Search Results (93)

This paper presents a novel harmonic-selective clocking scheme that facilitates concurrent downconversion of spectrally distant radio frequency (RF) signals using a single low-frequency local oscillator (LO) in an N-path receiver architecture. The proposed scheme selectively generates LO harmonics aligned with multiple RF bands, enabling simultaneous downconversion without modification of the passive mixer topology. The receiver employs a 4-path passive mixer configuration to enhance harmonic selectivity and provide flexible frequency planning.The architecture is implemented on a printed circuit board (PCB) and validated through comprehensive simulation and experimental measurements under continuous wave and modulated signal conditions. Measured results demonstrate a sensitivity of $-55\mathrm{dBm}$ and a conversion gain varying from $-2.5\mathrm{dB}$ to $-9\mathrm{dB}$ depending on the selected harmonic pair. The receiver’s performance is further corroborated by concurrent (dual band) reception of real-world signals, including a GPS signal centered at 1575 MHz and an LTE signal at 1179 MHz, both downconverted using a single 393 MHz LO. Signal fidelity is assessed via Normalized Mean Square Error (NMSE) and Error Vector Magnitude (EVM), confirming the proposed architecture’s effectiveness in maintaining high-quality signal reception under concurrent multiband operation. The results highlight the potential of harmonic-selective clocking to simplify multiband receiver design for wireless communication and global navigation satellite system (GNSS) applications. Full article

In the Internet of Things (IoT) era, the demand for cost-effective, flexible, wearable antennas and circuits has been growing. Accordingly, screen-printing techniques are becoming more popular due to their lower costs and high-volume manufacturing. This paper presents and investigates a full-screen-printed 1 × 4 Quasi-Yagi-Uda antenna array on a high-transparency flexible Zeonor thin-film substrate for emerging 26 GHz band (24.25–27.55 GHz) 5G applications. As part of this study, screen-printing implementation rules are developed by properly managing ink layer thickness on a transparent flexible Zeonor thin-film dielectric to achieve a decent antenna array performance. In addition, a screen-printing repeatability study has been carried out through a performance comparison of 24 antenna array samples manufactured by our research partner from CEA-Liten Grenoble. Despite the challenging antenna array screen printing at higher frequencies, the measured results show a good antenna performance as anticipated from the traditional subtractive printed circuit board (PCB) manufacturing process using standard substrates. It shows a wide-band matched input impedance from 22–28 GHz (i.e., 23% of relative band-width) and a maximum realized gain of 12.8 dB at 27 GHz. Full article

Structural Health Monitoring (SHM) is an essential technique for continuously assessing structural conditions using integrated sensor systems during operation. SHM technologies have evolved to address the increasing demand for efficient maintenance strategies in advanced engineering fields, such as civil infrastructure, aerospace, and transportation. However, developing a miniaturized, cost-effective, and multi-sensor solution based on Wireless Sensor Networks (WSNs) remains a significant challenge, particularly for SHM applications in weight-sensitive aerospace structures. To address this, the present study introduces a novel WSN-based Multi-Sensor System (MSS) that integrates multiple sensing capabilities onto a 3 × 3 cm flexible Printed Circuit Board (PCB). The proposed system combines a Piezoelectric Transducer (PZT) for impact detection; a strain gauge for mechanical deformation monitoring; an accelerometer for capturing dynamic responses; and an environmental sensor measuring temperature, pressure, and humidity. This high level of functional integration, combined with real-time Data Acquisition (DAQ) and precise time synchronization via Bluetooth Low Energy (LE), distinguishes the proposed MSS from conventional SHM systems, which are typically constrained by bulky hardware, single sensing modalities, or dependence on wired communication. Experimental evaluations on composite panels and aluminum specimens demonstrate reliable high-fidelity recording of PZT signals, strain variations, and acceleration responses, matching the performance of commercial instruments. The proposed system offers a low-power, lightweight, and scalable platform, demonstrating strong potential for on-board SHM in aircraft applications. Full article

