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18 pages, 3676 KB  
Article
Tailoring Copper Pillars to Prevent Physical Aging in Matrimid® 5218 Carbon Molecular Sieve Membranes
by Whitney K. Cosey, Edson V. Perez, Kenneth J. Balkus, John P. Ferraris and Inga H. Musselman
Membranes 2026, 16(4), 133; https://doi.org/10.3390/membranes16040133 - 1 Apr 2026
Viewed by 531
Abstract
Carbon molecular sieve membranes (CMSMs) provide a means to greatly improve gas separations. CMSMs have a pore size distribution comprising micropores and ultramicropores which provide high flux and high selectivity, enabling them to outperform polymeric membranes. CMSMs, however, suffer from physical aging that [...] Read more.
Carbon molecular sieve membranes (CMSMs) provide a means to greatly improve gas separations. CMSMs have a pore size distribution comprising micropores and ultramicropores which provide high flux and high selectivity, enabling them to outperform polymeric membranes. CMSMs, however, suffer from physical aging that results from the collapse of the pores that severely reduces their gas permeability. Therefore, reducing physical aging of CMSMs is an important step in the development of these types of materials. In this work, a method for reducing physical aging through the incorporation of metal nanoparticles that serve as a structural scaffold for the membrane pore structure is presented. The pore structure in CMSMs is dependent upon the polymeric precursor, and thus the support system incorporated must be tailored. The copper nanoparticles were formed in situ from soluble, copper-based metal–organic polyhedra 18 (MOP-18) dispersed into Matrimid® 5218, a low free volume polymer. The size (2 to 20 nm) and shape (sphere, rods) of the copper particles were refined by adjusting MOP-18 loading, pyrolysis temperature, and soaking time. The Cu-pillared Matrimid® 5218 CMSMs from this work showed no decline in permeability or selectivity for methane (107 Barrer) and carbon dioxide (1785 Barrer) over a period of 21 d. The results suggest that tailored metal pillars can suppress physical aging in CMSMs, thereby enhancing their long-term stability and applicability in gas separations. Full article
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19 pages, 6228 KB  
Article
Research on Optimization of Orebody Mining Sequence Under Isolation Layer of Filling Body Based on FLAC3D Software
by Yu Wang and Aibing Jin
Processes 2025, 13(7), 2296; https://doi.org/10.3390/pr13072296 - 18 Jul 2025
Cited by 1 | Viewed by 1019
Abstract
This study investigates the stability risks associated with a substandard-thickness (42 m) backfill isolation layer in the open-underground coordinated mining system of the Yongping Copper Mine’s eastern panel at the −150 m level. A numerical simulation based on FLAC3D 3.00 was conducted to [...] Read more.
This study investigates the stability risks associated with a substandard-thickness (42 m) backfill isolation layer in the open-underground coordinated mining system of the Yongping Copper Mine’s eastern panel at the −150 m level. A numerical simulation based on FLAC3D 3.00 was conducted to evaluate the impacts of four mining sequences (south-to-north, north-to-south, center-to-flank, and flank-to-center) on stress redistribution and displacement evolution. A three-dimensional geomechanical model incorporating lithological parameters was established, with 23 monitoring points tracking stress and displacement dynamics. Results indicate that the mining sequence significantly influences the stability of both the isolation layer and the slope. No abrupt displacement occurred during mining, with incremental isolation layer settlement controlled within 3 mm. Post-mining maximum displacement increased to 10–12 mm. The “north-to-south” sequence emerged as the theoretically optimal solution, reducing cumulative displacements in pillars and stopes by 9.1% and 7.8%, respectively, compared to the suboptimal scheme. However, considering the engineering continuity of the existing “south-to-north” sequence at the −100 m level, maintaining consistent directional mining at the −150 m level is recommended to ensure synergistic disturbance control, ventilation system stability, and operational management coherence. Full article
(This article belongs to the Section Energy Systems)
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12 pages, 3480 KB  
Article
Laser Micromachining for the Nucleation Control of Nickel Microtextures for IR Emission
by Tatsuhiko Aizawa, Hiroki Nakata and Takeshi Nasu
Micromachines 2025, 16(6), 696; https://doi.org/10.3390/mi16060696 - 11 Jun 2025
Cited by 1 | Viewed by 1150
Abstract
Femtosecond laser micromachining was utilized to build up a micro-through-hole array into a sacrificial film, which was coated onto a copper specimen. This micro-through hole was shaped in the paraboloidal profile, with its micro-dimple on the interface between the copper substrate and the [...] Read more.
