategies. In particular, the introduction of interfacial layers in MIS structures has emerged as a promising approach. For MIS architectures, functional interlayers—including high-k materials (Al₂O₃, HfO₂, SnO₂) and low-work-function materials (LaB₆, CeB₆)—are evaluated for their efficacy in interface passivation, barrier modulation, and electric field control. Terminal engineering strategies, such as field-plate designs and surface termination treatments, are also highlighted for their role in improving breakdown voltage. Furthermore, we emphasize the limitations in current parameter extraction from current–voltage (I–V) properties and call for a unified new method to accurately determine SBH. This comprehensive analysis provides critical insights into interface engineering strategies and evaluation protocols for high-performance diamond SBDs, paving the way for their reliable deployment in extreme conditions. Full article

The use of CH₄ as an energy source is increasing every day. To increase the efficiency of CH₄ combustion and ensure that the equipment meets ecological requirements, it is necessary to measure the CH₄ concentration in the exhaust gases of combustion systems. To this end, sensors are required that can withstand extreme operating conditions, including temperatures of at least 600 °C, as well as high pressure and gas flow rate. ZnGa₂O₄, being an ultra-wide bandgap semiconductor with high chemical and thermal stability, is a promising material for such sensors. The synthesis and investigation of the structural and CH₄ sensing properties of ceramic pellets made from pure and Er-doped ZnGa₂O₄ were conducted. Doping with Er leads to the formation of a secondary Er₃Ga₅O₁₂ phase and an increase in the active surface area. This structural change significantly enhanced the CH₄ response, demonstrating an 11.1-fold improvement at a concentration of 10⁴ ppm. At the optimal response temperature of 650 °C, the Er-doped ZnGa₂O₄ exhibited responses of 2.91 a.u. and 20.74 a.u. to 100 ppm and 10⁴ ppm of CH₄, respectively. The Er-doped material is notable for its broad dynamic range for CH₄ concentrations (from 100 to 20,000 ppm), low sensitivity to humidity variations within the 30–70% relative humidity range, and robust stability under cyclic gas exposure. In addition to CH₄, the sensitivity of Er-doped ZnGa₂O₄ to other gases at a temperature of 650 °C was investigated. The samples showed strong responses to C₂H₄, C₃H₈, C₄H₁₀, NO_2, and H₂, which, at gas concentrations of 100 ppm, were higher than the response to CH₄ by a factor of 2.41, 2.75, 3.09, 1.16, and 1.64, respectively. The study proposes a plausible mechanism explaining the sensing effect of Er-doped ZnGa₂O₄ and discusses its potential for developing high-temperature CH₄ sensors for applications such as combustion monitoring systems and determining the ideal fuel/air mixture. Full article

Wide-bandgap semiconductor betavoltaic batteries have a promising prospect in Micro-Electro-Mechanical Systems for high power density and long working life, but their material selection is still controversial. Specifically, the silicon carbide (SiC) betavoltaic battery was reported to have higher efficiency, although its bandgap is lower than that of gallium nitride (GaN) or diamond, which is inconsistent with general assumptions. In this work, the effects of different semiconductor characteristics on the battery energy conversion process are systematically analyzed to explain this phenomenon, including beta particle energy deposition, electron–hole pair (EHP) creation energy and EHPs collection efficiency. Device efficiencies of the betavoltaic battery using SiC, GaN, diamond, gallium oxide (Ga₂O₃), aluminum nitride (AlN) and boron nitride (BN) are compared to determine the optimum semiconductor. Results show that SiC for the betavoltaic battery has higher efficiency than GaN, Ga₂O₃ and AlN because of higher EHPs collection efficiency, less energy loss and fewer material defects, which is the optimal selection currently. SiC betavoltaic batteries were prepared, with the device efficiency having reached 14.88% under an electron beam, and the device efficiency recorded as 7.31% under an isotope source, which are consistent with the predicted results. This work provides a theoretical and experimental foundation for the material selection of betavoltaic batteries. Full article

Semiconductors characterized by ultrawide bandgaps (UWBGs), exceeding the SiC bandgap of 3.2 eV and the GaN bandgap of 3.4 eV, are currently under focus for applications in high-power and radio-frequency (RF) electronics, as well as in deep-ultraviolet optoelectronics and extreme environmental conditions. These semiconductors offer numerous advantages, such as a high breakdown field, exceptional thermal stability, and minimized power losses. This study used numerical simulation to investigate, at the material level, the single-particle radiation response of various UWBG semiconductors, such as aluminum gallium nitride alloys (Al_xGa_1−xN), diamond, and β-phase gallium oxide (β-Ga₂O₃), when exposed to ground-level neutrons. Through comprehensive Geant4 simulations covering the entire spectrum of atmospheric neutrons at sea level, this study provides an accurate comparison of the neutron radiation responses of these UWBG semiconductors focusing on the interaction processes, the number and nature of secondary ionizing products, their energy distributions, and the production of electron–hole pairs at the origin of single-event effects (SEEs) in microelectronics devices. Full article

