Search Results (28)

The rapid growth in electronic waste (e-waste) generation highlights the urgent need for efficient and environmentally sustainable methods for metal recovery. This study focuses on the selective recovery of valuable metals from multilayer ceramic capacitors (MLCCs), commonly found in printed circuit boards (PCBs) of post-consumer electronics. MLCCs were manually recovered from dismantled computer PCBs, thermally treated, pulverized, and characterized using X-ray fluorescence and X-ray diffraction techniques. To evaluate green alternatives to traditional acid leaching, three deep eutectic solvents (DESs) based on choline chloride (ChCl) were prepared: citric acid (CA), glycerol (GLY), and a ternary (GLY-CA) mixture of both (GLY-CA). Leaching experiments were conducted over a 24 h period and analyzed using atomic absorption spectroscopy. The results showed complete recovery (100%) of copper using both CA and the GLY-CA mixture, while nickel recovery reached 100% with CA and moderate levels with GLY-CA. Zinc recovery was also high (99%) with both CA and GLY-CA. Iron showed a maximum recovery of 60%, potentially due to its occurrence in various chemical forms. The ternary DES (GLY-CA) demonstrated lower viscosity, improving handling and operational efficiency. These findings highlight the potential of citric-acid-based and ternary (GLY-CA) DESs as effective, low-toxicity leaching agents for the recovery of critical metals from MLCCs. Full article

Low-voltage power converters in the 25–200 V range are increasingly employed in emerging applications such as hybrid electric vehicles (HEVs), photovoltaic systems with battery storage, and electric propulsion systems for recreational boats. In these contexts, 48 V battery systems have become standard, due to safety considerations. Among various converter topologies, H-bridge configurations operating around 100 V DC are widely used in laboratory-scale prototyping. While MOSFETs are the preferred switching devices in this voltage range, due to their high efficiency and fast switching characteristics, they also introduce design challenges related to high current slew rates and associated overvoltage spikes caused by parasitic inductances in the PCB layout. These overvoltages, though modest in absolute terms, can be critical in low-voltage systems, due to the lower device ratings. This paper presents design strategies and layout best practice for a 120 V, 50 A H-bridge converter using 200 V rated MOSFETs. The effectiveness of various mitigation techniques—including the use of ceramic capacitors in parallel with film and electrolytic types, Schottky diodes across MOSFETs, and snubber circuits—is evaluated and experimentally validated on a dedicated prototype. The results highlight the critical role of PCB design in ensuring switching reliability and device protection in low-voltage converter systems. In addition, with the design solutions shown in this study, it was possible to obtain a voltage overshoot during switching of just 165 V with a 120 V DC-link voltage, which guarantees a sufficient safety margin for the MOSFET rated voltage. Full article

Electrostatic separation is a promising technology for the recovery of valuable metals from electronic waste, particularly from printed circuit boards (PCBs). This study explores the application of electrostatic separation for the selective recovery of metallic and non-metallic fractions from crushed PCBs (PCBs). The process exploits the differences in electrical properties between conductive metals and non-conductive polymers and ceramics, facilitating their separation through applied electric fields. The raw materials were pre-treated via mechanical comminution using shredders and hammer mills to achieve an optimal particle size distribution (<3 mm), which enhances separation efficiency. Ferrous materials were removed prior to electrostatic separation to improve process selectivity. Key operational parameters, including particle size, charge accumulation, environmental conditions, and separation efficiency, were systematically analysed. The results demonstrate that electrostatic separation effectively recovers high-value metals such as copper and gold while minimizing material losses. Additionally, the process contributes to the sustainability of e-waste recycling by enabling the recovery of non-metallic fractions for potential secondary applications. This work underscores the significance of electrostatic separation as a viable technique for e-waste management and highlights optimization strategies for enhancing its performance in large-scale recycling operations. Full article

Recent studies focus on recovering materials from Waste Electrical and Electronic Equipment (WEEE). Printed Circuit Boards (PCBs) are promising due to their heterogeneous composition, which includes precious metals, ceramics, and polymers. This research analyzes the leaching process of computer PCB waste to recover valuable metals such as copper and gold. The study involved physical-mechanical processing of PCB samples followed by chemical composition characterization. Metal extraction was performed through a three-stage leaching process. The first two stages used 2 M and 3 M sulfuric acid with hydrogen peroxide as leaching agents, achieving about 75% copper extraction. In the third stage, parameters for gold leaching using thiosulfate were evaluated, including concentrations of ammonium hydroxide and copper sulfate, reaction times (1–4 h), and temperatures (30, 40, and 50 ${\phantom{­}}^{\circ }$C). The leaching solution comprising 0.12 M sodium thiosulfate, 0.2 M ammonium hydroxide, and 20 mM copper sulfate yielded maximum gold extractions of 14.76% for fine and 15.73% for coarse fractions at 40 ${\phantom{­}}^{\circ }$C. In conclusion, the proposed method for recovering metals from PCBs can reduce the environmental impact of improper WEEE disposal while promoting a circular economy of secondary raw materials. Full article