To address the inherent contradiction between low-profile design and high gain in traditional omnidirectional antennas, as well as the narrow bandwidth constraints of ENZ antennas, this study presents a dual-mode ENZ-FP collaborative resonant antenna array design utilizing a substrate-integrated waveguide (SIW). Through systematic analysis of ENZ media’s quasi-static field distribution, we innovatively integrated it with Fabry–Perot (F–P) resonance, achieving unprecedented dual-band omnidirectional radiation at 5.18 GHz and 5.72 GHz within a single ENZ antenna configuration for the first time. The directivity of both frequencies reached 12.0 dBi, with a remarkably low profile of only 0.018λ. We then extended this design to an ENZ-FP dual-mode beam-scanning array. By incorporating phase control technology, we achieved wide-angle scanning despite low-profile constraints. The measured 3 dB beam coverage angles at the dual frequencies were ±63° and ±65°, respectively. Moreover, by loading the impedance matching network, the −10 dB impedance bandwidth of the antenna array was further extended to 2.4% and 2.7%, respectively, thus overcoming the narrowband limitations of the ENZ antenna and enhancing practical applicability. The antennas were manufactured using PCB (Printed Circuit Board) technology, offering high integration and cost efficiency. This provides a new paradigm for UAV (Unmanned Aerial Vehicle) communication and radar detection systems featuring multi-band operation, a low-profile design, and flexible beam control capabilities. Full article

This study presents a novel approach to manufacture a rigid printed circuit board (PCB) using sustainable polymers. Current PCBs use a fossil-fuel-based substrate, like FR4. This presents recycling challenges due to its composite nature. Replacing the substrate with an environmentally friendly alternative leads to a reduction in negative impacts. Polylactic acid (PLA) and Polyhydroxybutyrate (PHB) biopolymers are used in this study. These two biopolymers have low melting points (130–180 °C, and 170–180 °C, respectively) and cannot withstand the high temperature soldering process (up to 260 °C for standard SAC (SnAgCu, tin/silver/copper) lead free solder processes). Our approach for replacing the PCB substrate is applying the PLA/PHB carrier substrate at the end of the PCB manufacturing process using injection molding technology. This approach involves all the standard PCB processes, including wet etching of the Cu conductors, and component assembly with SAC solder on a thin flexible polyimide (PI) foil with patterned Cu conductors and then overmolding the biopolymer onto the foil to create a rigid base. This study demonstrates the functionality of two test circuits fabricated using this method. In addition, we evaluated the adhesion between the biopolymer and PI to achieve a durable PCB. Moreover, we performed two different end-of-life approaches (debonding and composting) as a part of the end-of-life consideration. By incorporating biodegradable materials into PCB standard manufacturing, the CO₂ emissions and energy consumption are significantly reduced, and installation costs are lowered. Full article

Tactile sensation across the whole hand, including the fingers and palm, is essential for manipulation and, therefore, is expected to be similarly useful for enabling dexterous robot manipulation. Tactile sensation would ideally be distributed (over large surface areas), have a high precision, and provide measurements in multiple axes, allowing for effective manipulation and interaction with objects of varying shapes, textures, friction, and compliance. Given the complex geometries and articulation of state-of-the-art robotic grippers and hands, they would benefit greatly from their surface being instrumented with a thin, curved, and/or flexible tactile sensor technology. However, the majority of current sensor technologies measure tactile information across a planar sensing surface or instrument-curved skin using relatively bulky camera-based approaches; proportionally in the literature, thin and flexible tactile sensor arrays are an under-explored topic. This paper, presents a thin, flexible, non-camera-based optical tactile sensor design as an investigation into the feasibility of adapting our novel LiVec sensing principle to curved and flexible surfaces. To implement the flexible sensor, flexible PCB technology is utilized in combination with other soft components. This proof-of-concept design eliminates rigid circuit boards, creating a sensor capable of providing localized 3D force and 3D displacement measurements across an array of sensing units in a small-thickness, non-camera-based optical tactile sensor skin covering a curved surface. The sensor consists of 16 sensing units arranged in a uniform 4 × 4 grid with an overall size of 30 mm × 30 mm × 7.2 mm in length, width, and depth, respectively. The sensor successfully estimated local XYZ forces and displacements in a curved configuration across all sixteen sensing units, the average force bias values ($\overline{\mu }$) were −1.04 mN, −0.32 mN, and −1.31 mN, and the average precision ($\overline{SD}$) was 54.49 mN, 55.16 mN and 97.15 mN, for the X, Y, Z axes, respectively, the average displacement bias values ($\overline{\mu }$) were 1.58 μm, 0.29 μm, and −1.99 μm, and the average precision values ($\overline{SD}$) were 221.61 μm, 247.74 μm, and 44.93 μm for the X, Y, and Z axes, respectively. This work provides crucial insights into the design and calibration of future curved LiVec sensors for robotic fingers and palms, making it highly suitable for enhancing dexterous robotic manipulation in complex, real-world environments. Full article

