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Journal: Fibers, 2019
Volume: 7
Number: 12
Article:
A Novel Method for Embedding Semiconductor Dies within Textile Yarn to Create Electronic Textiles
Authors:
by
Mohamad-Nour Nashed, Dorothy Anne Hardy, Theodore Hughes-Riley and Tilak Dias
Link:
https://www.mdpi.com/2079-6439/7/2/12
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