Traditional Beidou Navigation Satellite System anti-jamming array antennas mostly use PCB plates, but in extreme vibration environments, their rigidity may cause the antenna structure to be more susceptible to damage. Especially in an extremely high-temperature environment, it may cause thermal expansion, softening, and even melting of metal materials, which will affect the structure and performance of the antenna; In this paper, a Beidou array antenna integrating high seismic resistance, high-temperature stability, and anti-interference ability is designed and studied. The structural parts of the antenna are composed of 7075 aluminum alloy and high-temperature ceramic material technology, which has a compact structure and strong corrosion resistance, which is especially suitable for aviation and marine environments. The antenna works stably at 400 °C and has excellent heat resistance. Built-in shock-absorbing elements or shock-absorbing materials are used to effectively absorb and disperse vibration energy and reduce the direct impact on the internal components of the antenna. Considering the anti-interference performance caused by the size of the array spacing and the mutual coupling between the array elements, the array spacing is designed to be between λ/4 and λ/2. In simulations and experiments, the designed antenna array shows good performance and proves its applicability for high-temperature applications. The antenna frequency includes the B3 band (1250.618~1286.423 MHz) and B1 band (1559.052~1591.788 MHz) of the Beidou Navigation Satellite System. The following article includes the introduction, proposed array antenna structure and dimension, antenna simulation results, antenna protype and environment test, conclusions and future work. Full article

A full characterization of multilayer ceramic capacitors including variations in capacitance, series resistance, and series inductance is accomplished by measuring their RF response while being submitted to mechanical stress. This allows for the first time quantifying the degradation of the device’s RF performance when cracks form within its structure. In this regard, the main challenge is designing an interface for measuring the high-frequency response of a capacitor using a vector network analyzer as a bending test on a PCB in progress, which is achieved here by using a microstrip-based test fixture. The results indicate that there is an overestimation of its response to microwave stimuli when considering only the degradation impact as a reduction in capacitance. Capacitors of representative sizes and capacitances are analyzed to show the usefulness of the proposal, whereas the validity of the results is verified by observing the correlation with measurements collected using microprobes and performing optical inspections of cross-sectioned samples. Full article

A rework of electronic assemblies and the reuse of electronic components are the most effective ways to reduce electronic waste. Since neither components nor substrates were developed with the intention of multiple usage, the question of how the integrity of lead-free solder joints is affected by multiple reflow operations is crucial for the implementation of any reuse strategy. Therefore, various types of 1206 multilayer ceramic capacitors (MLCCs) differing in their capacitance value and dielectric type (X5R, X7R, Y5V, NP0) were soldered on test printed circuit boards (PCBs) having a pure Cu-metallization surface in order to investigate the intermetallic reactions during multiple reflows. The metallization system on the MLCC-component side consisted of a thick film of Ni covered by galvanic-deposited Sn. The reflow experiments were conducted using a hypoeutectic SnAgCu solder. The results show the formation of a Cu₆Sn₅ intermetallic phase on both metallizations, which grows homogeneously with the number of reflows. Moreover, an ongoing decomposition of the solder into Ag-enriched and depleted zones was observed. The effect of these microstructural changes on the functionality of the solder joint was investigated by mechanical shear experiments and electrical four-point capacitance measurements. Full article

Low-frequency working standards of inductance are generally uniformly wound toroids on a ceramic core. Planar inductors made using printed circuit board (PCB) technology are simple and cheap to manufacture in comparison to inductors wound on toroid cores, but they are significantly prone to the influence of external magnetic fields. In this paper, we propose the design of a PCB inductance working standard of 10 μH, consisting of a duplex system of planar PCB coils, electrostatic shielding, and an enclosure. Alongside an electromagnetic analysis and design procedure, the measurements on the manufactured prototype included the generated magnetic field, the thermal time constant of the enclosure, temperature coefficients, and its error analysis. The measurements show negligible generated magnetic fields (<$1.68\mathrm{n}\mathrm{T}\mathrm{a}\mathrm{t}7\mathrm{c}\mathrm{m}$, 49 mA, 10 kHz). The minimum thermal time constant of the enclosure is 1270 s and the temperature coefficient of resistance is $0.003841/℃$. The presented method of temperature coefficient measurement using a climate chamber allows for measurements in the temperature range of 10 °C to 40 °C. In this temperature range, the results show an inductance variation of 0.05 µH at 50 kHz, while the uncertainty of inductance measurement at this frequency was 0.03 µH (k = 2). Full article

