Thermal and Dielectric Properties of Nanostructures
A special issue of Nanomaterials (ISSN 2079-4991). This special issue belongs to the section "Nanoelectronics, Nanosensors and Devices".
Deadline for manuscript submissions: 20 May 2025 | Viewed by 189
Special Issue Editor
Interests: focus on the development of multi-functional dielectric materials and their application in energy electrical equipment; specific directions include coil electrical equipment insulation; aramid/cellulose insulating paper; high-performance epoxy resin, thermally yet insulating dielectric and so on
Special Issue Information
Dear Colleagues,
The field of nanostructures is rapidly evolving, with a strong focus on understanding and exploiting their thermal and dielectric properties. These properties are of paramount importance for the advancement of technology, as they can significantly enhance the performance of various applications.
Nanostructures, due to their unique size-dependent characteristics, display thermal and dielectric behaviors that are markedly different from those of bulk materials. Factors such as high surface-to-volume ratios, quantum confinement effects, and interface phenomena play crucial roles in determining these properties. By employing sophisticated synthesis techniques like self-assembly, epitaxy, and exfoliation, we can precisely manipulate the size, shape, and composition of nanostructures, thereby tailoring their thermal and dielectric properties to meet specific application requirements.
Current research is revealing the immense potential of nanostructured materials in areas such as energy storage, sensing, and electronics. As our comprehension of these materials deepens, we are on the cusp of groundbreaking discoveries that could revolutionize energy efficiency and electronic device performance.
This Special Issue is dedicated to showcasing the most recent research on the thermal and dielectric properties of nanostructures. We are eager to feature contributions from leading experts in the field, aiming to provide a thorough and up-to-date account of the current state and future outlook of this dynamic area within materials science.
We look forward to your submissions and the opportunity to explore the cutting-edge developments in this exciting domain together.
Dr. Junwen Ren
Guest Editor
Manuscript Submission Information
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Keywords
- thermal conductivity
- dielectric
- interface
- energy storage
- electronic
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