Rapid thermal annealing (RTA) has been widely used in semiconductor device processing. However, the rise time of RTA, limited to the millisecond (ms) range, is unsuitable for advanced nanometer-scale electronic devices. Using sub-energy bandgap (E_G) 532 nm ultra-fast 15 nanosecond (ns) pulsed laser annealing, a record-high dielectric constant (high-κ) of 67.8 and a capacitance density of 75 fF/μm² at −0.2 V were achieved in Ni/ZrO₂/TiN capacitors. According to heat source and diffusion equations, the surface temperature of TiN can reach as high as 870 °C at a laser energy density of 16.2 J/cm², effectively annealing the ZrO₂ material. These record-breaking results are enabled by a novel annealing method—the surface plasma effect generated on the TiN metal. This is because the 2.3 eV (532 nm) pulsed laser energy is significantly lower than the 5.0–5.8 eV energy bandgap (E_G) of ZrO₂, making it unabsorbable by the ZrO₂ dielectric. X-ray diffraction analysis reveals that the large κ value and capacitance density are attributed to the enhanced crystallinity of the cubic-phase ZrO₂, which is improved through laser annealing. This advancement is critical for monolithic three-dimensional device integration in the backend of advanced integrated circuits. Full article

β-Ga₂O₃ is an ultra-wide bandgap semiconductor (E_g~4.8 eV) of interest for many applications, including optoelectronics. Undoped Ga₂O₃ emits light in the UV range that can be tuned to the visible region of the spectrum by rare earth dopants. In this work, we investigate the crystal lattice recovery of $(\overline{2}01)$-oriented β-Ga₂O₃ crystals implanted with Yb ions to the fluence of 1 ×10¹⁴ at/cm². Post-implantation annealing at a range of temperature and different atmospheres was used to investigate the β-Ga₂O₃ crystal structure recovery and optical activation of Yb ions. Ion implantation is a renowned technique used for material doping, but in spite of its many advantages such as the controlled introduction of dopants in concentrations exceeding the solubility limits, it also causes damage to the crystal lattice, which strongly influences the optical response from the material. In this work, post-implantation defects in β-Ga₂O₃:Yb crystals, their transformation, and the recovery of the crystal lattice after thermal treatment have been investigated by channeling Rutherford backscattering spectrometry (RBS/c) supported by McChasy simulations, and the optical response was tested. It has been shown that post-implantation annealing at temperatures of 700–900 °C results in partial crystal lattice recovery, but it is accompanied by the out-diffusion of Yb ions toward the surface if the annealing temperature and time exceed 800 °C and 10 min, respectively. High-temperature implantation at 500–900 °C strongly limits post-implantation damage to the crystal lattice, but it does not cause the intense luminescence of Yb ions. This suggests that the recovery of the crystal lattice is not a sufficient condition for strong rare-earth photoluminescence at room temperature and that oxygen annealing is beneficial for intense infrared luminescence compared to other tested environments. Full article

Ultrafast laser technology has moved from ultrafast to ultra-strong due to the development of chirped pulse amplification technology. Ultrafast laser technology, such as femtosecond lasers and picosecond lasers, has quickly become a flexible tool for processing brittle and hard materials and complex micro-components, which are widely used in and developed for medical, aerospace, semiconductor applications and so on. However, the mechanisms of the interaction between an ultrafast laser and brittle and hard materials are still unclear. Meanwhile, the ultrafast laser processing of these materials is still a challenge. Additionally, highly efficient and high-precision manufacturing using ultrafast lasers needs to be developed. This review is focused on the common challenges and current status of the ultrafast laser processing of brittle and hard materials, such as nickel-based superalloys, thermal barrier ceramics, diamond, silicon dioxide, and silicon carbide composites. Firstly, different materials are distinguished according to their bandgap width, thermal conductivity and other characteristics in order to reveal the absorption mechanism of the laser energy during the ultrafast laser processing of brittle and hard materials. Secondly, the mechanism of laser energy transfer and transformation is investigated by analyzing the interaction between the photons and the electrons and ions in laser-induced plasma, as well as the interaction with the continuum of the materials. Thirdly, the relationship between key parameters and ultrafast laser processing quality is discussed. Finally, the methods for achieving highly efficient and high-precision manufacturing of complex three-dimensional micro-components are explored in detail. Full article

