Low Power Sensors: Technology, Circuit Interfaces, Systems and Applications

A special issue of Journal of Low Power Electronics and Applications (ISSN 2079-9268).

Deadline for manuscript submissions: closed (30 September 2014) | Viewed by 8779

Special Issue Editor


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Guest Editor
Principal Engineer, Intel Corporation, Yakum, Israel
Interests: low power sensors; sensor interfaces; analog interfaces; MEMs; RF sensor arrays; PMUT; CMUT; biomedical sensors; sensor applications; thermal sensors; piezoelectric and piezoresistive sensors; capacitive sensors; image sensors physical/electronic interfaces

Special Issue Information

Dear Colleagues,

Today’s electronic applications are generally trending toward mobile and portable systems. All traditional computing devices are "going mobile." To be viable, these mobile systems will be required to interface with the physical world effectively and efficiently. Consequently, the field of "low power sensors" is a very important one for electronics.

In this Special Issue, we are recruiting research papers relevant to low power sensors; papers may concern technology, circuits, systems, and applications.

Possible topics include, but are not limited to, the following:

  • Image Sensors
  • Piezoresistive Sensors
  • Capacitive Sensors
  • Piezoelectric Sensors
  • Biomedical Sensors, including Neural Interfaces and lab-on-a-chip
  • Chemical Sensors
  • Temperature Sensors
  • Sensor Applications
  • MEMs for RF and Analog
  • RF Arrays and Imaging
  • Sensors for Wearable Electronics
  • Environmental Sensors
  • Sensor arrays

The Special Issue constitutes an excellent forum for the dissemination of top research in the low power sensors area. We encourage submissions from academic and research institutes, as well as from industry. Papers concerning systems, low paper sensor technology and analog interfaces, novel products, and applications in this area are highly encouraged.

Dr. Joseph Shor
Guest Editor

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Journal of Low Power Electronics and Applications is an international peer-reviewed open access quarterly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 1800 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

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Published Papers (1 paper)

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Article
Untrimmed Low-Power Thermal Sensor for SoC in 22 nm Digital Fabrication Technology
by Ro'ee Eitan and Ariel Cohen
J. Low Power Electron. Appl. 2014, 4(4), 304-316; https://doi.org/10.3390/jlpea4040304 - 9 Dec 2014
Cited by 3 | Viewed by 8353
Abstract
Thermal sensors (TS) are essential for achieving optimized performance and reliability in the era of nanoscale microprocessor and system on chip (SoC). Compiling with the low-power and small die area of the mobile computing, the presented TS supports a wide range of sampling [...] Read more.
Thermal sensors (TS) are essential for achieving optimized performance and reliability in the era of nanoscale microprocessor and system on chip (SoC). Compiling with the low-power and small die area of the mobile computing, the presented TS supports a wide range of sampling frequencies with an optimized power envelope. The TS supports up to 45 K samples/s, low average power consumption, as low as 20 μW, and small core Si area of 0.013 mm2. Advanced circuit techniques are used in order to overcome process variability, ensuring inaccuracy lower than ±2 °C without any calibration. All this makes the presented thermal sensor a cost-effective, low-power solution for 22 nm nanoscale digital process technology. Full article
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