Search Results (61)

Molten salt electrodeposition is a promising technique to prepare high-performance tungsten coatings for fusion reactor first-wall components. However, the ultra-high temperature during deposition causes severe grain coarsening and precipitate dissolution in CuCrZr alloy substrates, resulting in dramatic mechanical property degradation. In this study, a thermal cycle at 1223.15 K for 100 h was employed to simulate the thermal impact of molten salt tungsten electrodeposition (MSE) on CuCrZr alloys, and an aging treatment (703.15 K for 12 h) was adopted to restore the degraded mechanical properties. After aging, the tensile strength and yield strength recovered to 378.35 ± 7.40 MPa and 261.02 ± 3.40 MPa, meeting the minimum tensile property requirements of ITER for CuCrZr alloys. The recovery is attributed to nano-sized Cr-rich phase precipitation and high-density dislocations, providing effective Orowan precipitation strengthening. This work provides the first simple, engineering-friendly post-treatment to repair performance degradation of CuCrZr under the extreme thermal exposure of molten salt electrodeposition, which is critical for large-scale fabrication of high-performance plasma-facing components (PFCs) for fusion reactors. Full article

Nano-titanium dioxide ceramic coatings exhibit excellent wear resistance, corrosion resistance, and self-cleaning properties, showing great potential as multifunctional protective materials. This study proposes a synergistic reinforcement strategy by encapsulating micron-sized Al₂O₃ particles with nano-TiO₂. A core-shell structured nanocomposite coating composed of 65 wt% nano-TiO₂ encapsulating 30 wt% micron-Al₂O₃ was precisely designed and fabricated via a slurry dip-coating method on Q235 steel substrates. The microstructure and surface morphology of the coatings were characterized using scanning electron microscopy (SEM) and X-ray diffraction (XRD). Comprehensive performance evaluations including densification, adhesion strength, wear resistance, and thermal shock resistance were conducted. Optimal coating properties were achieved under the conditions of a binder-to-solvent ratio of 1:15 (g/mL), a heating rate of 2 °C/min, and a sintering temperature of 400 °C. XRD analysis confirmed the formation of multiple crystalline phases during the 400 °C curing process, including titanium pyrophosphate (TiP₂O₇), aluminum phosphate (AlPO₄), copper aluminate (Cu(AlO₂)₂), and a unique titanium phosphate phase (Ti₃(PO₄)₄) exclusive to the 2 °C/min heating rate. Adhesion strength tests revealed that the coating sintered at 2 °C/min exhibited superior interfacial bonding strength and outstanding performance in wear resistance, hardness, and thermal shock resistance. The incorporation of nano-TiO₂ into the 30 wt% Al₂O₃ matrix significantly enhanced the mechanical properties of the composite coating. Mechanistic studies indicated that the bonding between the nanocomposite coating and the metal substrate is primarily achieved through mechanical interlocking, forming a robust physical interface. These findings provide theoretical guidance for optimizing the fabrication process of metal-based ceramic coatings and expanding their engineering applications in various industries. Full article

Intermetallic compounds (IMCs) growth can simultaneously bring about low-resistance electrical pathways and drastically reduce joint lifetime. Recently, incorporated trace nanoparticles into the free-Pb solder were found to promote the performance of the solder joints. Sn3Ag0.9Zn (SAZ) nano-composite solders were developed by doping 0.5 wt.% Al₂O₃ nanoparticles into the SAZ solder. The IMCs formation and growth behavior at the interfacial reactions between the SAZ-0.5Al₂O₃ nano-composite solder and the Cu substrate during soldering at temperatures ranging from 250 to 325 °C for 30 min were investigated. The results showed that after the addition of Al₂O₃ nanoparticles into the SAZ solder, the elongated-type IMCs layer changed into a prism-type IMCs layer, and Ag₃Sn nanoparticles were absorbed on the grain surface of the interfacial Cu₆Sn₅ phase, effectively suppressing the growth of the IMCs layers. The activation energies (Q) for the IMCs layers (Cu₆Sn₅ + Cu₃Sn) were determined to be 36.4 and 39.1 kJ/mol for the SAZ/Cu and SAZ-Al₂O₃/Cu solders, respectively. Full article