Femtosecond laser micromachining was utilized to build up a micro-through-hole array into a sacrificial film, which was coated onto a copper specimen. This micro-through hole was shaped in the paraboloidal profile, with its micro-dimple on the interface between the copper substrate and the film. This profile was simply in correspondence with the laser energy profile. The array was used as a nucleation and growth site for nickel cluster deposition during wet plating. The micro-pillared unit cells nucleated at the micro-dimple and grew on the inside of the micro-through hole. After removing the sacrificial film, cleansing, and polishing, the nickel micro-pillar array was obtained, standing on the copper substrate. These unit cells and their alignments were measured through scanning electron microscopy and laser microscopy. Thermographic microscopy with FT-IR was utilized to measure the IR emittance as a function of wavelength. The focused areas were varied by controlling the aperture to analyze the effects of arrayed microtextures on the IR emittance. Full article
(This article belongs to the Special Issue Laser Micro/Nano Fabrication, Second Edition)
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13 pages, 2562 KB  
Article
Gill Transcriptome, Proteome, and Histology in Female Eriocheir sinensis Under Copper Stress
by Tingshuang Pan, Tong Li, Min Yang, Chengchen Yu, He Jiang and Jun Ling
Int. J. Mol. Sci. 2025, 26(10), 4711; https://doi.org/10.3390/ijms26104711 - 14 May 2025
Cited by 1 | Viewed by 890
Abstract
Cu is a chemical contaminant that is toxic to aquatic animals at certain concentrations. The present study describes the gill transcriptome, proteome, and histology of the Chinese mitten crab (Eriocheir sinensis) subjected to copper stress. Female 14-month-old E. sinensis (n = [...] Read more.
Cu is a chemical contaminant that is toxic to aquatic animals at certain concentrations. The present study describes the gill transcriptome, proteome, and histology of the Chinese mitten crab (Eriocheir sinensis) subjected to copper stress. Female 14-month-old E. sinensis (n = 60) crabs (79.6 ± 4.8 g, body weight) were randomly divided into two groups and subjected to copper stress at concentrations of 0 μg/L (Blank group, GBL) and 50 μg/L (Copper group, GCP) for 96 h. In total, 278 upregulated and 189 downregulated differentially expressed genes (DEGs) were identified in the GBL and GCP groups. In addition, upregulated and downregulated differentially expressed proteins (DEPs) in the GBL and GCP groups were 260 and 308, respectively. An integrated analysis demonstrated that the three DEGs overlapped between the two omics approaches. Comparative omics analysis indicated that seven GO terms were significantly (p < 0.05) enriched by overlapping DEGs in the transcriptome and proteome. Further analysis revealed that only one overlapping DEG (stumps) was enriched in two common KEGG pathways, the PI3K-Akt and B cell receptor signaling pathways. Histological analyses showed that copper-stressed gills had collapsed lamellae with enlarged marginal vessels and shortened interlamellar spaces due to the disruption of the pillar cells and cuticles. These results demonstrate the variations in copper-stressed gills and will be helpful for better understanding the mechanisms of copper toxicity in E. sinensis. Full article
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3 pages, 130 KB  
Editorial
Editorial for Special Issue “Advances in Flotation of Copper, Lead and Zinc Minerals”
by Qicheng Feng and Guang Han
Minerals 2025, 15(5), 498; https://doi.org/10.3390/min15050498 - 8 May 2025
Viewed by 819
Abstract
Copper, lead, and zinc metals are fundamental pillars of modern industry, yet their extraction faces increasing hurdles [...] Full article
(This article belongs to the Special Issue Advances in Flotation of Copper, Lead and Zinc Minerals)
21 pages, 33528 KB  
Article
Simulating the Failure Mechanism of High-Slope Angles Under Rainfall-Mining Coupling Using MatDEM
by Qihang Li, Yunmin Wang, Di Hou, Song Jiang, Bin Gong and Xiaoshuang Li
Water 2025, 17(3), 414; https://doi.org/10.3390/w17030414 - 2 Feb 2025
Cited by 6 | Viewed by 1752
Abstract
The safety production of gold, silver, copper, and other important metals is seriously threatened in the process of mining from open-pit to underground due to various factors such as infiltration caused by rainfall and unloading during mining. Furthermore, the current situation of open-pit [...] Read more.
