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Journal: Micro, 2025
Volume: 5
Number: 26
26
Article: High-Performance EMI Shielding Film Based on Low-D_k Polyimide and Trimodal Ag Ink for High-Speed Signal Integrity Enhancement
Authors: by Moses Gu, Suin Chae, Seonwoo Kim, Yubin Kim, Shinui Kang, Soobin Park, Se-Hoon Park, Sung-Hoon Choa and Hyunjin Nam
Link: https://www.mdpi.com/2673-8023/5/2/26

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