Search Results (20)

This paper presents a new methodology for localizing impact events on plate-like structures using a proposed two-dimensional convolutional neural network (CNN) and received impact signals. A network of four piezoelectric wafer active sensors (PWAS) was installed on the tested plate to acquire impact signals. These signals consisted of reflection waves that provided valuable information about impact events. In this methodology, each of the received signals was divided into several equal segments. Then, a wavelet transform (WT)-based time-frequency analysis was used for processing each segment signal. The generated WT diagrams of these segments’ signals were cropped and resized using MATLAB code to be used as input image datasets to train, validate, and test the proposed CNN model. Two scenarios were adopted from PAWS transducers. First, two sensors were positioned in two corners of the plate, while, in the second scenario, four sensors were used to monitor and collect the signals. Eight datasets were collected and reshaped from these two scenarios. These datasets presented the signals of two, three, four, and five impacts. The model’s performance was evaluated using four metrics: confusion matrix, accuracy, precision, and F1 score. The proposed model demonstrated exceptional performance by accurately localizing all of the impact points of the first scenario and 99% of the second scenario. The main limitation of the proposed model is how to differentiate the data samples that have similar features. From our point of view, the similarity challenge arose from two factors: the segmentation interval and the impact distance. First, applying the segmenting procedure to the PWAS signals led to an increase in the number of data samples. The procedure segmented each PWAS signal to 30 samples with equal intervals, regardless of the features of the signal. Segmenting and transforming different PWAS signals into image-based data points led to data samples that had similar features. Second, some of the impacts had a close distance to the PWAS sensors, which resulted in similar segmented signals. Therefore, the second scenario was more challenging for the proposed model. Full article

Temperature has a significant impact on the operational lifetime of electronic components, as excessive heat can lead to accelerated degradation and ultimately failure. In safety-critical applications, it is important that real-time monitoring is employed to reduce the risk of system failures and maintain the safety, reliability, and integrity of the connected systems. In the case of printed circuit boards (PCBs), it is often not feasible to install enough sensors to adequately cover all of the temperature sensitive components. In this study, we present a novel method for the temperature monitoring of PCBs using ultrasonic guided waves and machine learning techniques. Our approach utilizes a small number of low-cost, unobtrusive piezoelectric wafer active sensors (PWAS) sensors for propagating ultrasonic guided waves across a PCB. Through interaction with board features, the temperature of components can be predicted using multi-output regression algorithms. Our technique has been applied to three different PCBs, each with five hotspot positions, achieving an RMSE of <3.5 °C and $R^2$ > 0.95 in all three cases. Full article

Guided ultrasonic wave (GUW) analysis is a well-investigated method for structural health monitoring (SHM) applications. For plate-like structures, the pitch-catch technique is a popular choice since it offers the possibility to investigate a large area with a small number of sensors. This method requires a large amount of data to be analyzed to detect and localize damage, with the consequence that, besides the presence of damage, environmental influences like temperature and load will also change the GUW signals. In addition, the location, size, and type of the damage will result in different changes in the GUW signals. Data-driven methods require sufficient data and therefore require data augmentation. In order to get closer to this goal, this study aims to demonstrate the conversion of GUW signals measured with an air-coupled measurement system (ACMS) into signals measured with piezoelectric wafer active sensors (PWAS). This would allow the fast measurement of GUW data with ACMS at different positions of a plate-like specimen and translate it to a surface-bonded PWAS signal without the time-consuming process of transducer mounting. In this study, it is assumed that the measurement methods are not independent of each other when they are measured at the same position. To obtain the transform function from ACMS to PWAS, GUW signals were measured both with ACMS and PWAS for different positions of artificial damage. Since both signal classes are physically dependent, it should be possible to determine the transform function with machine learning (ML) methods. As input, the ACMS time-dependent signal or signal features are used, while the PWAS signals serve as labels for the training process. We are evaluating different ML-based transform model architectures with respect to their suitability for signal or signal feature transformation, e.g., ANN, CNN, and LSTM-based networks, with a particular focus on autoencoders. Full article

This paper addresses the challenging issue of achieving high spatial resolution in temperature monitoring of printed circuit boards (PCBs) without compromising the operation of electronic components. Traditional methods involving numerous dedicated sensors such as thermocouples are often intrusive and can impact electronic functionality. To overcome this, this study explores the application of ultrasonic guided waves, specifically utilising a limited number of cost-effective and unobtrusive Piezoelectric Wafer Active Sensors (PWAS). Employing COMSOL multiphysics, wave propagation is simulated through a simplified PCB while systematically varying the temperature of both components and the board itself. Machine learning algorithms are used to identify hotspots at component positions using a minimal number of sensors. An accuracy of 97.6% is achieved with four sensors, decreasing to 88.1% when utilizing a single sensor in a pulse–echo configuration. The proposed methodology not only provides sufficient spatial resolution to identify hotspots but also offers a non-invasive and efficient solution. Such advancements are important for the future electrification of the aerospace and automotive industries in particular, as they contribute to condition-monitoring technologies that are essential for ensuring the reliability and safety of electronic systems. Full article