Research on how to efficiently utilize solar energy can effectively address the current situation where excessive carbon emissions threaten the natural environment. The solar capture device, as the core component of the solar thermal photovoltaic system, can significantly enhance the absorption properties of the solar thermal photovoltaic system, which is of high research value in the solar energy application area. In this paper, a metamaterial broadband solar capture device based on the top microstructure of semiconductor InAs material is proposed. The model is fabricated from top to bottom with the semiconductor InAs material at the top with Ti material to make hollow cylindrical microstructures, and a combination of SiO₂ material film, Ti material film, and Cu material film as the substrate. In addition to incorporating the properties of metamaterials, the model is also inspired by the quantum-limited domain effect of nano-semiconductors by using the incorporation of InAs top microstructures at the top to further improve the model’s absorption properties. The model was calculated to have an average absorption in the 280–2500 nm waveband of 96.15% and a weighted average absorption in the 280–4000 nm waveband of 97.71% at AM1.5. Results of calculating the model’s reflectivity in the 280–20,000 nm bands show that the reflectivity of the model is higher than 80% in all the bands after the wavelength of 7940 nm, so the model has a certain spectral selectivity. In addition, the thermal radiation efficiency of the model in the 280–2500 nm waveband, when it is used as a thermal emitter, is calculated to reach 94.40% in this paper. Meanwhile, the capture device has good angular insensitivity, which has high potential for practical applications. Full article

Surface-enhanced Raman scattering (SERS) spectroscopy is a powerful technology in trace analysis. However, the wide applications of SERS in practice are limited by the expensive substrate materials and the complicated preparation processes. Here we report a simple and economical galvanic-replacement-assisted synthesis route to prepare Ag nanoparticles on Cu(0) foil (nanoAg@Cu), which can be directly used as SERS substrate. The fabrication process is fast (ca. 10 min) and easily scaled up to centimeters or even larger. In addition, the morphology of the nanoAg@Cu (with Ag particles size from 30 nm to 160 nm) can be adjusted by various additives (e.g., amino-containing ligands). Finally, we show that the as-prepared nanoAg@Cu can be used for SERS characterization of two-dimensional polymers, and ca. 298 times relative enhancement of Raman intensity is achieved. This work offers a simple and economical strategy for the scalable fabrication of silver-based SERS substrate in thin film analysis. Full article

This study focuses on the analyses of nano-twinned copper (Cu) films deposited through magnetron sputtering on silicon carbide (SiC) chips. The investigation encompasses the utilization of a chromium (Cr) adhesive layer coupled with varying voltage bias conditions. The goal is to comprehensively examine the influence of the adhesive layer and negative bias voltages, contributing to an enhanced understanding of materials engineering and bonding technologies for advanced applications. The formation of a nano-twinned structure and (111) surface orientation can be properly controlled by applied substrate bias. High-density nanotwinned structures were introduced into Cu films sputtered on SiC substrates with 82.3% of (111) orientation proportion at −150 V, much higher than the Cu film sputtered with another substrate bias. It is concluded that the sputtered Cu nanotwinned film formed with −150 V bias voltage has the potential to be employed as the interlayer for low-temperature direct bonding. Full article

Cu-Al-Ni is a high-temperature shape memory alloy (HTSMA) with exceptional thermomechanical properties, making it an ideal active material for engineering new technologies able to operate at temperatures up to 200 °C. Recent studies revealed that these alloys exhibit a robust superelastic behavior at the nanometer scale, making them excellent candidates for developing a new generation of micro-/nano-electromechanical systems (MEMS/NEMS). The very large-scale integration (VLSI) technologies used in microelectronics are based on thin films. In the present work, 1 μm thickness thin films of 84.1Cu-12.4 Al-3.5Ni (wt.%) were obtained by solid-state diffusion from a multilayer system deposited on SiNx (200 nm)/Si substrates by e-beam evaporation. With the aim of evaluating the thermal stability of such HTSMA thin films, heating experiments were performed in situ inside the transmission electron microscope to identify the temperature at which the material was decomposed by precipitation. Their microstructure, compositional analysis, and phase identification were characterized by scanning and transmission electron microscopy equipped with energy dispersive X-ray spectrometers. The nucleation and growth of two stable phases, Cu-Al-rich alpha phase and Ni-Al-rich intermetallic, were identified during in situ heating TEM experiments between 280 and 450 °C. These findings show that the used production method produces an HTSMA with high thermal stability and paves the road for developing high-temperature MEMS/NEMS using shape memory and superelastic technologies. Full article

