Advances in Thin Film Based Sensors
A special issue of Sensors (ISSN 1424-8220). This special issue belongs to the section "Sensor Materials".
Deadline for manuscript submissions: closed (18 December 2022) | Viewed by 302
Special Issue Editor
Special Issue Information
Dear Colleagues,
This Special Issue of the journal Sensors aims to collect cutting edge research papers in the field of sensor devices, namely, “Advances in Thin Film Based Sensors”.
Sensor devices which can be fabricated by semiconductor device process for the size range from nano scale to mm scale such as microelectromechanical systems (MEMS) with thin films can be extended to extremely stacked 3D structures. These sensor devices have outstanding advantages, not only in their small size for use in device processes and microelectromechanical systems (MEMS) technology but also in social and environmental evaluation. Their advantages typically include their smaller form factor and/or lower power consumption whilst at least maintaining—although in many cases exceeding—performance over conventional/thick film devices.
Thin-film advanced material systems enable the demonstration of next-generation innovative components suitable for the development of cost-effective and forward-looking nanostructures and devices. Additionally, materials’ stability and functionality together with their availability and production costs bring the necessity of diverse research works in this field. Therefore, functional devices with extremely integrated sensors would be available in the near future. In addition, collaboration with neuromorphic devices and artificial intelligence will open a new world in the device research field.
Prof. Dr. Tokiyoshi Matsuda
Guest Editor
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