This study conducted experimental and numerical investigations on piezoelectric wafer active sensors (PWASs) bonded to an aluminum plate to assess the impact of bonding degradation on Lamb wave generation. Three surface-bonded PWASs were examined, including one intentionally bonded with a reduced adhesive to create a defective bond. Thermal cyclic aging was applied, monitoring through laser Doppler vibrometry (LDV) and static capacitance measurements. The PWAS with the initially defective bond exhibited the poorest performance over aging cycles, emphasizing the significance of the initial bond condition. As debonding progressed, modifications in electromechanical behavior were observed, leading to a reduction in wave amplitude and distortion of the generated wave field, challenging the validity of existing analytical modeling of wave-tuning curves for perfectly bonded PWASs. Both numerical simulations and experimental observations substantiated this finding. In conclusion, this study highlights the imperative of a high-integrity bond for the proper functioning of a guided wave-based structural health monitoring (SHM) system, emphasizing ongoing challenges in assessing SHM performance. Full article

Piezoelectric materials are defined by their ability to display a charge across their surface in response to mechanical strain, making them great for use in sensing applications. Such applications include pressure sensors, medical devices, energy harvesting and structural health monitoring (SHM). SHM describes the process of using a systematic approach to identify damage in engineering infrastructure. A method of SHM that uses piezoelectric wafers connected directly to the structure has become increasingly popular. An investigation of a novel pitch-catch method of determining instrumentation quality of piezoelectric wafer active sensors (PWASs) used in SHM was conducted as well as an investigation into the effects of defects in piezoelectric sensors and sensor bonding on the sensor response. This pitch-catch method was able to verify defect-less instrumentation quality of pristinely bonded PWASs. Additionally, the pitch-catch method was compared with the electromechanical impedance method in determining defects in piezoelectric sensor instrumentation. Using the pitch-catch method, it was found that defective instrumentation resulted in decreasing amplitude of received and transmitted signals as well as changes in the frequency spectrums of the signals, such as the elimination of high frequency peaks in those with defects in the bonding layer and an increased amplitude of around 600 kHz for a broken PWAS. The electromechanical impedance method concluded that bonding layer defects increase the primary frequency peak’s amplitude and cause a downward frequency shift in both the primary and secondary frequency peaks in the impedance spectrum, while a broken sensor has the primary peak amplitude reduced while shifting upward and nearly eliminating the secondary peak. Full article

Water management is a key issue in the design and operation of proton exchange membrane fuel cells (PEMFCs). For an efficient and stable operation, the accumulation of liquid water inside the flow channels has to be prevented. Existing measurement methods for localizing water are limited in terms of the integration and application of measurements in operating PEMFC stacks. In this study, we present a measurement method for the localization of liquid water based on ultrasonic guided waves. Using a sparse sensing array of four piezoelectric wafer active sensors (PWAS), the measurement requires only minor changes in the PEMFC cell design. The measurement method is demonstrated with ex situ measurements for water drop localization on a single bipolar plate. The wave propagation of the guided waves and their interaction with water drops on different positions of the bipolar plate are investigated. The complex geometry of the bipolar plate leads to complex guided wave responses. Thus, physical modeling of the wave propagation and tomographic methods are not suitable for the localization of the water drops. Using machine learning methods, it is demonstrated that the position of a water drop can be obtained from the guided wave responses despite the complex geometry of the bipolar plate. Our results show standard deviations of 4.2 mm and 3.3 mm in the x and y coordinates, respectively. The measurement method shows high potential for in situ measurements in PEMFC stacks as well as for other applications that require deposit localization on geometrically complex waveguides. Full article

The acoustic emission (AE) technique has become a well-established method of monitoring structural health over recent years. The sensing and analysis of elastic AE waves, which have involved piezoelectric wafer active sensors (PWAS) and time domain and frequency domain analysis, has proven to be effective in yielding fatigue crack-related information. However, not much research has been performed regarding (i) the correlation between the fatigue crack length and AE signal signatures and (ii) artificial intelligence (AI) methodologies to automate the AE waveform analysis. In this paper, this crack length correlation is investigated along with the development of a novel AE signal analysis technique via AI. A finite element model (FEM) study was first performed to understand the effects of fatigue crack length on the resulting AE waveforms and a fatigue experiment was performed to capture experimental AE waveforms. Finally, this database of experimental AE waveforms was used with a convolutional neural network to build a system capable of performing automated classification and prediction of the length of a fatigue crack that excited respective AE signals. AE signals captured during a fatigue crack growth experiment were found to match closely with the FEM simulations. This novel AI system proved to be effective at predicting the crack length of an AE signal at an accuracy of 98.4%. This novel AI-enabled AE signal analysis technique will provide a crucial step forward in the development of a comprehensive structural health monitoring (SHM) system. Full article

