Precision Grinding of Brittle Materials: Techniques and Applications
A special issue of Applied Sciences (ISSN 2076-3417). This special issue belongs to the section "Materials Science and Engineering".
Deadline for manuscript submissions: 20 June 2025 | Viewed by 128
Special Issue Editor
Interests: interfacial reaction; microstructure; diamond tool; precision grinding
Special Issues, Collections and Topics in MDPI journals
Special Issue Information
Dear Colleagues,
Brittle materials are widely used in the optical, semiconductor, electronics, and medical industries. However, machining these materials presents significant challenges due to their tendency to fracture or develop defects, requiring precise control of processing parameters. In response to growing demands in the optoelectronic industry, this Special Issue aims to serve as a platform to explore the latest progress, challenges, and opportunities in the domain of “Precision Grinding of Brittle Materials: Techniques and Applications”.
Contributions are invited to uncover the fundamental understanding of precision grinding of brittle materials such as Si, SiC, sapphire, and diamond, paying special attention to enhancing manufacturing practices. In this Special Issue, original research articles and reviews are welcome. Areas of interest include (but are not limited to) pioneering research on (1) ultraprecision machining, (2) the deformation and removal of brittle materials, (3) micro/nano manufacturing, (4) surface integrity and characterization in manufacturing, and (5) the fabrication and performance of advanced machining tools.
We look forward to receiving your contributions.
Prof. Dr. Dekui Mu
Guest Editor
Manuscript Submission Information
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Keywords
- brittle materials
- ultraprecision machining
- micro/nano manufacturing
- surface integrity and characterization in manufacturing
- the fabrication and performance of advanced machining tools
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