Order Article Reprints

Cherif L, Chentouf M, Benallal J, Darmi M, Elgouri R, Hmina N. A New Multi-Bit Flip-Flop Merging Mechanism for Power Consumption Reduction in the Physical Implementation Stage of ICs Conception. Journal of Low Power Electronics and Applications. 2019; 9(1):3. https://doi.org/10.3390/jlpea9010003

Cherif, Lekbir, Mohamed Chentouf, Jalal Benallal, Mohammed Darmi, Rachid Elgouri, and Nabil Hmina. 2019. "A New Multi-Bit Flip-Flop Merging Mechanism for Power Consumption Reduction in the Physical Implementation Stage of ICs Conception" Journal of Low Power Electronics and Applications 9, no. 1: 3. https://doi.org/10.3390/jlpea9010003

Cherif, L., Chentouf, M., Benallal, J., Darmi, M., Elgouri, R., & Hmina, N. (2019). A New Multi-Bit Flip-Flop Merging Mechanism for Power Consumption Reduction in the Physical Implementation Stage of ICs Conception. Journal of Low Power Electronics and Applications, 9(1), 3. https://doi.org/10.3390/jlpea9010003