Acoustic waves are widely used in structural health monitoring (SHM) for detecting fatigue cracking. The strain energy released when a fatigue crack advances has the effect of exciting acoustic waves, which travel through the structures and are picked up by the sensors. Piezoelectric wafer active sensors (PWAS) can effectively sense acoustic waves due to fatigue-crack growth. Conventional acoustic-wave passive SHM, which relies on counting the number of acoustic events, cannot precisely estimate the crack length. In the present research, a novel method for estimating the crack length was proposed based on the high-frequency resonances excited in the crack by the energy released when a crack advances. In this method, a PWAS sensor was used to sense the acoustic wave signal and predict the length of the crack that generated the acoustic event. First, FEM analysis was undertaken of acoustic waves generated due to a fatigue-crack growth event on an aluminum-2024 plate. The FEM analysis was used to predict the wave propagation pattern and the acoustic signal received by the PWAS mounted at a distance of 25 mm from the crack. The analysis was carried out for crack lengths of 4 and 8 mm. The presence of the crack produced scattering of the waves generated at the crack tip; this phenomenon was observable in the wave propagation pattern and in the acoustic signals recorded at the PWAS. A study of the signal frequency spectrum revealed peaks and valleys in the spectrum that changed in frequency and amplitude as the crack length was changed from 4 to 8 mm. The number of peaks and valleys was observed to increase as the crack length increased. We suggest this peak–valley pattern in the signal frequency spectrum can be used to determine the crack length from the acoustic signal alone. An experimental investigation was performed to record the acoustic signals in crack lengths of 4 and 8 mm, and the results were found to match well with the FEM predictions. Full article

Barely visible impact damage (BVID) due to low velocity impact events in composite aircraft structures are becoming prevalent. BVID can have an adverse effect on the strength and safety of the structure. During aircraft inspections it can be extremely difficult to visually detect BVID. Moreover, it is also a challenge to ascertain if the BVID has in-fact caused internal damage to the structure or not. This paper describes a method to ascertain whether or not internal damage happened during the impact event by analyzing the high-frequency information contained in the recorded acoustic emission signal signature. Multiple 2 mm quasi-isotropic carbon fiber reinforced polymer (CFRP) composite coupons were impacted using the ASTM D7136 standard in a drop weight impact testing machine to determine the mass, height and energy parameters to obtain approximately 1” impact damage size in the coupons iteratively. For subsequent impact tests, four piezoelectric wafer active sensors (PWAS) were bonded at specific locations on each coupon to record the acoustic emission (AE) signals during the impact event using the MISTRAS micro-II digital AE system. Impact tests were conducted on these instrumented 2 mm coupons using previously calculated energies that would create either no damage or 1” impact damage in the coupons. The obtained AE waveforms and their frequency spectrums were analyzed to distinguish between different AE signatures. From the analysis of the recorded AE signals, it was verified if the structure had indeed been damaged due to the impact event or not. Using our proposed structural health monitoring technique, it could be possible to rapidly identify impact events that cause damage to the structure in real-time and distinguish them from impact events that do not cause damage to the structure. An invention disclosure describing our acoustic emission structural health monitoring technique has been filed and is in the process of becoming a provisional patent. Full article

This paper investigates the potential of a novel vibration-based thermal health monitoring method for continuous and on-board damage detection in fiber reinforced polymer sandwich structures, as typically used in aerospace applications. This novel structural health monitoring method uses the same principles, which are used for vibration-based thermography in combination with the concept of the local defect resonance, as a well known non-destructive testing method (NDT). The use of heavy shakers for applying strong excitation and infrared cameras for observing thermal responses are key hindrances for the application of vibration-based thermography in real-life structures. However, the present study circumvents these limitations by using piezoelectric wafer active sensors as excitation source, which can be permanently bonded on mechanical structures. Additionally, infrared cameras are replaced by surface temperature sensors for observing the thermal responses due to vibrations and damage. This makes continuous and on-board thermal health monitoring possible. The new method is experimentally validated in laboratory experiments by a sandwich structure with face layer debonding as damage scenario. The debonding is realized by introduction of an insert during the manufacturing process of the specimen. The surface temperature sensor results successfully show the temperature increase in the area of the debonding caused by a sinusoidal excitation of the sandwich structure with the PWAS at the first resonance frequency of the damage. This is validated by conventional infrared thermography. These findings demonstrate the potential of the proposed novel thermal health monitoring method for detecting, localizing and estimating sizes of face layer debonding in sandwich structures. Full article