Crack-free Cu alloy coating has been fabricated on Al alloy substrate with the existence of a Ag buffer layer. The Cu alloy coating had 12 at.% Al and 45 at.% Ag, which contributed to the formation of Cu solid solution and the eutectic phase (transformation temperature 780 °C). The eutectic phase was characterized as finer Cu solid solution and finer Ag solid solution. The Ag buffer layer had the main contents of Ag₂Al and Ag solid solution, and it not only hindered the formation of brittle intermetallic compounds (IMCs)but also reduced the thermal stress as its intermediate coefficient of thermal expansion (CTE). Furthermore, the plastic deformation of Ag solid solution in the Ag buffer layer and Cu solid solution in Cu alloy coating also relieved the thermal stress which was generated during the cladding process. All these three aspects inhibited crack generation. And the hardness of the Cu alloy coating increased to approximately 275 HV due to the strengthening effect of Al solid solution, grain boundary within the finer eutectic phase, and nano twin in the Cu solid solution of the eutectic phase. Full article

Epoxy coatings provide an economical and practical solution for combating steel corrosion. However, epoxy coatings have poor conductivity, resulting in the accumulation of electrostatic charges. The surface conductivity and anticorrosion properties of epoxy coatings can be improved by adding nano-Cu and hydroxylated multi-walled carbon nanotubes (MWCNTs). This paper investigates the impact of MWCNTs at different concentrations (2.5, 5%) and the ratio of nano-Cu to MWCNTs on the surface conductivity and anticorrosion properties of epoxy coatings on a steel substrate. The findings from the four-probe method of measuring surface resistance indicated that the surface resistivity of steel coated with an epoxy composite of 5% MWCNTs and 65% nano-Cu (Cu65/MWCNT5) was significantly lower, approximately by one order of magnitude, compared to steel coated with a 5% MWCNT (MWCNT5) epoxy coating. When the Cu65/MWCNT5-coated steel was immersed in a 3.5 wt % NaCl solution for 30 days, it was observed that there was a minimal effect on its surface resistivity. The inclusion of a high content of MWCNTs facilitates a more uniform distribution of Cu particles within the epoxy coatings, thereby improving the anticorrosion properties of these coatings on a steel substrate. This was further corroborated by the results of the polarization curves and electrochemical impedance spectroscopy, demonstrating that the Cu65/MWCNT5 epoxy coating on a steel substrate offers exceptional anticorrosion and barrier protection properties. The corrosion rate of steel with a Cu65/MWCNT5 epoxy coating was three orders of magnitude lower than that of steel with a Cu65/MWCNT2.5 epoxy coating, at 4.79 × 10⁻⁷ mm/year. Full article

Nanostructured films of copper, zinc, and nickel oxides were obtained from a controlled oxidation of the ternary nickel silver (Cu-Zn-Ni) substrates through a one-pot, green, and low temperature vapor-based treatment. Brief contact of the alloy with ammonia and hydrogen peroxide vapors at room temperature originates a mixture of nanometric copper, zinc, and nickel oxides at its surface. The growths evolve with time and temperature, generating a layered film with highly dispersed copper nano-oxides/hydroxides on a base of zinc and nickel oxides. The composition, configuration, and way of obtaining these films make them green catalysts, which are highly active and stable for a carbon monoxide oxidation reaction. Full article

