Advanced Electronic Materials—from Molecular Design, Assembly to 3D Package, Smart Device and Intelligence
A special issue of Nanomaterials (ISSN 2079-4991). This special issue belongs to the section "Nanoelectronics, Nanosensors and Devices".
Deadline for manuscript submissions: 20 April 2026 | Viewed by 214
Special Issue Editors
Interests: advanced functional materials design; functional oriented molecular recognition and assembly; advanced electronic packaging materials
Special Issues, Collections and Topics in MDPI journals
Interests: flexible electronic materials and devices, biodegradable electronic materials and devices, and transparent conductive films
Interests: fundamental understanding of the mechanics and dynamics of thermosets (epoxy resin, silicone, and etc.); thermosets nanocomposites; nanocomposite rheology; application: high-performance thermal interface materials and their applications in advanced electronic packaging
Special Issues, Collections and Topics in MDPI journals
Special Issue Information
Dear Colleagues,
The electronic information and integrated circuit industry has greatly promoted the development of the global economy and society, enabling humans to evolve from an agricultural society to an industrial civilization, and then to the current era of information and intelligence.
At the molecular and atomic level, most electronics, such as chips and RAM sticks, are enabled by advanced materials. The assembly, packaging, and stacking of silicon and carbon atoms, along with other atoms, are the foundation of the modern semiconductor industry.
As Moore's Law gradually approaches its limit, many problems and challenges still exist.
High-frequency, high-power, and high-speed applications, such as 5G/6G tele-communication, supercomputing, and data centers, face the challenges of heat dissipation, energy efficiency, and stability. The emergence of robots and embodied intelligence creates risks that humans will be threatened and replaced by the machines we create.
Nevertheless, many more challenges remain.
In the big data era, software occupies more and more space. Our cell phones and laptops' hard drives and memory are quickly filled up. How can we design and manufacture more powerful chips and storage devices for the AI age?
How can we create next-genetation photo-sensitizers that support the most advanced extreme ultraviolet lithography process?
How can we make sensors and electronics more sensitive and have lower latency, so that intelligent driving systems can ensure the safety of passengers in case of emergencies during high-speed driving?
How can we invent bioelectronics that help people with Alzheimer's disease regain recognition and memory?
The present Special Issue of Nanomaterials aims to present the most recent developments in advanced electronic materials, covering molecular design and assembly, 3D packages, smart devices, and intelligence.
In the present Special Issue, we have invited contributions from leading researchers in the field, aiming to provide an updated view of the current state of the art in advanced electronic materials. Research and review articles are both welcome. Topics of interest include, but are not limited to, the following areas:
- Electronic packaging materials
- High-purity electronic chemicals
- Electronic cleaning agents and processes
- 3D heterogeneous integrated materials
- Flexible electronics and packaging materials
- Integrated all-in-one compact energy structures
- Intelligent surface and integrated molding antenna
- Thermal management packaging and fluid materials
- Microwave-absorbing materials
- Electromagnetic stealth materials
- Bio-based packaging materials and bioelectronics
- Brain–computer interface
- Organic electronics
- Emerging electronic Materials
Prof. Dr. Yagang Zhang
Prof. Dr. Wei Lan
Prof. Dr. Xiaoliang Zeng
Guest Editors
Manuscript Submission Information
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Keywords
- advanced electronic materials
- electronic packaging materials
- molecular design and assembly
- 3D package, smart electronics and device
- electronic for artificial intelligence
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