Special Issue "Heat Transfer and Its Innovative Applications"
A special issue of Inventions (ISSN 2411-5134). This special issue belongs to the section "Inventions and innovation in Energy and Thermal/Fluidic Science".
Deadline for manuscript submissions: closed (31 July 2018).
Interests: MEMS; biochips; nanotechnology; two-phase flow and heat transfer; medical devices; entrepreneurship; innovation
Special Issues, Collections and Topics in MDPI journals
Interests: heat transfer in nanostructure materials; Boiling heat transfer on micro-nano structures; Heat transfer in high temperature gas turbine; Thermal design of electronic device; Thermal design of CCS (Carbon Capture Sequestration) using fluidization
Many innovative and high-end techniques have been developed and employed for changing our daily lives, namely, artificial intelligence (AI) technology, autonomous car, hyper-loop for high-speed transportation, miniaturization of electronic devices, and heat dissipation from cooling films to outer space, and so on. However, these innovative technologies can not reach their optimal performance without adequate techniques for heat transfer or a well-control of temperature during operation.
Manuscripts are welcome to be submitted to cover the topics of thermal management of data centers, electronic devices, renewable energy applications, autonomous cars, thin films with well-defined structures for reflection or emission of thermal radiation, two-phase heat transfer phenomenon on surfaces with hierarchical structures, and applications of AI with regards to heat transfer. Furthermore, we invite manuscripts that focus on novel research regarding the development of components, equipment, and techniques involving thermal processes. However, special topics are not limited to the aforementioned ones.
Prof. Ping-Hei Chen
Prof. Hyung Hee Cho
Manuscript Submission Information
Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All papers will be peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.
Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Inventions is an international peer-reviewed open access quarterly journal published by MDPI.
Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 1500 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.
- Thermal management in high-end techniques
- Heat transfer mechanism on nanostructured surfaces
- Renewable energy sources and clean energy
- Thermodynamic optimization of sustainable energy system
- Heat transfer mechanism of nanofluids
- Modelling and optimization of thermophysical properties, convective heat transfer, and two-phase heat transfer
- Effect of size of channels on conjugate heat transfer and pressure drop.
- Waste heat management
- Design of development of heat transfer devices and equipment