Kulkarni, R.; Soltani, M.; Wappler, P.; Guenther, T.; Fritz, K.-P.; Groezinger, T.; Zimmermann, A.
Reliability Study of Electronic Components on Board-Level Packages Encapsulated by Thermoset Injection Molding. J. Manuf. Mater. Process. 2020, 4, 26.
https://doi.org/10.3390/jmmp4010026
AMA Style
Kulkarni R, Soltani M, Wappler P, Guenther T, Fritz K-P, Groezinger T, Zimmermann A.
Reliability Study of Electronic Components on Board-Level Packages Encapsulated by Thermoset Injection Molding. Journal of Manufacturing and Materials Processing. 2020; 4(1):26.
https://doi.org/10.3390/jmmp4010026
Chicago/Turabian Style
Kulkarni, Romit, Mahdi Soltani, Peter Wappler, Thomas Guenther, Karl-Peter Fritz, Tobias Groezinger, and André Zimmermann.
2020. "Reliability Study of Electronic Components on Board-Level Packages Encapsulated by Thermoset Injection Molding" Journal of Manufacturing and Materials Processing 4, no. 1: 26.
https://doi.org/10.3390/jmmp4010026
APA Style
Kulkarni, R., Soltani, M., Wappler, P., Guenther, T., Fritz, K.-P., Groezinger, T., & Zimmermann, A.
(2020). Reliability Study of Electronic Components on Board-Level Packages Encapsulated by Thermoset Injection Molding. Journal of Manufacturing and Materials Processing, 4(1), 26.
https://doi.org/10.3390/jmmp4010026