Recent Advances in Artificial Intelligence for Wound Assessment

A special issue of Bioengineering (ISSN 2306-5354). This special issue belongs to the section "Biosignal Processing".

Deadline for manuscript submissions: 15 September 2026 | Viewed by 206

Special Issue Editors


E-Mail Website
Guest Editor
Computer Science & Biomedical Engineering, University of Wisconsin-Milwaukee, Milwaukee, WI 53211, USA
Interests: big data; machine learning; image analysis; scientific computing; 3D visualization

E-Mail Website
Guest Editor
Cardiovascular Medicine, Mayo Clinic, Rochester, MN 55905, USA
Interests: big data; machine learning; image analysis; medical diagnosis

Special Issue Information

Dear Colleagues,

Chronic wounds—including diabetic foot ulcers, venous leg ulcers and pressure injuries—represent a major and growing challenge for healthcare systems worldwide. These conditions affect millions of patients and are associated with substantial morbidity, mortality and healthcare costs. Accurate wound assessment is essential for guiding treatment decisions and predicting healing outcomes. However, current clinical practice still relies heavily on visual inspection and manual measurements, which can be subjective, time-consuming and prone to inter-observer variability.

Recent advances in artificial intelligence—particularly deep learning and computer vision—have created unprecedented opportunities to transform wound assessment and management. By leveraging large collections of wound images and clinical data, modern AI algorithms can automatically extract clinically meaningful features from wound images, enabling objective evaluation of wound characteristics such as size, tissue composition, infection status and healing progression. Image-based AI systems have demonstrated promising potential to support clinicians in diagnosis, automate wound measurement and tissue classification and predict healing trajectories, ultimately improving clinical decision-making and patient outcomes.

This Special Issue on “Recent Advances in Artificial Intelligence for Wound Assessment” aims to bring together cutting-edge research at the intersection of artificial intelligence, medical image analysis and clinical wound care. We welcome original research articles, methodological developments and comprehensive reviews that advance the development, validation and clinical translation of AI-driven wound assessment technologies.

Topics of interest include, but are not limited to:

  1. Novel deep learning architectures for wound detection, segmentation and classification
  2. Multimodal wound analysis integrating imaging, clinical data and electronic health records
  3. Automated tissue type identification and quantitative wound measurement
  4. Deep learning methods for wound healing prediction and prognosis
  5. Few-shot, transfer learning and self-supervised learning for medical imaging
  6. Explainable and trustworthy AI for clinical wound assessment
  7. Mobile, point-of-care and telemedicine applications for wound monitoring
  8. Clinical validation, deployment and translational studies of AI-based wound analysis systems

Prof. Dr. Zeyun Yu
Dr. D. M. Anisuzzaman
Guest Editors

Guest Editor Assistant:
Name: Dr. Yash Patel
Affiliation: College of Business and Information Technology, Lawrence Technological University
Southfield, MI 48075, USA
Website: https://ltu.edu/faculty/patel-yash/
E-mail: ypatel3@ltu.edu
Interests: big data; machine learning; image analysis

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 250 words) can be sent to the Editorial Office for assessment.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Bioengineering is an international peer-reviewed open access monthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2700 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • artificial intelligence
  • deep learning
  • medical image analysis
  • convolutional neural networks
  • wound assessment
  • wound segmentation
  • wound classification
  • wound healing prediction
  • telemedicine
  • digital health

Benefits of Publishing in a Special Issue

  • Ease of navigation: Grouping papers by topic helps scholars navigate broad scope journals more efficiently.
  • Greater discoverability: Special Issues support the reach and impact of scientific research. Articles in Special Issues are more discoverable and cited more frequently.
  • Expansion of research network: Special Issues facilitate connections among authors, fostering scientific collaborations.
  • External promotion: Articles in Special Issues are often promoted through the journal's social media, increasing their visibility.
  • Reprint: MDPI Books provides the opportunity to republish successful Special Issues in book format, both online and in print.

Further information on MDPI's Special Issue policies can be found here.

Published Papers

This special issue is now open for submission.
Back to TopTop