Special Issue "New Trends on Selective Laser Melting"
Deadline for manuscript submissions: 31 December 2020.
Interests: modeling and simulation; machining; powders; manufacturing
Applied Sciences (ISSN 2076-3417) is a high visibility journal covering all aspects of applied engineering. Experimental and theoretical results that are presented in as much detail as possible are encouraged. The journal is indexed by the Science Citation Index Expanded (Web of Science), Scopus, Inspec (IET) and other databases. Its Impact Factor is 1.689 (2017) and the 5-Year Impact Factor is 1.855 (2017). Applied Sciences is available online at: https://www.mdpi.com/journal/applsci.
I am currently guest editing a Special Issue of the journal, focused on " New Trends in Selective Laser Melting". Selective laser melting (SLM) is gradually introducing revolutionary changes to manufacturing processes and will play a significant part in future economic growth. Today there is a focus on finding a balance between production and consumption, and SLM presents a way to improve the performance of resources. SLM is being widely investigated by many governments, research institutions, enterprises and the media.
The purpose of this Special Issue is to provide the reader with a collection of valuable research papers highlighting SLM trends. Topics include but are not limited to developments in materials, highly-complex and high-performance products, embedded functionality, process modeling, thermal treatment, post-processing, surface conditioning, support optimization, part characterization, powder characterization, part and process design, process management with warrant attention, and databases and digital rights.
Within the framework of this Special Issue, I would like to invite you to submit a paper to Applied Sciences. I would greatly appreciate if you would forward this call to friends, colleagues and co-workers working in the field.
Dr. Alberto Boschetto
Manuscript Submission Information
Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All papers will be peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.
Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Applied Sciences is an international peer-reviewed open access semimonthly journal published by MDPI.
Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 1800 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.
- selective laser melting
- process simulation
- surface quality prediction
- process modeling
- surface roughness
- assembly and non-assembly mechanism
- surface chemistry
- part characterization
- support optimization
- post processing
- part finishing
- thermal treatment
- new materials
- powder characterization
The below list represents only planned manuscripts. Some of these manuscripts have not been received by the Editorial Office yet. Papers submitted to MDPI journals are subject to peer-review.
1.Im Doo Jung, Korea Institute of Materials Science (Korea)
2.Paolo Gaudenzi, Francesco Veniali, Marco Eugeni, Luana Bottini, Valerio Cardini, Alberto Boschetto,
Sapienza University of Rome via Eudossiana (Italy)