The safety production of gold, silver, copper, and other important metals is seriously threatened in the process of mining from open-pit to underground due to various factors such as infiltration caused by rainfall and unloading during mining. Furthermore, the current situation of open-pit mining in an increasing number of mines presents a high and steep terrain, which poses significant security risks. Accordingly, it is of great practical significance to investigate the failure mechanism of high-slope angles to ensure the long-term safe mining of mines, considering factors such as rainfall infiltration and excavation unloading. In this study, the slope failure of high-slope angles (45°, 55°, and 65°) under rainfall-mining coupling was analyzed using the discrete element MatDEM numerical simulation software. Herein, the stress distribution, failure characteristics, and energy conversion of the model were simulated under different slope angles to analyze the failure mechanism at each stage. The simulation results show that the damage scale is smallest at 55° and largest at 65°. This indicates that setting the slope angle to 55° can reduce the risk of slope instability. Moreover, the reduction of elastic potential energy during the mine room mining stage is similar to that of mechanical energy. During the pillar mining stage, stress is concentrated in each goaf, resulting in a greater reduction in mechanical energy compared to elastic potential energy. Finally, after the completion of the continuous pillar mining stage, stress becomes concentrated in the failure area, and the effect of the slope angle on mechanical energy reduction becomes evident after the complete collapse of the model. Full article
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14 pages, 5008 KB  
Article
The Effect of BEOL Design Factors on the Thermal Reliability of Flip-Chip Chip-Scale Packaging
by Dejian Li, Bofu Li, Shunfeng Han, Dameng Li, Baobin Yang, Baoliang Gong, Zhangzhang Zhang, Chang Yu and Pei Chen
Micromachines 2025, 16(2), 121; https://doi.org/10.3390/mi16020121 - 22 Jan 2025
Cited by 3 | Viewed by 3333
Abstract
With the development of high-density integrated chips, low-k dielectric materials are used in the back end of line (BEOL) to reduce signal delay. However, due to the application of fine-pitch packages with high-hardness copper pillars, BEOL is susceptible to chip package interaction (CPI), [...] Read more.
With the development of high-density integrated chips, low-k dielectric materials are used in the back end of line (BEOL) to reduce signal delay. However, due to the application of fine-pitch packages with high-hardness copper pillars, BEOL is susceptible to chip package interaction (CPI), which leads to reliability issues such as the delamination of interlayer dielectric (ILD) layers. In order to improve package reliability, the effect of CPI at multi-scale needs to be explored in terms of package integration. In this paper, the stress of BEOL in the flip-chip chip-scale packaging (FCCSP) model during thermal cycling is investigated by using the finite-element-based sub-model approach. A three-dimensional (3D) multi-level finite element model is established based on the FCCSP. The wiring layers were treated by the equivalent homogenization method to ensure high prediction accuracy. The stress distribution of the BEOL around the critical bump was analyzed. The cracking risk of the interface layer of the BEOL was assessed by pre-cracking at a dangerous location. In addition, the effects of the epoxy molding compound (EMC) thickness, polyimide (PI) opening, and coefficient of thermal expansion (CTE) of the underfill on cracking were investigated. The simulation results show that the first principal stress of BEOL is higher at high-temperature moments than at low-temperature moments, and mainly concentrated near the PI opening. Compared with the oxide layer, the low-k layer has a higher risk of cracking. A smaller EMC thickness, lower CTE of the underfill, and larger PI opening help to reduce the risk of cracking in the BEOL. Full article
(This article belongs to the Special Issue 3D Integration: Trends, Challenges and Opportunities)
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23 pages, 14082 KB  
Article
Procedure Design and Reliability Analysis for Prediction of Surface Subsidence of a Metal Mine Induced by Block Caving Method—A Case Study of Pulang Copper Mine in China
by Weijia Ling, Zhonghua Zhu, Xinglong Feng, Liguan Wang, Weixiong Wang, Zhengrong Li and Jiadong Qiu
Minerals 2024, 14(10), 1011; https://doi.org/10.3390/min14101011 - 7 Oct 2024
Cited by 1 | Viewed by 2021
Abstract
Surface subsidence resulting from block caving mining causes considerable environmental and economic harm in mining areas, highlighting the critical need for accurate predictions of surface subsidence. Given the unique features of the block caving technique and the resemblance between the released ore pillars [...] Read more.
