Special Issue "Micro-devices in the Area of Industry 4.0"

A special issue of Micromachines (ISSN 2072-666X). This special issue belongs to the section "A:Physics".

Deadline for manuscript submissions: 10 August 2020.

Special Issue Editors

Prof. Dr. Rolf Wüthrich
Guest Editor
Department of Mechanical, Industrial & Aerospace Engineering, Concordia University, 1455 de Maisonneuve Blvd. West Montreal, Quebec H3G 1M8, Canada
Interests: micromachining; Industry 4.0; electrochemical processes
Special Issues and Collections in MDPI journals
Assoc. Prof. Dr. Lucas A. Hof
Guest Editor
Department of Mechanical Engineering, École de technologie supérieure, 1100, rue Notre-Dame Ouest, Montréal, Québec H3C 1K3, Canada
Interests: micromachining; Industry 4.0; circular manufacturing

Special Issue Information

Dear Colleagues,

With the mass proliferation of network technologies and massive reduction in their costs, more and more devices are integrating the ability to connect to larger networks, such as the World Wide Web. A new concept has emerged in the form of Internet of Things (IoT), where devices can connect to each other, exchange information, and sometimes even make decisions collaboratively. Along with this new wave of technology, the concept of Industry 4.0 also emerged. Industry 4.0, originally introduced in Germany in 2011, regroups technologies and practices in the manufacturing industry which, among other factors, heavily relies on interconnectivity. One of the aims of Industry 4.0 is to answer the new challenges faced by the manufacturing industry, with the increasing need for low batch size production and mass personalization. Not only does manufacturing itself make use of these technologies, but novel products as well, such as is exemplified by smart phones.

This Special Issue of Micromachines seeks contributions from the broad research field of microdevices in the context of the fourth industrial revolution. This includes (1) microdevices with applications for the Internet of Things, (2) smart microdevices and fabrication methods for low batch sizes, (3) smart factories or cyberphysical systems for the production of microdevices, (4) mass personalization for microdevices, digital twins of microdevices, and (5) virtual reality for microdevice design, assembly, or fabrication.

Prof. Dr. Rolf Wüthrich
Assoc. Prof. Dr. Lucas A. Hof
Guest Editors

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All papers will be peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Micromachines is an international peer-reviewed open access monthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 1600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.


  • microdevices for IoT (Internet of Things)
  • smart microdevices
  • fabrication methods for low batch sizes
  • smart factories/cyberphysical systems for production of microdevices
  • mass personalization for microdevices
  • digital twins/virtual reality for microdevice design/assembly/fabrication

Published Papers

This special issue is now open for submission.
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