A Novel Method for Embedding Semiconductor Dies within Textile Yarn to Create Electronic Textiles
AbstractElectronic yarns (E-yarns) contain electronics fully incorporated into the yarn’s structure prior to textile or garment production. They consist of a conductive core made from a flexible, multi-strand copper wire onto which semiconductor dies or MEMS (microelectromechanical systems) are soldered. The device and solder joints are then encapsulated within a resin micro-pod, which is subsequently surrounded by a textile sheath, which also covers the copper wires. The encapsulation of semiconductor dies or MEMS devices within the resin polymer micro-pod is a critical component of the fabrication process, as the micro-pod protects the dies from mechanical and chemical stresses, and hermetically seals the device, which makes the E-yarn washable. The process of manufacturing E-yarns requires automation to increase production speeds and to ensure consistency of the micro-pod structure. The design and development of a semi-automated encapsulation unit used to fabricate the micro-pods is presented here. The micro-pods were made from a ultra-violet (UV) curable polymer resin. This work details the choice of machinery and methods to create a semi-automated encapsulation system in which incoming dies were detected then covered in resin micro-pods. The system detected incoming 0402 metric package dies with an accuracy of 87 to 98%. View Full-Text
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Nashed, M.-N.; Hardy, D.A.; Hughes-Riley, T.; Dias, T. A Novel Method for Embedding Semiconductor Dies within Textile Yarn to Create Electronic Textiles. Fibers 2019, 7, 12.
Nashed M-N, Hardy DA, Hughes-Riley T, Dias T. A Novel Method for Embedding Semiconductor Dies within Textile Yarn to Create Electronic Textiles. Fibers. 2019; 7(2):12.Chicago/Turabian Style
Nashed, Mohamad-Nour; Hardy, Dorothy A.; Hughes-Riley, Theodore; Dias, Tilak. 2019. "A Novel Method for Embedding Semiconductor Dies within Textile Yarn to Create Electronic Textiles." Fibers 7, no. 2: 12.
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