Surface subsidence resulting from block caving mining causes considerable environmental and economic harm in mining areas, highlighting the critical need for accurate predictions of surface subsidence. Given the unique features of the block caving technique and the resemblance between the released ore pillars and the mining processes, this paper developed a lightweight model to forecast surface settlement utilizing the probability integration approach to address the issue of predicting surface settlement in metallic mines. This study focuses on the Pulang Copper Mine, situated in the northeast of Shangri-La County within the Yunnan Province, as a case example. This mine employs the block caving method, which results in substantial surface subsidence. A visual mining simulation program is designed to combine the ore mining plan with the prediction model, manage the ore output of each mining point in batches, treat the ore pillars released in the planning cycle as strip work, and simulate and calculate the surface area above the ore pillars settlement value. The calculated values of surface subsidence induced by ore drawing are then interpreted as the downward displacement of the surface subsidence beneath the strip workings. Furthermore, to verify the reliability of the model, three-dimensional laser point cloud data of the Pulang Copper Mine in recent years were collected, and the differences between the predicted surface and the measured surface were calculated and analyzed. Full article
(This article belongs to the Special Issue Sustainable Mining: Advancements, Challenges and Future Directions)
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16 pages, 37562 KB  
Article
Reliability Simulation Analysis of TSV Structure in Silicon Interposer under Temperature Cycling
by Wenchao Tian, Haojie Dang, Dexin Li, Yunhao Cong and Yuanming Chen
Micromachines 2024, 15(8), 986; https://doi.org/10.3390/mi15080986 - 30 Jul 2024
Cited by 10 | Viewed by 5380
Abstract
As semiconductor integration scales expand and chip sizes shrink, Through Silicon Via (TSV) technology advances towards smaller diameters and higher aspect ratios, posing significant challenges in thermo-mechanical reliability, particularly within interposer substrates where mismatched coefficients of thermal expansion exacerbate issues. This study conducts [...] Read more.
As semiconductor integration scales expand and chip sizes shrink, Through Silicon Via (TSV) technology advances towards smaller diameters and higher aspect ratios, posing significant challenges in thermo-mechanical reliability, particularly within interposer substrates where mismatched coefficients of thermal expansion exacerbate issues. This study conducts a thermo-mechanical analysis of TSV structures within multi-layered complex interposers, and analyzes the thermal stress behavior and reliability under variable temperature conditions (−55 °C to 85 °C), taking into account the typical electroplating defects within the copper pillars in TSVs. Initially, an overall model is established to determine the critical TSV locations. Sub-model analysis is then employed to investigate the stress and deformation of the most critical TSV, enabling the calculation of the temperature cycle life accordingly. Results indicate that the most critical TSV resides centrally within the model, exhibiting the highest equivalent stress. During the temperature cycling process, the maximum deformation experiences approximately periodic variations, while the maximum equivalent stress undergoes continuous accumulation and gradually diminishes. Its peak occurs at the contact interface corner between the TSV and Redistribution Layer (RDL). The estimated life of the critical point is 3.1708 × 105 cycles. Furthermore, it is observed that electroplating defect b alleviates thermal stress within TSVs during temperature cycling. This study provides insights into TSV thermal behavior and reliability, which are crucial for optimizing the design and manufacturing processes of advanced semiconductor packaging. Full article
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17 pages, 11808 KB  
Article
Geomechanical Analysis of the Main Roof Deformation in Room-and-Pillar Ore Mining Systems in Relation to Real Induced Seismicity
by Dariusz Chlebowski and Zbigniew Burtan
Appl. Sci. 2024, 14(13), 5710; https://doi.org/10.3390/app14135710 - 29 Jun 2024
Cited by 2 | Viewed by 1555
Abstract
Rockbursts represent one of the most serious and severe natural hazards emerging in underground copper mines within the Legnica–Glogow Copper District (LGCD) in Poland. The contributing factor determining the scale of this event is mining-induced seismicity of the rock strata. Extensive expertise of [...] Read more.