A metal–organic framework (MOF) is a highly porous material with abundant redox capacitive sites for intercalation/de-intercalation of charges and, hence, is considered promising for electrode materials in supercapacitors. In addition, dopants can introduce defects and alter the electronic structure of the MOF, which can affect its surface reactivity and electrochemical properties. Herein, we report a copper-doped iron-based MOF (Cu@Fe-MOF/NF) thin film obtained via a simple drop-cast route on a 3D-nickel foam (NF) substrate for the supercapacitor application. The as-deposited Cu@Fe-MOF/NF electrodes exhibit a unique micro-sized bipyramidal structure composited with nanoparticles, revealing a high specific capacitance of 420.54 F g⁻¹ at 3 A g⁻¹ which is twice compared to the nano-cuboidal Fe-MOF/NF (210 F g⁻¹). Furthermore, the asymmetric solid-state (ASSSC) supercapacitor device, derived from the assembly of Cu@Fe-MOF/NFǁrGO/NF electrodes, demonstrates superior performance in terms of energy density (44.20 Wh.kg⁻¹) and electrochemical charge–discharge cycling durability with 88% capacitance retention after 5000 cycles. This work, thus, demonstrates a high potentiality of the Cu@Fe-MOF/NF film electrodes in electrochemical energy-storing devices. Full article

The aim of our study was to determine the effect of various nitrogen sources (NH₄NO₃ (N, 34%), Ca(NO₃)₂ (N, 15.5%; Ca, 18%), Mg(NO₃)₂ (N, 11%; Mg, 12%), NaNO₃ (N, 15%; Na, 25%) and urea (N, 46%)) and increasing the intensity of N nutrition with these fertilisers (50, 70, and 90 mg N·dm⁻³) on the yield and quality of flowering Chinese cabbage (Brassica campestris L. ssp. chinensis var. utilis Tsen et Lee). The plants were grown in two different soilless systems, namely pot cultivation (substrate system—mixture of peat and sand) and hydroponic cultivation. The quality of plants was expressed as macro- and microelement contents, pigment contents, antioxidant activity and phenolic content. It was observed that the yield of flowering Chinese cabbage was about 43–70% higher in the hydroponic system than in the substrate. The N source and N nutrition affected the yield volume. The highest mean yield was observed in pot cultivation after fertilisation with Mg(NO₃)₂ and in hydroponics with Ca(NO₃)₂. We found a rather high tolerance of flowering cabbage to sodium and an excessive content of ammonium in the nutrient solution. The nitrogen source and N doses modified plant contents of macro- and microelements (N, P, K, Ca, Mg, Na, Fe, Mn, Zn and Cu) and other quality parameters of plants. In pot cultivation, the highest element contents as well as the highest antioxidant activity were obtained after fertilisation with Mg(NO₃)₂ at N-70 and N-90. The highest pigment contents (chlorophylls and carotenoids) were obtained in the samples treated with urea at the N-90 dose. Those samples were also characterised by a high Mn content. Generally, the pigment content in the pot system positively correlated with the Mn content in leaves, the microelement which is involved in the process of photosynthesis, but it did not correlate with colour coordinates. In the hydroponic system, the highest pigment contents were observed in the samples treated with Mg(NO₃)₂ at the N-70 dose. Generally, in hydroponics, chlorophyll levels positively correlated with Ca levels in the aboveground parts of the plants. Additionally, the content of Chl b inversely correlated with L* and b* values. In hydroponic systems, the highest DPPH (2,2-diphenyl-1-picrylhydrazyl) activity was observed after treatment with NH₄NO₃ at the N-70 and N-90 doses and it did not correlate with phenolic content but rather with pigment content. In conclusion, both the intensity of N nutrition and the fertiliser applied can significantly modify the yield of plants and their quality parameters. For pot cultivation, the most effective fertiliser was Mg(NO₃)₂ at the N-70/N-90 doses, while for hydroponic cultivation, it is difficult to indicate the most effective fertiliser as the responses varied depending on the method of fertilisation. Full article