Diamond is known as the ultimate semiconductor material for electric devices with excellent properties such as an ultra-wide bandgap (5.47 eV), high carrier mobility (electron mobility 4000 cm²/V·s, hole mobility 3800 cm²/V·s), high critical breakdown electric field (20 MV/cm), and high thermal conductivity (22 W/cm·K), showing good prospects in high-power applications. The lack of n-type diamonds limits the development of bipolar devices; most of the research focuses on p-type Schottky barrier diodes (SBDs) and unipolar field-effect transistors (FETs) based on terminal technology. In recent years, breakthroughs have been made through the introduction of new structures, dielectric materials, heterogeneous epitaxy, etc. Currently, diamond devices have shown promising applications in high-power applications, with a BV of 10 kV, a BFOM of 874.6 MW/cm², and a current density of 60 kA/cm² already realized. This review summarizes the research progress of diamond materials, devices, and specific applications, with a particular focus on the development of SBDs and FETs and their use in high-power applications, aiming to provide researchers with the relevant intuitive parametric comparisons. Finally, the paper provides an outlook on the parameters and development directions of diamond power devices. Full article

During the past decade, Gallium Oxide (Ga₂O₃) has attracted intensive research interest as an ultra-wide-bandgap (UWBG) semiconductor due to its unique characteristics, such as a large bandgap of 4.5–4.9 eV, a high critical electric field of ~8 MV/cm, and a high Baliga’s figure of merit (BFOM). Unipolar β-Ga₂O₃ devices such as Schottky barrier diodes (SBDs) and field-effect transistors (FETs) have been demonstrated. Recently, there has been growing attention toward developing β-Ga₂O₃-based heterostructures and heterojunctions, which is mainly driven by the lack of p-type doping and the exploration of multidimensional device architectures to enhance power electronics’ performance. This paper will review the most recent advances in β-Ga₂O₃ heterostructures and heterojunctions for power electronics, including NiO_x/β-Ga₂O₃, β-(Al_xGa_1−x)₂O₃/β-Ga₂O₃, and β-Ga₂O₃ heterojunctions/heterostructures with other wide- and ultra-wide-bandgap materials and the integration of two-dimensional (2D) materials with β-Ga₂O₃. Discussions of the deposition, fabrication, and operating principles of these heterostructures and heterojunctions and the associated device performance will be provided. This comprehensive review will serve as a critical reference for researchers engaged in materials science, wide- and ultra-wide-bandgap semiconductors, and power electronics and benefits the future study and development of β-Ga₂O₃-based heterostructures and heterojunctions and associated power electronics. Full article

Mono- and few-layer hexagonal AlN (h-AlN) has emerged as an alternative “beyond graphene” and “beyond h-BN” 2D material, especially in the context of its verification in ultra-high vacuum Scanning Tunneling Microscopy and Molecular-beam Epitaxy (MBE) experiments. However, graphitic-like AlN has only been recently obtained using a scalable and semiconductor-technology-related synthesis techniques, such as metal–organic chemical vapor deposition (MOCVD), which involves a hydrogen-rich environment. Motivated by these recent experimental findings, in the present work, we carried out ab initio calculations to investigate the hydrogenation of h-AlN monolayers in a variety of functionalization configurations. We also investigated the fluorination of h-AlN monolayers in different decoration configurations. We find that a remarkable span of bandgap variation in h-AlN, from metallic properties to nar-row-bandgap semiconductor, and to wide-bandgap semiconductor can be achieved by its hy-drogenation and fluorination. Exciting application prospects may also arise from the findings that H and F decoration of h-AlN can render some such configurations magnetic. We complemented this modelling picture by disclosing a viable experimental strategy for the fluorination of h-AlN. Full article

The influence of various energetic particles and electron injection on the transport of minority carriers and non-equilibrium carrier recombination in Ga₂O₃ is summarized in this review. In Ga₂O₃ semiconductors, if robust p-type material and bipolar structures become available, the diffusion lengths of minority carriers will be of critical significance. The diffusion length of minority carriers dictates the functionality of electronic devices such as diodes, transistors, and detectors. One of the problems in ultrawide-bandgap materials technology is the short carrier diffusion length caused by the scattering on extended defects. Electron injection in n- and p-type gallium oxide results in a significant increase in the diffusion length, even after its deterioration, due to exposure to alpha and proton irradiation. Furthermore, post electron injection, the diffusion length of an irradiated material exceeds that of Ga₂O₃ prior to irradiation and injection. The root cause of the electron injection-induced effect is attributed to the increase in the minority carrier lifetime in the material due to the trapping of non-equilibrium electrons on native point defects. It is therefore concluded that electron injection is capable of “healing” the adverse impact of radiation in Ga₂O₃ and can be used for the control of minority carrier transport and, therefore, device performance. Full article