A large amount of multi-layer ceramic capacitor (MLCC) is mounted inside a printed circuit board (PCB) constituting electronic components. The use of MLCC in electric vehicles and the latest mobile phones is rapidly increasing with the latest technology. Environments in which electronic components are used are becoming more diverse and conformal coatings are being applied to protect mounted components from these environments. In particular, MLCCs in electronic components mainly have voltage applied. They might be used in environments where humidity exists for various reasons. In a humid environment, electrochemical migration (ECM) will occur, with the cathode and anode on the surface of the MLCC encountering each other. This can result in product damage due to a short circuit. In this study, the effects of voltage, NaCl concentration, and distance between electrodes on a non-mount MLCC, surface mount MLCC, and solder pad pattern were evaluated using a water drop test (WDT). Based on the analysis of the effects of the presence of conformal coating, applied voltage, concentration of NaCl, and the distance between electrodes, a mechanism model for ECM behavior in MLCCs was proposed. Full article

We review dielectric resonator antenna (DRA) designs. This review examines recent advancements across several categories, specifically focusing on their applicability in array configurations for millimeter-wave (mmW) bands, particularly in the context of 5G and beyond 5G applications. Notably, the off-chip DRA designs, including in-substrate and compact DRAs, have gained prominence in recent years. This surge in popularity can be attributed to the rapid development of cost-effective multilayer laminate manufacturing techniques, such as printed circuit boards (PCBs) and low-temperature co-fired ceramic (LTCC). Furthermore, there is a growing demand for DRAs with beam-steering, dual-band functions, and on-chip alignment availability, as they offer versatile alternatives to traditional lossy printed antennas. DRAs exhibit distinct advantages of lower conductive losses and greater flexibility in shapes and materials. We discuss and compare the performances of different DRA designs, considering their material usage, manufacturing feasibility, overall performance, and applications. By exploring the pros and cons of these diverse DRA designs, this review provides valuable insights for researchers in the field. Full article

This paper describes a fast and flexible microfabrication method for thermal conductivity gas sensors useful in high-temperature applications. The key parts of the sensor, the microheater and the package, were fabricated from glass-coated platinum wire and the combination of laser micromilling (ablation) of already-sintered monolithic ceramic materials and thick-film screen-printing technologies. The final thermal conductivity gas sensor was fabricated in the form of a complete MEMS device in a metal ceramic package, which could be used as a compact miniaturized surface-mounted device for soldering to standard PCB. Functional test results of the manufactured sensor are presented, demonstrating their full suitability for gas sensing applications and indicating that the obtained parameters are at a level comparable to those of standard industrially produced sensors. The results of the design and optimization principles of applied methods are discussed with regard to possible wider applications in thermal gas sensor prototyping in the future. The advantage of the developed sensors is their ability to operate in air environments under high temperatures of 900 °C and above. The sensor element material and package metallization were insensitive to oxidation compared with classical sensor-solution-based metal–glass packages and silicone MEMS membranes, which exhibit mechanical stress at temperatures above 700 °C. Full article

This article presents a numerical and experimental investigation of a novel rod-shaped linear piezoelectric actuator that consists of a square cross-section-shaped rod with eight piezo ceramic plates and a cylindrical guidance rail. The rod has a hollow cut made with an offset from the longitudinal axis of the symmetry. A cylindrical guidance rail is placed on one side of the rod, while T-shaped clamping is formed on the opposite side. The slider is mounted on the rail and is moved along it. The actuator is compact, making it possible to mount it directly on a printed circuit board (PCB) or in another device with limited mounting space, restricted mass, or actuator footprint. The operation of the actuator is based on the excitation of the first longitudinal vibration mode of the rod that induces in-plane bending vibration of the nodal zone of the rod due to a hollowed cut asymmetrically placed in the central part of the actuator. The actuator is driven by two sawtooth waveform electric signals with the phase difference of π that allows exciting longitudinal deformations of the rod and controls the reverse motion of the slider. The results of numerical investigations confirmed the operation principle of the actuator at the frequency of 59.72 kHz. The maximum displacement amplitude of the guidance rail in the longitudinal direction reaches up to 152.9 μm while the voltage of 200 V_p-p was applied. An experimental investigation of the actuator was made, and a maximum linear speed of 45.6 mm/s and thrust force of 115.4 mN was achieved. Full article