Commercially available copper and copper (II) oxide nanoparticles (CuNPs and CuO NPs) were characterized using TEM and electronography methods to elucidate their true average size and composition. The catalytic amine arylation using unsupported copper nanoparticles differing in their size and copper oxidation state was investigated. The reaction of the model iodobenzene with n-octylamine was shown to be successfully catalyzed by CuNPs of average size 25 and 10/80 nm in the presence of the ligands such as 2-isobutyrylcyclohexanone (L1) and rac-1,1′-bi-2-naphthol (BINOL, L2), giving high yields (up to 95%) of the target N-octylaniline. CuO in bulk and nano forms was shown to be almost equally efficient in this process. Studies on the Cu-catalyzed amination of substituted iodobenzenes and 2-iodopyridine, as well as the arylation of different aliphatic amines and NH-heterocycles, verified that CuNPs (25 or 10/80 nm) with L1 and L2 are the most versatile and efficient nanocatalysts for a variety of substrates. Investigation of copper leaching under different conditions was carried out. Full article

Nanotechnology is a discipline of science and engineering that emphasizes developing, modifying, characterizing, and using nanoscale components in a variety of applications. Owing to their multiple advantages, including adhesion strength, surface hardness, long-term and extra-high-temperature corrosion resistance, improvement of interfacial behavior, etc., nanocoatings are efficiently utilized to minimize the influence of a corrosive environment. Additionally, nanocoatings are often applied in thinner and finer concentrations, allowing for greater versatility in instrumentation and reduced operating and maintenance costs. The exemplary physical coverage of the coated substrate is facilitated by the fine dimensions of nanomaterials and the significant density of their grounded boundaries. For instance, fabricated self-healing eco-sustainable corrosion inhibitors including PAC/CuONPs, PAC/Fe₃O₄NPs, and PAC/NiONPs, with uniform distributions and particulate sizes of 23, 10, and 43 nm, correspondingly, were effective in producing PAC/MONPs nanocomposites which exhibited IE% of 93.2, 88.1, 96.1, and 98.6% for carbon steel corrosion in 1M HCl at the optimum concentration of 250 ppm. Therefore, in this review, further steps are taken into the exploration of the significant corrosion-mitigation potential and applications of nanomaterial-based corrosion inhibitors and nano-modified coatings, including self-healing nanocoatings, natural source-based nanocoatings, metal/metallic ion-based nanocoatings, and carbon allotrope-based nanocoatings, to generate defensive film and protection against corrosion for several metals and alloys. These have been illuminated through the in-depth discussion on characterization techniques such as scanning electron microscopy (SEM), electrochemical impedance spectroscopy (EIS), potentiodynamic polarization (PDP), atomic force microscopy (AFM), energy dispersive spectroscopy (EDS), etc. After providing a general summary of the various types of nanomaterials and their protective mechanisms in wide corrosive media, we subsequently present a viewpoint on challenges and future directions. Full article

The effects of the Cu content on the microstructural, mechanical and tribological properties of the TiAlSiN–Cu coatings were investigated in an effort to improve the wear resistance with a good fracture toughness for cutting tool applications. A functionally graded TiAlSiN–Cu coating with various copper (Cu) contents was fabricated by a filtered cathodic arc ion plating technique using four different (Ti, TiAl₂, Ti₄Si, and Ti₄Cu) targets in an argon-nitrogen atmosphere. The results showed that the TiAlSiN–Cu coatings are a nanocomposite consisting of (Ti,Al)N nano-crystallites (~5 to 7 nm) embedded in an amorphous matrix, which is a mixture of TiO_x, AlO_x, SiO_x, SiN_x, and CuO_x phase. The addition of Cu atoms into the TiAlSiN coatings led to the formation of an amorphous copper oxide (CuO_x) phase in the coatings. The maximum nanohardness (H) of ~46 GPa, H/E ratio of ~0.102, and adhesion bonding strength between coating and substrate of ~60 N (L_C2) were obtained at a Cu content ranging from 1.02 to 2.92 at.% in the TiAlSiN–Cu coatings. The coating with the lowest friction coefficient and best wear resistance was also obtained at a Cu content of 2.92 at.%. The formation of the amorphous CuO_x phase during coating growth or sliding test played a key role as a smooth solid-lubricant layer, and reduced the average friction coefficient (~0.46) and wear rate (~10 × 10⁻⁶ mm³/N·m). Full article