Power electronics are becoming increasingly more important, as electrical energy constitutes 40% of the total primary energy usage in the USA and is expected to grow rapidly with the emergence of electric vehicles, renewable energy generation, and energy storage. New materials that are better suited for high-power applications are needed as the Si material limit is reached. Beta-phase gallium oxide (β-Ga₂O₃) is a promising ultra-wide-bandgap (UWBG) semiconductor for high-power and RF electronics due to its bandgap of 4.9 eV, large theoretical breakdown electric field of 8 MV cm⁻¹, and Baliga figure of merit of 3300, 3–10 times larger than that of SiC and GaN. Moreover, β-Ga₂O₃ is the only WBG material that can be grown from melt, making large, high-quality, dopable substrates at low costs feasible. Significant efforts in the high-quality epitaxial growth of β-Ga₂O₃ and β-(Al_xGa_1−x)₂O₃ heterostructures has led to high-performance devices for high-power and RF applications. In this report, we provide a comprehensive summary of the progress in β-Ga₂O₃ field-effect transistors (FETs) including a variety of transistor designs, channel materials, ohmic contact formations and improvements, gate dielectrics, and fabrication processes. Additionally, novel structures proposed through simulations and not yet realized in β-Ga₂O₃ are presented. Main issues such as defect characterization methods and relevant material preparation, thermal studies and management, and the lack of p-type doping with investigated alternatives are also discussed. Finally, major strategies and outlooks for commercial use will be outlined. Full article

GaOOH, having a bandgap of 4.7–4.9 eV, can be regarded as one of several ultrawide-bandgap (UWBG) semiconductors, although it has so far mainly been used as a precursor material of Ga₂O₃. To examine the possibility of valence control and application in electronics, impurity levels in GaOOH are investigated using the first-principles density-functional theory calculation. The density values of the states of a supercell including an impurity atom are calculated. According to the results, among the group 14 elements, Si is expected to introduce a shallow donor level, i.e., a free electron is introduced. On the other hand, Ge and Sn introduce a localized state about 0.7 eV below the conduction band edge, and thus cannot act as an effective donor. While Mg and Ca can introduce a free hole and act as a shallow acceptor, Zn and Cd introduce acceptor levels away from the valence band. The transition metal elements (Fe, Co, Ni, Cu) are also considered, but none of them are expected to act as a shallow dopant. Thus, the results suggest that the carrier concentration can be controlled if Si is used for n-type doping, and Mg and Ca for p-type doping. Since GaOOH can be easily deposited using various chemical techniques at low temperatures, GaOOH will potentially be useful for transparent electronic devices. Full article

Ultra-wide bandgap Ga₂O₃-based optoelectronic devices have attracted considerable attention owing to their special significance in military and commercial applications. Using RF magnetron sputtering and post-annealing, monoclinic Ga₂O₃ films of various thicknesses were created on a c-plane sapphire substrate (0001). The structural and optical properties of β-Ga₂O₃ films were then investigated. The results show that all β-Ga₂O₃ films have a single preferred orientation ($2(\_)$01) and an average transmittance of more than 96% in the visible wavelength range (380–780 nm). Among them, the sample with a 90-minute sputtering time has the best crystal quality. This sample was subsequently used to construct a metal-semiconductor-metal (MSM), solar-blind, ultraviolet photodetector. The resulting photodetector not only exhibits excellent stability and sunblind characteristics but also has an ultra-high responsivity (46.3 A/W) and superb detectivity (1.83 × 10¹³ Jones). Finally, the application potential of the device in solar-blind ultraviolet imaging was verified. Full article

Ultra-wide bandgap semiconductor gallium oxide (Ga₂O₃) features a breakdown strength of 8 MV/cm and bulk mobility of up to 300 cm²V⁻¹s⁻¹, which is considered a promising candidate for next-generation power devices. However, its low thermal conductivity is reckoned to be a severe issue in the thermal management of high-power devices. The epitaxial integration of gallium oxide thin films on silicon carbide (SiC) substrates is a possible solution for tackling the cooling problems, yet premature breakdown at the Ga₂O₃/SiC interface would be introduced due to the relatively low breakdown strength of SiC (3.2 MV/cm). In this paper, the on-state properties as well as the breakdown characteristics of the Ga₂O₃-on-SiC metal-oxide-semiconductor field-effect transistor (MOSFET) were investigated by using the technology computer-aided design (TCAD) approach. Compared with the full-Ga₂O₃ MOSFET, the lattice temperature of the Ga₂O₃-on-SiC MOSFET was decreased by nearly 100 °C thanks to the high thermal conductivity of SiC. However, a breakdown voltage degradation of >40% was found in an unoptimized Ga₂O₃-on-SiC MOSFET. Furthermore, by optimizing the device structure, the breakdown voltage degradation of the Ga₂O₃-on-SiC MOSFET is significantly relieved. As a result, this work demonstrates the existence of premature breakdown in the Ga₂O₃-on-SiC MOSFET and provides feasible approaches to further enhance the performance of hetero-integrated Ga₂O₃ power devices. Full article