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Integrated Sensing, Communications, and Computing: Enabling Technologies and Applications for Intelligent Communication Networks and Low-Altitude Economy

A special issue of Sensors (ISSN 1424-8220). This special issue belongs to the section "Sensor Networks".

Deadline for manuscript submissions: 31 December 2025 | Viewed by 42

Special Issue Editors


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Guest Editor
School of Information and Communication Engineering, University of Electronic Science and Technology of China, Chengdu 611731, China
Interests: ISAC; array signal processing; beamforming; microwave imaging; anti-jamming

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Guest Editor
Department of Information and Communication Technologies, Universidad Politécnica de Cartagena (UPCT), Campus Muralla del Mar, E-30202 Cartagena, Spain
Interests: wireless networks; internet of things; nanocommunications; streaming services
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Special Issue Information

Dear Colleagues,

The convergence of Integrated Sensing, Communications, and Computing (ISCC) is revolutionizing next-generation intelligent communication networks and the emerging low-altitude economy. As advancements in 6G, artificial intelligence (AI), and edge computing accelerate, ISCC is enabling seamless interaction between terrestrial and aerial networks, supporting applications such as unmanned aerial vehicles (UAVs), urban air mobility (UAM), and smart transportation. The integration of ISCC in intelligent communication networks plays a crucial role in enhancing situational awareness, resource allocation, and real-time decision-making for air–ground collaborative systems. This Special Issue aims to explore the latest research, cutting-edge technologies, and real-world applications at the intersection of ISCC, intelligent communication networks, and the low-altitude economy. This Special Issue focuses on the following topics:

  • Waveform, sequence, coding, modulation, and beamforming design for ISCC;
  • MIMO, massive MIMO, and ultra-massive MIMO technologies for ISCC;
  • Sensing and positioning in communication networks;
  • Near-field transmission for ISCC;
  • Radar detection and imaging technologies;
  • ISCC design and optimization in V2X, UAV, and UAM networks;
  • Artificial intelligence for ISCC;
  • Integration of communication and multi-modal sensing.

Dr. Yi Liao
Prof. Dr. Rafael Asorey-Cacheda
Guest Editors

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Sensors is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • integrated sensing, communications, and computing (ISCC)
  • intelligent communication networks
  • waveform design for ISCC
  • sensing and positioning in communication networks
  • multi-modal sensing and communication integration
  • beamforming techniques
  • MIMO, massive MIMO, and ultra-massive MIMO

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Published Papers

This special issue is now open for submission.
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