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Open AccessArticle

Reliability Study of Electronic Components on Board-Level Packages Encapsulated by Thermoset Injection Molding

1
Hahn-Schickard, 70569 Stuttgart, Germany
2
Institute for Micro Integration (IFM), University of Stuttgart, 70569 Stuttgart, Germany
*
Author to whom correspondence should be addressed.
J. Manuf. Mater. Process. 2020, 4(1), 26; https://doi.org/10.3390/jmmp4010026
Received: 18 December 2019 / Revised: 12 March 2020 / Accepted: 16 March 2020 / Published: 18 March 2020
A drastically growing requirement of electronic packages with an increasing level of complexity poses newer challenges for the competitive manufacturing industry. Coupled with harsher operating conditions, these challenges affirm the need for encapsulated board-level (2nd level) packages. To reduce thermo-mechanical loads induced on the electronic components during operating cycles, a conformal type of encapsulation is gaining preference over conventional glob-tops or resin casting types. The availability of technology, the ease of automation, and the uncomplicated storage of raw material intensifies the implementation of thermoset injection molding for the encapsulation process of board-level packages. Reliability case studies of such encapsulated electronic components as a part of board-level packages become, thereupon, necessary. This paper presents the reliability study of exemplary electronic components, surface-mounted on printed circuit boards (PCBs), encapsulated by the means of thermoset injection molding, and subjected to cyclic thermal loading. The characteristic lifetime of the electronic components is statistically calculated after assessing the probability plots and presented consequently. A few points of conclusion are summarized, and the future scope is discussed at the end. View Full-Text
Keywords: encapsulation; board level package; electronics; epoxy molding compound; flow simulation; injection molding; injection molding simulation; lifetime; manufacturing; PCB; QFN; reliability; resistors; SMD; surface mount technology; thermoset; transfer molding; Weibull; boxplot; capacitor; CTE; material processing; mold trials; scanning acoustic microscopy; temperature shock encapsulation; board level package; electronics; epoxy molding compound; flow simulation; injection molding; injection molding simulation; lifetime; manufacturing; PCB; QFN; reliability; resistors; SMD; surface mount technology; thermoset; transfer molding; Weibull; boxplot; capacitor; CTE; material processing; mold trials; scanning acoustic microscopy; temperature shock
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MDPI and ACS Style

Kulkarni, R.; Soltani, M.; Wappler, P.; Guenther, T.; Fritz, K.-P.; Groezinger, T.; Zimmermann, A. Reliability Study of Electronic Components on Board-Level Packages Encapsulated by Thermoset Injection Molding. J. Manuf. Mater. Process. 2020, 4, 26. https://doi.org/10.3390/jmmp4010026

AMA Style

Kulkarni R, Soltani M, Wappler P, Guenther T, Fritz K-P, Groezinger T, Zimmermann A. Reliability Study of Electronic Components on Board-Level Packages Encapsulated by Thermoset Injection Molding. Journal of Manufacturing and Materials Processing. 2020; 4(1):26. https://doi.org/10.3390/jmmp4010026

Chicago/Turabian Style

Kulkarni, Romit; Soltani, Mahdi; Wappler, Peter; Guenther, Thomas; Fritz, Karl-Peter; Groezinger, Tobias; Zimmermann, André. 2020. "Reliability Study of Electronic Components on Board-Level Packages Encapsulated by Thermoset Injection Molding" J. Manuf. Mater. Process. 4, no. 1: 26. https://doi.org/10.3390/jmmp4010026

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