The acoustic emission (AE) method is a very popular and well-developed method for passive structural health monitoring of metallic and composite structures. AE method has been efficiently used for damage source detection and damage characterization in a large variety of structures over the years, such as thin sheet metals. Piezoelectric wafer active sensors (PWASs) are lightweight and inexpensive transducers, which recently drew the attention of the AE research community for AE sensing. The focus of this paper is on understanding the fatigue crack growth AE signals in thin sheet metals recorded using PWAS sensors on the basis of the Lamb wave theory and using this understanding for predictive modeling of AE signals. After a brief introduction, the paper discusses the principles of sensing acoustic signals by using PWAS. The derivation of a closed-form expression for PWAS response due to a stress wave is presented. The transformations happening to the AE signal according to the instrumentations we used for the fatigue crack AE experiment is also discussed. It is followed by a summary of the in situ AE experiments performed for recording fatigue crack growth AE and the results. Then, we present an analytical model of fatigue crack growth AE and a comparison with experimental results. The fatigue crack growth AE source was modeled analytically using the dipole moment concept. By using the source modeling concept, the analytical predictive modeling and simulation of the AE were performed using normal mode expansion (NME). The simulation results showed good agreement with experimental results. A strong presence of nondispersive S0 Lamb wave mode due to the fatigue crack growth event was observed in the simulation and experiment. Finally, the analytical method was verified using the finite element method. The paper ends with a summary and conclusions; suggestions for further work are also presented. Full article

High-temperature (HT) ultrasonic transducers are of increasing interest for structural health monitoring (SHM) of structures operating in harsh environments. This article focuses on the development of an HT piezoelectric wafer active sensor (HT-PWAS) for SHM of HT pipelines using ultrasonic guided waves. The PWAS was fabricated using Y-cut gallium phosphate (GaPO₄) to produce a torsional guided wave mode on pipes operating at temperatures up to 600 °C. A number of confidence-building tests on the PWAS were carried out. HT electromechanical impedance (EMI) spectroscopy was performed to characterise piezoelectric properties at elevated temperatures and over long periods of time (>1000 h). Laser Doppler vibrometry (LDV) was used to verify the modes of vibration. A finite element model of GaPO₄ PWAS was developed to model the electromechanical behaviour of the PWAS and the effect of increasing temperatures, and it was validated using EMI and LDV experimental data. This study demonstrates the application of GaPO₄ for guided-wave SHM of pipelines and presents a model that can be used to evaluate different transducer designs for HT applications. Full article

In this paper, some recent piezoelectric wafer active sensors (PWAS) progress achieved in our laboratory for active materials and smart structures (LAMSS) at the University of South Carolina: http: //www.me.sc.edu/research/lamss/ group is presented. First, the characterization of the PWAS materials shows that no significant change in the microstructure after exposure to high temperature and nuclear radiation, and the PWAS transducer can be used in harsh environments for structural health monitoring (SHM) applications. Next, PWAS active sensing of various damage types in aluminum and composite structures are explored. PWAS transducers can successfully detect the simulated crack and corrosion damage in aluminum plates through the wavefield analysis, and the simulated delamination damage in composite plates through the damage imaging method. Finally, the novel use of PWAS transducers as acoustic emission (AE) sensors for in situ AE detection during fatigue crack growth is presented. The time of arrival of AE signals at multiple PWAS transducers confirms that the AE signals are originating from the crack, and that the amplitude decay due to geometric spreading is observed. Full article

This paper focuses on impact localization of composite structures, which possess more complexity in the guided wave propagation due to the anisotropic behavior of composite materials. In this work, a composite plate was manufactured by using a compression molding process with proper pressure and temperature cycle. Eight layers of woven composite prepreg were used to manufacture the composite plate. A structural health monitoring (SHM) technique was implemented with piezoelectric wafer active sensors (PWAS) to detect and localize the impact on the plate. There were two types of impact event that were considered in this paper (a) low energy impact event (b) high energy impact event. Two clusters of sensors recorded the guided acoustic waves generated from the impact. The acoustic signals were then analyzed using a wavelet transform based time-frequency analysis. The proposed SHM technique successfully detected and localized the impact event on the plate. The experimentally measured impact locations were compared with the actual impact locations. An immersion ultrasonic scanning method was used to visualize the composite plate before and after the impact event. A high frequency 10 MHz 1-inch focused transducer was used to scan the plate in the immersion tank. Scanning results showed that there was no visible manufacturing damage in the composite plate. However, clear impact damage was observed after the high-energy impact event. Full article