Near-field microwave microscopy (NSMM) is a promising technique for the non-destructive, high-resolution imaging of electrical and dielectric properties at the microscale. However, its performance is highly sensitive to the probe-to-sample distance, often requiring extremely close proximity, which limits its practical application in device manufacturing, especially in scenarios involving coatings and packaging. In this study, we propose a distance inversion method based on a dual-port symmetrical microwave probe to improve imaging performance at larger, safer scanning distances. This method utilizes the correlation between probe height and resonant frequency to compensate for distance-induced signal distortions. The experimental results demonstrate that even at a probe–sample distance of 80 µm, clear and distinguishable NSMM images of printed circuit boards (PCBs) can be obtained. The imaging resolution reached 13 µm. The defect structure with dimensions of 130 × 130 µm² on the PCB was successfully identified. The signal-to-noise ratio was significantly enhanced after applying the correction method. This approach not only improves the robustness and flexibility of NSMM in industrial scenarios but also extends its applicability to packaged or coated electronic devices, offering a valuable tool for advanced non-destructive testing. Full article

This paper presents a flexible and broadband metamaterial absorber (MA) with a sandwich structure for W-band absorption. The MA uses a thin FR4 material as the dielectric layer and incorporates multiple patches of varying sizes as the top pattern layer. By optimizing the dimensions and arrangement of the metal patches, an average absorption rate exceeding 94% is achieved across the 75–110 GHz frequency range, effectively covering the entire W-band. The MA, with a thickness of only 0.22 mm and a weight less than 600 g/m², is polarization-insensitive and maintains high absorption for TM waves within an incident angle of 45°. The structure is simple, low-cost, and compatible with PCB fabrication processes. The experimental results align well with the simulations and demonstrate effective absorbing performance in conformal applications, offering a new solution for flexible millimeter-wave absorption. Full article

This paper presents PCB design solutions for implementing a radiative-field RF energy harvester with an ASK-PWM decoding communication scheme using available commercial components. The paper provides the design approach and tackles key challenges such as the impact of inductive parasitic effects at the output of the harvester, how to maintain the $PCE$ at a constant value regardless of the time constant at the output of the communication path’s rectifier, and the difficulty of changing the aspect ratio of the discrete inverter used for PWM decoding. These challenges are addressed by using multiple capacitors connected in parallel at the output of the rectifier to reduce inductive parasitic effects, adding a series resistor in the communication path’s rectifier to isolate its loading from impacting the $PCE$, and utilizing a potentiometer in the inverter to realize PWM decoding on PCB. The system was manufactured using FR-4 substrate material with a size of 5 cm × 4 cm × 0.6 cm, harvesting energy at the ISM frequency of 924 MHz with a $PCE$ of $42.12\%$ at a bit rate of 15 Kbps. Moreover, the system consumes only 355 μW of power and maintains correct harvesting and decoding operation in the antenna separation range of 6–12 cm. This work aims to provide an alternative to IC realization by implementing the system entirely using commercial discrete components, reducing costs, adding flexibility, reducing development time, and allowing for simple debugging. Full article

