Functional Polymer Composites for Advanced Applications

A special issue of Polymers (ISSN 2073-4360). This special issue belongs to the section "Smart and Functional Polymers".

Deadline for manuscript submissions: 15 October 2024 | Viewed by 1922

Special Issue Editors

College of Chemistry and Chemical Engineering, Shaanxi University of Science and Technology, Xi'an, China
Interests: biomedical materials; supramolecular polymers; host-guest inclusion; drug release behavior; cancer therapy; flexible electronic sensors; functional polymers
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Guest Editor
Xi’an Modern Chemistry Research Institute, Xi’an 710065, China
Interests: preparation and application of propellants; theoretical study of the reaction mechanism for propellants
Special Issues, Collections and Topics in MDPI journals

Special Issue Information

Dear Colleagues,

Recently, functional and composite polymeric materials for biomedical, electronical, environmental, energetic and engineering application have drawn a lot of attention. As a result, many novel functional polymeric materials have been prepared. However, the design of functional polymers or the novel composite structure for advanced application still need to be studied further. Thus, we encourage the submission of manuscripts that provide novel insights and papers that report on significant advances in the field. Topics include, but are not limited to, the following:

  • Functional polymeric materials for engineering applications;
  • Composite polymeric materials for engineering applications;
  • The design of novel functional polymers for advanced applications;
  • Biopolymer-based materials for engineering applications;
  • New concepts in the application of polymers.

Dr. Yang Bai
Dr. Xiaolong Fu
Guest Editors

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Polymers is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2700 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • composite
  • polymer
  • application
  • functional materials
  • characterization

Published Papers (2 papers)

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Research

13 pages, 3581 KiB  
Article
Two-Level Self-Thickening Mechanism of a Novel Acid Thickener with a Hydrophobic-Associated Structure during High-Temperature Acidification Processes
by Peng Li, Lei Wang, Xiaojuan Lai, Jinhao Gao, Zhiqiang Dang, Rong Wang, Fan Mao, Yemin Li and Guangliang Jia
Polymers 2024, 16(5), 679; https://doi.org/10.3390/polym16050679 - 2 Mar 2024
Cited by 1 | Viewed by 654
Abstract
Two acid thickeners, ADMC and ADOM, were prepared by aqueous solution polymerization using acrylamide (AM) and methacryloyloxyethyl trimethyl ammonium chloride (DMC) as raw materials, with or without the introduction of octadecyl polyoxyethylene ether methacrylate (OEMA). It was characterized by FTIR, 1H NMR, [...] Read more.
Two acid thickeners, ADMC and ADOM, were prepared by aqueous solution polymerization using acrylamide (AM) and methacryloyloxyethyl trimethyl ammonium chloride (DMC) as raw materials, with or without the introduction of octadecyl polyoxyethylene ether methacrylate (OEMA). It was characterized by FTIR, 1H NMR, and the fluorescence spectra of pyrene. The double-layer thickening mechanism of ADOM was proved by comparing the thickening and rheological properties of ADMC and ADOM tested by a six-speed rotary viscometer and a HAKKE MARSIV rheometer during the acidification process. The results showed that the synthetic product was the target product; the first stage of the self-thickening ADOM fresh acid solution during high-temperature acidification was mainly affected by Ca2+ concentration, and the second stage of self-thickening was mainly affected by temperature. The residual viscosity of the 0.8 wt% ADOM residual acid solution was 250, 201.5, and 61.3 mPa·s, respectively, after shearing at 90, 120, and 150 °C for 60 min at a shear rate of 170 s−1. The thickening acid ADOM with a hydrophobic association structure has good temperature resistance and shear resistance, which can be used for high-temperature deep-well acid fracturing. In addition, no metal crosslinking agent was introduced in the system to avoid damage to its formation, and ADOM exhibited good resistance to Ca2+, which could provide ideas for the reinjection of the acidizing flowback fluid. It also has certain advantages for environmental protection. Full article
(This article belongs to the Special Issue Functional Polymer Composites for Advanced Applications)
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13 pages, 6887 KiB  
Article
The Enhancement of the Thermal Conductivity of Epoxy Resin Reinforced by Bromo-Oxybismuth
by Yuan Jia, Beibei Li, Huan Ma, Juxiang Yang and Zhen Liu
Polymers 2023, 15(23), 4616; https://doi.org/10.3390/polym15234616 - 4 Dec 2023
Cited by 2 | Viewed by 917
Abstract
With the gradual miniaturization of electronic devices, the thermal conductivity of electronic components is increasingly required. Epoxy (EP) resins are easy to process, exhibit excellent electrical insulation properties, and are light in weight and low in cost, making them the preferred material for [...] Read more.
With the gradual miniaturization of electronic devices, the thermal conductivity of electronic components is increasingly required. Epoxy (EP) resins are easy to process, exhibit excellent electrical insulation properties, and are light in weight and low in cost, making them the preferred material for thermal management applications. In order to endow EPs with better dielectric and thermal conductivity properties, bromo-oxygen-bismuth (BiOBr) prepared using the hydrothermal method was used as a filler to obtain BiOBr/EP composites, and the effect of BiOBr addition on the properties of the BiOBr/EP composites was also studied. The results showed that the addition of a small amount of BiOBr could greatly optimize the dielectric properties and thermal conductivity of EP resin, and when the content of BiOBr was 0.75 wt% and 1.00 wt%, the dielectric properties and thermal conductivity of the composite could reach the optimum, respectively. The high dielectric constant and excellent thermal conductivity of BiOBr/EP composites are mainly due to the good layered structure of BiOBr, which can provide good interfacial polarization and thermal conductivity. Full article
(This article belongs to the Special Issue Functional Polymer Composites for Advanced Applications)
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