Special Issue "Soft Nanocomposites in Electronic and Optical Devices"

A special issue of Nanomaterials (ISSN 2079-4991).

Deadline for manuscript submissions: closed (1 December 2019).

Special Issue Editor

Prof. Linda S. Hirst
Website
Guest Editor
UC Merced, School of Natural Sciences, Merced, United States
Interests: nanocomposites; liquid crystals; soft matter; biomaterials

Special Issue Information

Dear Colleagues,

The ability to controllably combine conventional hard nanoscale materials with a soft host phase opens up an enormous range of possibilities for innovation in electronic and optical materials and devices. Applications include switchable/responsive coatings and films, sensitive electro-optical or magnetic sensors, photovoltaics and novel optical components. In recent years, there has been a surge of interest in developing polymer and liquid crystal nanocomposites that incorporate the functionality of included nanoparticles into a complex fluid base material such that the composite is amenable to device manufacture in a variety of geometries. For example, plasmon resonance in metallic particles can be used to create thermally responsive polymers, reorient liquid crystal molecules or break capsules for controlled release. Quantum dots can be assembled into mesoscale structures and bulk phases with highly tunable optical properties. To achieve the necessary spatial control of nanoparticles for use in devices, researchers must gain expertise in particle dispersion and controlled assembly in complex solvents. This has largely been achieved by novel approaches to ligand design and the development of advanced assembly methods, focusing in detail on the nanoscale interactions between surface-modified particles and the host phase.

This Special Issue of Nanomaterials will focus on the latest developments in the use of soft nanocomposites for cutting-edge optical and electronic devices and aims to cover a broad range of perspectives and exciting new technologies. Submissions may describe significant advances in nanoparticle use for potential device applications on all length-scales. Suitable topics include fundamental ligand design and synthesis, nanoparticle/host phase interactions, defect and phase transition-based assembly methods, mesoscale structural assembly and device design and evaluation.

Prof. Linda S. Hirst
Guest Editor

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All papers will be peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Nanomaterials is an international peer-reviewed open access monthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2000 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • nanoparticles
  • nanomaterials
  • quantum dots
  • polymer
  • liquid crystal
  • soft nanocomposites
  • photovoltaics
  • sensor
  • photonic
  • mesoscale

Published Papers

There is no accepted submissions to this special issue at this moment.
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