A 2048-element dual-polarized receive (RX) phased array for $Ku$-band (10.7–12.7 GHz) satellite communication (SATCOM) is presented in this paper. The design of the multilayer printed circuit board (PCB) it uses adopts a novel copper paste sintering interconnection technology that allows for more flexibility in the design of vias and can reduce the PCB’s lamination number. This technology is more suitable for manufacturing multilayer and complex PCBs than traditional processes. The array is designed to consist of sixteen 8 × 16 element subarrays, each based on the silicon RX beamformer and multilayer PCB. Dual-polarized antenna elements are arranged in a regular rectangle with a spacing of 0.5 for a wavelength of 12.7 GHz, thus achieving a scanning range of ±70° in all planes. By adjusting the amplitude and phase of two line polarizations with cross-polarization levels better than −25 dB at boresight, the array can generate linear or circular polarization. Moreover, the antenna gain-to-noise temperature is above 12 dB/K ($T_{\mathrm{ant}}$ = 20 K) at boresight. The aperture of the 2048-element RX phased array is 768 × 450 mm. With its low profile, the array is appropriate for usage in $Ku$-band SATCOM terminals. Full article

The purpose of the experiment was to indicate which element of the production process of flexible printed circuit boards is optimal in terms of the reliability of final products. According to the Taguchi method, in the experiment, five factors with two levels each were chosen for the subsequent analysis. These included the number of conductive layers, the thickness of the laminate layer, the type of the laminate, the diameter of the plated holes, and the current density in the galvanic bath. The reliability of the PCBs in the produced variations was verified using the Interconnect Stress Test environmental test. The qualitatively best variant of the board construction was indicated using the signal-to-noise ratio and the analysis of variance method for each factor. The factors determined to be the most important in terms of reliability were the number of conductive layers and the current density in the galvanic bath. The optimal variant of the board construction was two conductive layers on a polyimide laminate, where the laminate layer was 100 μm thick, the hole diameter was equal to 0.4 mm, and current density was 2 A/dm² in the galvanic bath. Therefore, the plated experiment indicated the factors needed to obtain a high-quality product with a low failure rate. Full article

This work presents the design, fabrication, and rigorous validation of a flexible, wireless, capacitive pressure sensor for the full-range continuous monitoring of ventricular pressure. The proposed system consists of an implantable set and an external readout device; both modules were designed to form an RCL resonant circuit for passive, wireless pressure sensing and signal retrieving. Using surface micromachining and flexible electronics techniques, a two-variable capacitor array and a dual-layer planar coil were integrated into a flexible ergonomic substrate, avoiding hybrid-like connections in the implantable set. The proposed arrangement (capacitor array and dual-layer coil) allows us to optimize the operation pressure range and sensing distance. The use of polyimide as both the flexible substrate and the passivation material is a key feature, ensuring a biocompatible, implantable set that is mechanically flexible and can be folded to a compact size to achieve minimally invasive implantation. An external readout device has also been developed using a discrete printed circuit board (PCB) approach to support pressure measurements. The pressure responsivity of the sensor was validated to the laboratory level using a controlled pressure chamber. The results obtained show that the capacitance value of the sensor changed from 5.68 pF to 33.26 pF as the pressure varied from 0 to 300 mmHg. Correspondingly, the resonance frequency of the implantable set shifted from 12.75 MHz to 5.27 MHz. The sensitivity of the capacitive sensor was approximately 0.58 pF/mmHg and the typical response time was 220 ms. The wireless system performance was evaluated in both air and synthetic biological tissue using a Maxwell–Wien bridge circuit. The results showed a sensing distance longer than 3.5 cm, even under moderate misalignment conditions (up to 1.5 cm). The output voltage was successfully measured, ranging from 502.54 mV to 538.29 mV, throughout the full pressure range, with a measurement error of ±2.2 mV. Full article

