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Thermal Behavior and Properties of Polymer Composites

A special issue of Polymers (ISSN 2073-4360). This special issue belongs to the section "Polymer Composites and Nanocomposites".

Deadline for manuscript submissions: 10 March 2026 | Viewed by 3

Special Issue Editors


E-Mail Website
Guest Editor
Vinča Institute of Nuclear Science, University of Belgrade, P.O. Box 522, 11001 Belgrade, Serbia
Interests: nanostructured materials; polymers; nanocomposites; thermal methods; TG-DTA; DSC
Special Issues, Collections and Topics in MDPI journals

E-Mail Website
Guest Editor
Faculty of Sciences and Mathematics, Vinča Institute of Nuclear Science, University of Belgrade, P.O. Box 522, 11001 Belgrade, Serbia
Interests: polymer synthesis; nanocomposites; elastomeric materials; bio-composite materials and polymer characterization

Special Issue Information

Dear Colleagues,

The journal Polymers (ISSN 2073-4360, IF 4.9) is currently running a Special Issue entitled “Thermal Behavior and Properties of Polymer Composites”, for which Dr. Milena Marinović-Cincović is serving as Guest Editor.

Polymer composites represent an important class of advanced materials whose thermal behavior strongly influences their processing, stability, and performance in end-use applications. The incorporation of fillers, fibers, or nanoparticles into polymer matrices modifies their heat transfer mechanisms and thermal transitions, including their glass transition temperature (Tg), melting temperature (Tm), and crystallization behavior. Improved thermal conductivity can be achieved through the addition of conductive fillers like carbon nanotubes, graphene, or metallic particles, which facilitate efficient heat dissipation. At the same time, inorganic fillers such as silica or clay can enhance thermal stability by restricting polymer chain mobility and acting as barriers to heat and mass transfer during degradation.

Thermal analysis techniques, including thermogravimetric analysis (TGA), differential thermal analysis (DTA), differential scanning calorimetry (DSC), dynamic mechanical analysis (DMA), and the Laser Flash technique (LFT), are commonly used to evaluate decomposition temperatures, phase transitions, relaxation processes, and thermal conductivity. The synergistic effects between polymer matrices and reinforcing agents often result in composites with superior flame resistance, dimensional stability, and mechanical integrity under elevated temperatures compared to neat polymers.

Understanding the thermal behavior of polymer composites is crucial for their application in the aerospace, automotive, electronics, and packaging industries, where thermal management, durability, and safety are essential.

This Special Issue aims to highlight recent progress in the processing, characterization, and application of polymer composites, with particular emphasis on their thermal behavior, structure–property relationships, and innovative processing technologies. Both fundamental studies and applied research are welcome, including topics such as

  • Thermal stability, degradation, and phase transitions in polymers and polymer-based composites;
  • Novel experimental and computational approaches to investigating thermal and mechanical properties;
  • Polymer nanocomposites, hybrid materials, and advanced multifunctional systems;
  • Recycling, reprocessing, and sustainable development of polymer composites with improved thermal performance;
  • Advanced applications of thermally modified polymers in engineering, medicine, and energy technologies.

The aim of this Special Issue is to provide a platform for presenting new insights into the correlation between the structural and thermal properties of polymers, as well as to encourage the development of innovative and sustainable approaches for tailoring materials with improved performance. By bringing together a collection of high-quality contributions, we hope to stimulate fruitful discussions and further advancements in this important area of polymer science and engineering.

We warmly encourage you to consider contributing your latest results or insights. Your participation will greatly enrich the scope and impact of this Special Issue.

We very much look forward to your submission.

Dr. Milena Marinović-Cincović
Prof. Dr. Suzana Samaržija-Jovanović
Prof. Dr. Ignazio Blanco
Guest Editors

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Polymers is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2700 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • polymer composites
  • thermal stability
  • thermal conductivity
  • glass transition temperature (Tg)
  • melting temperature (Tm)
  • crystallization
  • thermogravimetric analysis (TGA)
  • differential scanning calorimetry (DSC)

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Published Papers

This special issue is now open for submission.
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