Symmetry/Asymmetry in Additive Manufacturing

A special issue of Symmetry (ISSN 2073-8994). This special issue belongs to the section "Engineering and Materials".

Deadline for manuscript submissions: 30 November 2025 | Viewed by 386

Special Issue Editors


E-Mail Website
Guest Editor
Mechanical Engineering, Wuhan University of Technology, Wuhan 430070, China
Interests: additive manufacturing; robotic manufacturing; material-structure–function integrated design
Special Issues, Collections and Topics in MDPI journals

E-Mail Website
Guest Editor
Mechanical Engineering, Wuhan University of Technology, Wuhan 430070, China
Interests: additive manufacturing; materials processing; computational mechanics

Special Issue Information

Dear Colleagues,

Additive manufacturing (AM), also known as 3D printing, has advanced significantly in recent years. AM has transformed engineering by offering high flexibility and freedom in fabricating complex components with minimum waste and short lead times. The advancements in AM have often been coupled with material development, structure design, functional components, process optimization, and system innovation. Symmetry and asymmetry play crucial roles in the performance and applications of AM systems.

The Special Issue, titled “Symmetry/Asymmetry in Additive Manufacturing”, is dedicated to publishing studies focused on the in-depth exploration of the intricate relationship between symmetry/asymmetry and AM systems. A specific emphasis is put on the contributions related to affect AM engineering where symmetry performance favors design, optimization and analysis.

Prof. Dr. Jinliang Zhang
Dr. Wenchao Ke
Guest Editors

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Symmetry is an international peer-reviewed open access monthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2400 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • symmetry
  • asymmetry
  • additive manufacturing
  • material development
  • structure design
  • process optimization
  • manufacturing system

Benefits of Publishing in a Special Issue

  • Ease of navigation: Grouping papers by topic helps scholars navigate broad scope journals more efficiently.
  • Greater discoverability: Special Issues support the reach and impact of scientific research. Articles in Special Issues are more discoverable and cited more frequently.
  • Expansion of research network: Special Issues facilitate connections among authors, fostering scientific collaborations.
  • External promotion: Articles in Special Issues are often promoted through the journal's social media, increasing their visibility.
  • e-Book format: Special Issues with more than 10 articles can be published as dedicated e-books, ensuring wide and rapid dissemination.

Further information on MDPI's Special Issue policies can be found here.

Published Papers

This special issue is now open for submission.
Back to TopTop