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Journal: J. Compos. Sci., 2025
Volume: 9
Number: 536

Article: Degradation Progress of Metallized Silicon Nitride Substrate Under Thermal Cycling Tests by Digital Image Correlation
Authors: by Minh Chu Ngo, Hiroyuki Miyazaki, Kiyoshi Hirao, Tatsuki Ohji and Manabu Fukushima
Link: https://www.mdpi.com/2504-477X/9/10/536

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