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Smart Structures and Materials-Based Novel Sensing Technology for Civil Structures

A special issue of Sensors (ISSN 1424-8220). This special issue belongs to the section "Intelligent Sensors".

Deadline for manuscript submissions: closed (30 December 2022) | Viewed by 721

Special Issue Editors


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Guest Editor
Research Institute of Urbanization and Urban Safety, School of Civil and Resource Engineering, University of Science and Technology Beijing, Beijing 100083, China
Interests: multi-physical coupling analysis; non-destructive testing; smart materials and sensors

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Guest Editor
College of Civil Engineering, Huaqiao University, Xiamen 361021, China
Interests: multiscale simulation on RC structures; multiphysics simulation; FEM/XFEM/SEM; soft computation and artificial intelligence; NDT and SHM for engineering structures
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Special Issue Information

Dear Colleagues,

To achieve effective non-destructive testing and structural health monitoring for civil structures, smart sensing approaches have been rapidly developed in recent years. However, damage and defects in largescale infrastructures are diverse and cannot be easily detected using conventional NDT techniques. Current inadequate and impressive sensing methods have obstructed the development of structural health monitoring. Advanced sensing approaches using smart structures and materials are urgently needed to meet the increasing requirements in practical engineering applications. The aim of this Special Issue is to generate discussion on the latest research advances in smart structures and materials-based novel sensing technology for civil structures. The Special Issue will publish full research articles and review papers. Potential topics include, but are not limited to, the following research areas:

  • Smart materials and sensor design;
  • Multifunctional materials for smart sensing;
  • Detection mechanism analysis;
  • Experimental study and numerical simulation;
  • Non-destructive testing;
  • Structural health monitoring.

Dr. Hongbing Chen
Dr. Bin Xu
Guest Editors

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Sensors is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • Novel sensors and transducers
  • Innovative testing approach
  • Multi-physical coupling analysis
  • Intelligent sensing and imaging methods
  • Advanced signal processing

Published Papers

There is no accepted submissions to this special issue at this moment.
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