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Journal: Appl. Sci., 2019
Volume: 9
Number: 3535

Article: Two-Step Plasma Treatment on Sputtered and Electroplated Cu Surfaces for Cu-To-Cu Bonding Application
Authors: by Hankyeol Seo, Hae Sung Park and Sarah Eunkyung Kim
Link: https://www.mdpi.com/2076-3417/9/17/3535

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