Rockbursts represent one of the most serious and severe natural hazards emerging in underground copper mines within the Legnica–Glogow Copper District (LGCD) in Poland. The contributing factor determining the scale of this event is mining-induced seismicity of the rock strata. Extensive expertise of the copper mining practitioners clearly indicates that high-energy tremors are the consequence of tectonic disturbances or can be attributed to stress/strain behaviour within the burst-prone roof strata. Apparently, seismic activity is a triggering factor; hence, attempts are made by mine operators to mitigate and control that risk. Underlying the effective rockburst control strategy is a reliable seismicity forecast, taking into account the causes of the registered phenomena. The paper summarises the geomechanics analyses aimed to verify the actual seismic and rockburst hazard levels in one of the panels within the copper mine Rudna (LGCD). Two traverses were designated at the face range and comparative analyses were conducted to establish correlations between the locations of epicentres of registered tremors and anomaly zones obtained via analytical modelling of changes in stress/strain behaviours within the rock strata. The main objective of this study was to evaluate the likelihood of activating carbonate/anhydrite layers within the main roof over the excavation being mined, with an aim to verify the potential causes and conditions which might have triggered the registered high-energy events. Special attention is given to two seismic events giving rise to rockbursts in mine workings. Results seem to confirm the adequacy and effectiveness of solutions provided by mechanics of deformable bodies in the context of forecasting the scale and risk of dynamic phenomena and selecting the appropriate mitigation and control measures in copper mines employing the room-and-pillar mining system. Full article
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18 pages, 2696 KB  
Article
Stability Analysis of a Mine Wall Based on Different Roof-Contact Filling Rates
by Jiang Guo, Wenjun Yang, Yan Zhao and Wanzhong Zhang
Minerals 2024, 14(7), 673; https://doi.org/10.3390/min14070673 - 28 Jun 2024
Cited by 6 | Viewed by 1758
Abstract
This study takes the mine wall of the isolated mine pillar in the Dongguashan Copper Mine as the research object. Based on the mechanical model of the mine wall under the trapezoidal loading of the backfill, the expressions for calculating the safety factor [...] Read more.
This study takes the mine wall of the isolated mine pillar in the Dongguashan Copper Mine as the research object. Based on the mechanical model of the mine wall under the trapezoidal loading of the backfill, the expressions for calculating the safety factor of the mine wall were derived by considering the load-bearing conditions of the backfill–mine-wall system under different roof-contacted filling rates. On this basis, the variation law of the safety factor of the mine wall with the roof-contacted filling rate was obtained, and the calculation result was verified by a numerical simulation and a field test. The research shows that for the same mine wall width, when the roof-contacted filling rate exceeds 9.53%, the safety factor of the mine wall exhibits a “trapezoidal” variation pattern with the increase in the roof-contacted filling rate. Moreover, the comprehensive benefits of isolated pillar recovery are made more credible by maintaining a wall width of 3 m and a filler jointing rate between 30% and 74.49%. This study analyzes the effect of the roof-contacted filling rate on the stability of the mine wall, which can provide a theoretical basis for mining isolated pillars by the filler method in deep mines. Full article
(This article belongs to the Section Mineral Processing and Extractive Metallurgy)
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20 pages, 6868 KB  
Article
Aluminum Micropillar Surfaces with Hierarchical Micro- and Nanoscale Features for Enhancement of Boiling Heat Transfer Coefficient and Critical Heat Flux
by Armin Hadžić, Matic Može, Matevž Zupančič and Iztok Golobič
Nanomaterials 2024, 14(8), 667; https://doi.org/10.3390/nano14080667 - 11 Apr 2024
Cited by 13 | Viewed by 3287
Abstract
The rapid progress of electronic devices has necessitated efficient heat dissipation within boiling cooling systems, underscoring the need for improvements in boiling heat transfer coefficient (HTC) and critical heat flux (CHF). While different approaches for micropillar fabrication on copper or silicon substrates have [...] Read more.
