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Fibers 2019, 7(2), 12; https://doi.org/10.3390/fib7020012

A Novel Method for Embedding Semiconductor Dies within Textile Yarn to Create Electronic Textiles

Advanced Textiles Research Group, Nottingham Trent University, Nottingham NG1 4FQ, UK
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Received: 21 December 2018 / Revised: 18 January 2019 / Accepted: 21 January 2019 / Published: 26 January 2019
(This article belongs to the Special Issue Electronically Active Textiles)
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Abstract

Electronic yarns (E-yarns) contain electronics fully incorporated into the yarn’s structure prior to textile or garment production. They consist of a conductive core made from a flexible, multi-strand copper wire onto which semiconductor dies or MEMS (microelectromechanical systems) are soldered. The device and solder joints are then encapsulated within a resin micro-pod, which is subsequently surrounded by a textile sheath, which also covers the copper wires. The encapsulation of semiconductor dies or MEMS devices within the resin polymer micro-pod is a critical component of the fabrication process, as the micro-pod protects the dies from mechanical and chemical stresses, and hermetically seals the device, which makes the E-yarn washable. The process of manufacturing E-yarns requires automation to increase production speeds and to ensure consistency of the micro-pod structure. The design and development of a semi-automated encapsulation unit used to fabricate the micro-pods is presented here. The micro-pods were made from a ultra-violet (UV) curable polymer resin. This work details the choice of machinery and methods to create a semi-automated encapsulation system in which incoming dies were detected then covered in resin micro-pods. The system detected incoming 0402 metric package dies with an accuracy of 87 to 98%. View Full-Text
Keywords: electronics packaging; encapsulation; electronic yarns (E-yarn); textiles; electronic textiles (E-textiles); smart textiles; intelligent textiles; UV curing; polymer resin electronics packaging; encapsulation; electronic yarns (E-yarn); textiles; electronic textiles (E-textiles); smart textiles; intelligent textiles; UV curing; polymer resin
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This is an open access article distributed under the Creative Commons Attribution License which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited (CC BY 4.0).
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Nashed, M.-N.; Hardy, D.A.; Hughes-Riley, T.; Dias, T. A Novel Method for Embedding Semiconductor Dies within Textile Yarn to Create Electronic Textiles. Fibers 2019, 7, 12.

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