The exponential growth in the consumption of electronics, in combination with the reduction in their useful life, has led to a significant increase in the volume of electronic materials which are discarded. Printed Circuit Boards (PCBs) are modules composed of ceramic, polymer, and metallic materials of high economic value and with a great potential for damage to biotic and anthropic environments when inadequately discarded. The aims of this work were to study the main environmental impacts and the efficiency of mechanical operations in the electronic waste recycling process in optimizing the concentration of metallic copper. For this, the samples obtained were characterized according to their morphology and chemical composition, and subjected to physical and mechanical treatments: dismantling, grinding, separation by granulometry, density, and magnetic property. The environment impacts were estimated by the Life Cycle Assessment of the pre-treatment processes, associated with copper extraction operations in Waste Printed Circuit Boards (WPCBs). According to the results obtained, it is possible to infer that the NM + 1 mm Concentrated product presents in its metallic composition around 78% copper, which contributes to the efficiency of the hydrometallurgical extraction processes. It is noteworthy that the Concentrated class represents about 14% of copper (wt) taking into account the amount of 3.789 kg of PCB waste input material. The potential for reinsertion of the dust in the material recovery process is highlighted, given that the chemical composition of this particulate has a significant presence of metals. In general, it was found that due to the higher concentration (wt%) of the sample being allocated in the range of −0.15 mm + 0.05 mm, the elements Fe (18.30%), Si (10.73%), Ca (9.21%), and Cu (8.89%) stand out regarding the participation of the elemental composition of this fraction and also regarding the general composition of the sample. Furthermore, the generation of dust during the fragmentation process can be associated with occupational respiratory diseases when not managed. About the Life Cycle Assessment, in seven of the nine categories evaluated, crushing and screening activities accounted for more than 90% of the recorded impact values. In general, it is estimated that in the pre-treatment phase it generated 15.4 kg CO₂ eq. Full article

The technological development propitiates the rapid replacement of electrical and electronic equipment, which makes it indispensable to develop recycling processes for the treatment of this equipment when discarded. Printed circuit boards (PCBs) are fundamental components of electrical and electronic equipment. PCBs are composed of ceramics, polymers, and metals. Copper is the metal that is present in the greatest percentage of mobile phone PCBs. The objective of this study was to recover copper in the form of metallic deposits from a copper solution extracted from comminuted PCBs through supercritical CO₂ in the presence of cosolvents (H₂O₂ and H₂SO₄). A synthetic CuSO₄ solution was employed to determine the ideal current density in the range of 250 to 540 A/m². The electrowinning of the leachate solution from PCBs was performed at the determined current density. Using the current density of 250 A/m², pH equal to 4, and temperature of 25 °C, a current efficiency of around 100% was achieved for the real solution. The deposit obtained showed a copper concentration of 95.97 wt%, recovering 40% of the copper contained in the solution in 300 min of electrowinning. It was observed that for a longer electrowinning time, the percentage of copper recovery could increase. Full article

We examined the feasibility of alumina substrate metallization by magnetron deposition of copper coatings with thickness of several tens µm for its prospective applications in production of ceramic PCBs and packaging. The films were prepared in magnetron sputtering systems with cooled and thermally insulated (hot) targets. Substrates with different geometries were used, including those with through-holes. Thickness, adhesive properties, and electrical resistivity of produced coatings were analyzed. If the film thickness exceeded ~20 µm, we observed its systematic delamination, unless the dedicated Cu_xO_y sub-layer of was introduced between the substrate and the main Cu film. Intermediate copper oxide films were investigated separately by SEM, EDS, and XRD methods, and deposition conditions for predominant growth of favorable tenorite CuO were determined. Prepared composite two-layer CuO + Cu coatings with total thickness of ~100 µm demonstrated good adhesion to alumina substrates in scratch-testing and performed much better than Cu-only films both in soldering and thermal cycling tests. We discuss an approach for constructing a reliable metallizing coating by plasma-assisted PVD methods that could be beneficial for complex-shaped ceramic PCBs and packaging. Full article