The rapid progress of electronic devices has necessitated efficient heat dissipation within boiling cooling systems, underscoring the need for improvements in boiling heat transfer coefficient (HTC) and critical heat flux (CHF). While different approaches for micropillar fabrication on copper or silicon substrates have been developed and have shown significant boiling performance improvements, such enhancement approaches on aluminum surfaces are not broadly investigated, despite their industrial applicability. This study introduces a scalable approach to engineering hierarchical micro-nano structures on aluminum surfaces, aiming to simultaneously increase HTC and CHF. One set of samples was produced using a combination of nanosecond laser texturing and chemical etching in hydrochloric acid, while another set underwent an additional laser texturing step. Three distinct micropillar patterns were tested under saturated pool boiling conditions using water at atmospheric pressure. Our findings reveal that microcavities created atop pillars successfully facilitate nucleation and micropillars representing nucleation site areas on a microscale, leading to an enhanced HTC up to 242 kW m−2 K−1. At the same time, the combination of the surrounding hydrophilic porous area enables increased wicking and pillar patterning, defining the vapor–liquid pathways on a macroscale, which leads to an increase in CHF of up to 2609 kW m−2. Full article
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14 pages, 9822 KB  
Article
A High Copper Concentration Copper-Quadrol Complex Electroless Solution for Chip Bonding Applications
by Jeng-Hau Huang, Po-Shao Shih, Vengudusamy Renganathan, Simon Johannes Gräfner, Yu-Chun Lin, Chin-Li Kao, Yung-Sheng Lin, Yun-Ching Hung and Chengheng Robert Kao
Materials 2024, 17(7), 1638; https://doi.org/10.3390/ma17071638 - 3 Apr 2024
Cited by 1 | Viewed by 2556
Abstract
This article presents a novel bonding method for chip packaging applications in the semiconductor industry, with a focus on downsizing high-density and 3D-stacked interconnections to improve efficiency and performance. Microfluidic electroless interconnections have been identified as a potential solution for bonding pillar joints [...] Read more.
This article presents a novel bonding method for chip packaging applications in the semiconductor industry, with a focus on downsizing high-density and 3D-stacked interconnections to improve efficiency and performance. Microfluidic electroless interconnections have been identified as a potential solution for bonding pillar joints at low temperatures and pressures. However, the complex and time-consuming nature of their production process hinders their suitability for mass production. To overcome these challenges, we propose a tailored plating solution using an enhanced copper concentration and plating rate. By eliminating the need for fluid motion and reducing the process time, this method can be used for mass production. The Taguchi approach is first used to optimize the copper–quadrol complex solution with the plating rate and decomposition time. This solution exhibits a copper concentration that is over five times higher than that of conventional solutions, a plating rate of 22.2 μm/h, and a decomposition time of 8 min on a Cu layer substrate. This technique enables Cu pillars to be successfully bonded within 7 min at 35 °C. Planarizing the pillar surface yields a high bonding percentage of 99%. Mechanical shear testing shows a significant fracture strength of 76 MPa. Full article
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26 pages, 22627 KB  
Article
Rainfall–Mining Coupling Effects on Slope Failure Mechanism and Evolution Process: A Case Study of Open-Pit to Underground Mining
by Qihang Li, Yunmin Wang, Xiaoshuang Li and Bin Gong
Water 2024, 16(5), 740; https://doi.org/10.3390/w16050740 - 29 Feb 2024
Cited by 15 | Viewed by 3414
Abstract
This research examines how rainfall and mining affect the slope damage resulting from the transition from open-pit mining to underground mining. Using an unmanned aerial vehicle (UAV), the Huangniu slope of the Dexing Copper Mine was fully characterized, and experiments were conducted on [...] Read more.
