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Advanced Technology for Cultural Heritage and Digital Humanities

A special issue of Applied Sciences (ISSN 2076-3417). This special issue belongs to the section "Civil Engineering".

Deadline for manuscript submissions: 20 September 2025 | Viewed by 310

Special Issue Editors


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Guest Editor
Area of Sculpture at the Department of Fine Arts, University of La Laguna, 38320 San Cristóbal de La Laguna, Spain
Interests: 3D technology; digital fabrication; low-cost technologies; augmented and virtual reality for classroom; sculptural heritage
Special Issues, Collections and Topics in MDPI journals

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Guest Editor
Department of Technical and Project Engineering and Architecture, Polytechnic School of Engineering, University of La Laguna, Tenerife, Spain
Interests: 3D printer in education; 3D modelling; videogames in education
Special Issues, Collections and Topics in MDPI journals

Special Issue Information

Dear Colleagues,

The integration of technology into cultural heritage and digital humanities represents a paradigm shift in the way that we document, conserve, analyze, and interpret historical and cultural artifacts. We are interested in papers that explore innovative applications, methodologies, and theoretical frameworks related to advanced technology in these fields.

One application of technology for the dissemination and preservation of cultural heritage is virtual tours. These tours can vary in type, being created with advanced scanners and software or with more accessible technologies like 360° cameras. Virtual tours can be experienced in a fully immersive manner, even with haptic systems that go beyond visual engagement, or simply made accessible to the general public through a smartphone screen and a web link.

We seek diverse perspectives on the use of 3D surveying, modeling, printing, and visualization in the documentation, preservation, restoration, and study of cultural heritage. We are particularly interested in innovative applications of virtual and augmented reality for creating interactive and educational experiences. Furthermore, we encourage discussions on the development of open access digital archives and platforms for sharing cultural heritage data, as well as the integration of artificial intelligence.

Dr. Cecile Meier
Dr. Jose Luis Saorin
Guest Editors

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Applied Sciences is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2400 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • 3D scanning and photogrammetry
  • digital reconstruction
  • digital fabrication
  • virtual and augmented reality
  • virtual tours or museums
  • data management and analysis
  • artificial intelligence
  • education and divulgation

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Published Papers

This special issue is now open for submission.
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