A Numerical Study on High Velocity Impact Behavior of Titanium Based Fiber Metal Laminates
AbstractThe present paper gives details of the structural response of titanium-based fiber metal laminates (TFML) subjected to high velocity impact. Dynamic perforation behavior of two different sample configurations, TFML-2/1 and 3/2 are presented. The behavior of the metal and composite layer is defined using two independent appropriate constitutive material models. Both experimental and numerically predicted residual velocity follows the Recht-Ipson model variation with impact velocity. Being larger in thickness, residual velocity, peak contact force and total energy absorbed were found to be larger for TFML-3/2 than 2/1. However, the contact duration was rather insignificantly affected. Having similar metal volume fraction (MVF), energy dissipated by means of plastic deformation of metal layers was found to be constant for both TFML configurations that were considered. The axisymmetric loading, boundary conditions and having balanced material property distribution along the principle axes resulted in doubly symmetric damage surfaces, both layer-wise and overall. The developed finite element (FE) model adequately simulated the contact behavior and all of the experimentally realized damage modes in the metal and composite layers and confirmed its reliability. Having limited experimental information, the obtained numerical information allows one to briefly understand the dynamic perforation behavior of TFML laminates. View Full-Text
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Chai, G.B.; Manikandan, P.; Li, X. A Numerical Study on High Velocity Impact Behavior of Titanium Based Fiber Metal Laminates. J. Compos. Sci. 2018, 2, 62.
Chai GB, Manikandan P, Li X. A Numerical Study on High Velocity Impact Behavior of Titanium Based Fiber Metal Laminates. Journal of Composites Science. 2018; 2(4):62.Chicago/Turabian Style
Chai, Gin B.; Manikandan, Periyasamy; Li, Xin. 2018. "A Numerical Study on High Velocity Impact Behavior of Titanium Based Fiber Metal Laminates." J. Compos. Sci. 2, no. 4: 62.
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