This research examines how rainfall and mining affect the slope damage resulting from the transition from open-pit mining to underground mining. Using an unmanned aerial vehicle (UAV), the Huangniu slope of the Dexing Copper Mine was fully characterized, and experiments were conducted on rock samples from appropriate sites. First, the mechanical properties of the samples were measured. Then, the parameters of the similarity simulation experiments were derived based on the similarity theory. Subsequently, the rainfall, rock slope, data acquisition, and monitoring systems were designed. Finally, the rock mass failure with different slope angles was analyzed, and the deformation and damage patterns under the coupling effect were obtained. The results show that rainfall increases pore water pressure and moisture content. Rainfall and slope-slip water have more of an impact on the open-pit platform. The pore water pressure values on the upper rock mass rise faster than inside it. In the open-pit mining stage, the rock mass shifts slightly to the upper left. In the room mining stage, vertical fractures and goaf sinking occur. The fractures above the mine form a semi-ellipse. In the pillar mining stage, overlying rock displacement is evident and fractures persist. In the continuous pillar mining stage, the overlying rock collapses. The 65° slope model was the most damaged, while the 55° slope model was the least damaged. The results also suggest that the UAV guides sample selection. Full article
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19 pages, 4933 KB  
Article
Study of the Critical Safe Height of Goaf in Underground Metal Mines
by Qinli Zhang, Peng Zhang, Qiusong Chen, Hongpeng Li, Zian Song and Yunbo Tao
Minerals 2024, 14(3), 227; https://doi.org/10.3390/min14030227 - 23 Feb 2024
Cited by 6 | Viewed by 2187
Abstract
The empty-space subsequent filling mining method is the main mining scheme for underground metal mines to achieve large-scale mechanized mining. The stage height, one of the main parameters of this method, affects the various production process aspects of the mine and influences the [...] Read more.
The empty-space subsequent filling mining method is the main mining scheme for underground metal mines to achieve large-scale mechanized mining. The stage height, one of the main parameters of this method, affects the various production process aspects of the mine and influences the stability of the goaf. In order to determine the stage height scientifically and rationally in the empty-space subsequent filling mining method, a formula for the stabilized critical safe height of a high goaf in an underground metal mine was derived based on Pu’s arch equilibrium theory, Bieniawski’s pillar strength limit theory, and the Kastner equation and combined with the results of an orthogonal analysis to rank the importance of the main factors in the formula. A copper mine in Jiangxi Province was used as a case study, with the reliability of the formula verified by numerical simulation and industrial testing. The factors in the formula influencing the critical stabilized safe height of the goaf were, in descending order, the compressive strength of the rock body, the width of the two-step mining pillar, the width of the one-step mining room, the mining height, and the depth of mining. Based on the calculation results, the recommended stage heights are 30 m (−378 m middle section) and 25 m (−478 m middle section) in the area of poor rock body stability and 50 m in the area of better rock body stability. The simulation results show that the goaf is significantly affected by the compressive stress under the condition of a certain rock body stability and that the compressive stress increases with increasing goaf height. The minimum recommended values of the sidewall safety coefficients in areas of poor and better rock stability are 1.04 and 1.06, respectively. The volume deviation coefficients of the three industrial test mines were all controlled within 3%, indicating that no obvious collapse and destabilization phenomenon occurred in the goaf. This paper provides some theoretical and applied guidance for the stage height design of similar underground metal mines using the empty-space subsequent filling mining method. Full article
(This article belongs to the Topic Innovative Strategies to Mitigate the Impact of Mining)
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