Substrate Integrated Waveguide (SIW) and Its Applications II

Dear Colleagues,

During the last decade, substrate integrated waveguide (SIW) technology has been largely implemented for the construction of numerous microwave devices and circuits based on innovative solutions or re-proposing, by following a quasi-planar approach, well-known functionalities of classical waveguide-based components/systems. The possibility of fabricating shielded structures by employing planar geometries has provided an amazing way to fabricate innovative resonators exhibiting very high quality factors suitable for filter and oscillator applications, efficient radiating structures such as cavity-based antennas, miniaturized slot and horn antennas, compact coupling structures for multiplexing, multilayer/multi-way power dividers, wideband Magic-T, and so on. Multi-layered printed circuit board (PCB) or low-temperature co-fired ceramic (LTCC) technologies and the SIW approach allow a high feasibility, planar integration and packaging degree to be reached. As a consequence, the possibility of fabricating complex structures at low cost fulfils the increasing demand of highly sophisticated antennas for satellite communication, 5G and new generation wireless systems, terahertz systems, biomedicine, and a number of other applications.

Topics of interest to be covered by this Special Issue include, but are not limited to, the exploitation of SIW technology for:

• Fabrication of microwave components;
• Planar circuits integrations;
• Planar antennas and beam-forming techniques;
• Microwave photonics;
• 5G and wireless systems;
• Terahertz devices and systems;
• Satellite communications;
• Radar for automotive applications;
• Microwave applicators and wearable devices for medicine.

Prof. Dr. Francesco Prudenzano
Guest Editor

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