Advances in Heat Transfer Analysis Through Computational Fluid Dynamics
A special issue of Applied Sciences (ISSN 2076-3417). This special issue belongs to the section "Applied Physics General".
Deadline for manuscript submissions: 20 December 2025 | Viewed by 207
Special Issue Editor
2. Faculty of Mechanical Engineering, Delft University of Technology, Mekelweg 2, 2628 CD Delft, The Netherlands
Interests: additive manufacturing; high-fidelity numerical simulations; transport phenomena in materials processing; data and physics driven design and optimisation
Special Issues, Collections and Topics in MDPI journals
Special Issue Information
Dear Colleagues,
This Special Issue aims to highlight recent advancements and emerging methodologies in the field of heat transfer analysis through Computational Fluid Dynamics (CFD). With the growing demand for high-performance thermal systems across various engineering domains, novel CFD-based approaches are playing a pivotal role in designing, optimising, and understanding complex thermal processes.
We welcome original research and review articles that demonstrate innovative CFD strategies to tackle multi-scale and multi-physics heat transfer challenges. This Special Issue particularly focuses on new developments in thermal analysis, including microfluidics for high-performance thermal management and microchip cooling, the integration of artificial intelligence and machine learning techniques for heat transfer modelling, and the development of high-efficiency numerical schemes and advanced reduced-order models for industrial-scale simulations.
Contributions addressing thermal phenomena under non-equilibrium conditions, such as in rarefied gas flows, vacuum environments, or high-frequency transient heat transport, are also encouraged. In addition, we seek studies that explore novel heat transfer analysis methods in advanced manufacturing technologies, such as additive manufacturing and laser-based processing, where thermal dynamics are critical to performance and quality.
This Special Issue offers a platform to share cutting-edge research that bridges fundamental heat transfer theory with practical CFD implementation, enabling new solutions across aerospace, electronics cooling, energy systems, biomedical engineering, and materials processing.
Topics of interest include, but are not limited to, the following:
- Microfluidics and microscale heat transfer;
- Microchip and electronics cooling systems;
- AI/ML-assisted heat transfer modelling;
- High-performance numerical methods and solvers;
- Reduced-order modelling of thermal-fluid systems;
- Heat transfer under rarefied and vacuum conditions;
- Transient and non-equilibrium thermal transport;
- Thermal analysis in additive manufacturing and laser processing;
- Conjugate heat transfer and phase-change modelling;
- Multiphase and reactive flow simulations involving heat transfer.
Dr. Amin Ebrahimi
Guest Editor
Manuscript Submission Information
Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.
Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Applied Sciences is an international peer-reviewed open access semimonthly journal published by MDPI.
Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2400 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.
Keywords
- computational fluid dynamics (CFD)
- heat transfer
- microfluidics
- microchip cooling
- artificial intelligence
- machine learning
- numerical methods
- reduced-order models
- rarefied gas flow
- vacuum systems
- non-equilibrium heat transfer
- additive manufacturing
- conjugate heat transfer
- multiphase heat transfer
- phase transformation
Benefits of Publishing in a Special Issue
- Ease of navigation: Grouping papers by topic helps scholars navigate broad scope journals more efficiently.
- Greater discoverability: Special Issues support the reach and impact of scientific research. Articles in Special Issues are more discoverable and cited more frequently.
- Expansion of research network: Special Issues facilitate connections among authors, fostering scientific collaborations.
- External promotion: Articles in Special Issues are often promoted through the journal's social media, increasing their visibility.
- Reprint: MDPI Books provides the opportunity to republish successful Special Issues in book format, both online and in print.
Further information on MDPI's Special Issue policies can be found here.