Cardiac mapping is a crucial procedure for diagnosing and treating cardiac arrhythmias. Still, current clinical techniques face limitations including insufficient electrode coverage, poor conformability to complex heart chamber geometries, and high costs. This study explores the design, testing, and validation of a 64-electrode soft robotic catheter that addresses these challenges in cardiac mapping. A dual-layer flexible printed circuit board (PCB) was designed and integrated with sensors into a soft robotic sensor array (SRSA) assembly. Design considerations included flex PCB layout, routing, integration, conformity to heart chambers, sensor placement, and catheter durability. Rigorous SRSA in vitro testing evaluated the burst/leakage pressure, block force for electrode contact, mechanical integrity, and environmental resilience. For in vivo validation, a porcine model was used to demonstrate the successful deployment, conformability, and acquisition of electrograms in both the ventricles and atria. This catheter-deployable SRSA represents a meaningful step towards translating the integration of soft robotic actuators and stretchable electronics for clinical use, showcasing the unique mechanical and electrical performance that these designs enable. The high-density electrode array enabled rapid 2 s data acquisition with detailed spatial and temporal resolution, as illustrated by the clear and consistent cardiac signals recorded across all electrodes. The future of this work will lie in enabling high-density, anatomically conformable devices for detailed cardiac mapping to guide ablation therapy and other interventions. Full article

Smart clothes equipped with flexible sensing systems provide a comfortable means to track health status in real time. Although these sensors are flexible and small, the core signal-processing units still rely on a conventional printed circuit board (PCB), making current health-monitoring devices bulky and inconvenient to wear. In this study, a printed fabric-based hybrid circuit was designed and prepared—with a series of characteristics, such as surface/sectional morphology, electrical properties, and stability—to study its reliability. Furthermore, to verify the function of the fabric-based circuit, simulations and measurements of the circuit, as well as the collection and processing of a normal adult’s electrophysiological signals, were conducted. Under 10,000 stretching and bending cycles with a certain elongation and bending angle, the resistance remained 0.27 Ω/cm and 0.64 Ω/cm, respectively, demonstrating excellent conductivity and reliability. Additionally, the results of the simulation and experiment showed that the circuit can successfully amplify weak electrocardiogram (ECG) signals with a magnification of 1600 times with environmental filtering and 50 Hz of industrial frequency interference. This technology can monitor human electrophysiological signals, such as ECGs, electromyograms (EMGs), and joint motion, providing valuable practical guidance for the unobtrusive monitoring of smart clothes. Full article

The formation of conductive copper patterns on mica holds promise for developing cost-effective flexible electronics and sensing devices, though it is challenging due to the low adhesion of mica’s atomically flat surface. Herein, we present a wet-chemical method for copper patterning on flexible mica substrates via electroless copper deposition (Cu-ELD). The process involves pre-functionalizing 50 µm thick muscovite mica with a titanium dioxide (TiO₂) layer, via a sol–gel dip-coating method with a titanium acetylacetonate-based sol. Photolithography is employed to selectively activate the TiO₂-coated mica substrates for Cu-ELD, utilizing in situ photodeposited silver (Ag) nanoclusters as a catalyst. Copper is subsequently plated using a formaldehyde-based Cu-ELD bath, with the duration of deposition primarily determining the thickness and electrical properties of the copper layer. Conductive Cu layers with thicknesses in the 70–130 nm range were formed within 1–2 min of deposition, exhibiting an inverse relationship between plating time and sheet resistance, which ranged from 600 to 300 mΩ/sq. The electrochemical thickening of these layers to 1 μm further reduced the sheet resistance to 27 mΩ/sq. Finally, the potential of Cu-ELD patterning on TiO₂-functionalized mica for creating functional sensing devices was demonstrated by fabricating a functional resistance temperature detector (RTD) on the titania surface. Full article