The Study of Processing Technologies in Additive Manufacturing
A special issue of Applied Sciences (ISSN 2076-3417). This special issue belongs to the section "Mechanical Engineering".
Deadline for manuscript submissions: closed (20 March 2025) | Viewed by 231
Special Issue Editors
Interests: additive manufacturing; 3D reconstruction: bioengineering
Interests: additive metal manufacturing
Special Issue Information
Dear Colleagues,
The study of processing technologies in additive manufacturing (AM) aims to advance the understanding and optimization of AM processes. This Special Issue invites contributions that explore the development of new materials and the enhancement of existing ones to improve mechanical properties, durability, and versatility. Research should focus on refining process parameters, such as temperature, speed, and layer thickness, to enhance quality and efficiency. Submissions that discuss innovations in software, artificial intelligence (AI), and machine learning (ML) tools are particularly encouraged, as these technologies are crucial for predicting, controlling, and optimizing AM outcomes. AI and ML can provide new insights into process automation, decision making, and accuracy enhancement. Authors are also invited to explore the integration of AM with traditional manufacturing techniques to advance hybrid manufacturing capabilities. Studies addressing the environmental impacts and sustainability of AM, with an emphasis on reducing waste and energy consumption, are of particular interest. Contributions should aim to provide tailored solutions and expand the application of AM technologies across industries, such as aerospace, biomedical, and automotive industries.
Dr. Tomás Ballesteros
Dr. Alfredo Suárez
Dr. Pedro Villanueva-Roldán
Guest Editors
Manuscript Submission Information
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Keywords
- additive manufacturing
- process optimization
- material development
- mechanical properties
- simulation tools
- hybrid manufacturing
- sustainability
- machine learning
- artificial intelligence (AI)
- industry applications
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