- Article
Comparison between Bosch and STiGer Processes for Deep Silicon Etching
- Thomas Tillocher,
- Jack Nos,
- Gaëlle Antoun,
- Philippe Lefaucheux,
- Mohamed Boufnichel and
- Rémi Dussart
The cryogenic process is well known to etch high aspect ratio features in silicon with smooth sidewalls. A time-multiplexed cryogenic process, called STiGer, was developed in 2006 and patented. Like the Bosch process, it consists in repeating cycles...