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Volume 11
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Article

Kinematic Prediction and Experimental Demonstration of Conditioning Process for Controlling the Profile Shape of a Chemical Mechanical Polishing Pad

by
Hanchul Cho
,
Taekyung Lee
,
Doyeon Kim
and
Hyoungjae Kim
*
Precision Mechanical Process and Control R&D Group, Korea Institute of Industrial Technology (KITECH), Busan 46938, Korea
*
Author to whom correspondence should be addressed.
Appl. Sci. 2021, 11(10), 4358; https://doi.org/10.3390/app11104358
Submission received: 14 April 2021 / Revised: 3 May 2021 / Accepted: 5 May 2021 / Published: 11 May 2021
(This article belongs to the Special Issue Chemical Mechanical Polishing and Grinding)
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Abstract

The uniformity of the wafer in a chemical mechanical polishing (CMP) process is vital to the ultra-fine and high integration of semiconductor structures. In particular, the uniformity of the polishing pad corresponding to the tool directly affects the polishing uniformity and wafer shape. In this study, the profile shape of a CMP pad was predicted through a kinematic simulation based on the trajectory density of the diamond abrasives of the diamond conditioner disc. The kinematic prediction was found to be in good agreement with the experimentally measured pad profile shape. Based on this, the shape error of the pad could be maintained within 10 μm even after performing the pad conditioning process for more than 2 h, through the overhang of the conditioner.
Keywords: chemical mechanical polishing; pad profile; conditioner; conditioning; diamond conditioner; kinetic modeling; sliding distance chemical mechanical polishing; pad profile; conditioner; conditioning; diamond conditioner; kinetic modeling; sliding distance
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MDPI and ACS Style

Cho, H.; Lee, T.; Kim, D.; Kim, H. Kinematic Prediction and Experimental Demonstration of Conditioning Process for Controlling the Profile Shape of a Chemical Mechanical Polishing Pad. Appl. Sci. 2021, 11, 4358. https://doi.org/10.3390/app11104358

AMA Style

Cho H, Lee T, Kim D, Kim H. Kinematic Prediction and Experimental Demonstration of Conditioning Process for Controlling the Profile Shape of a Chemical Mechanical Polishing Pad. Applied Sciences. 2021; 11(10):4358. https://doi.org/10.3390/app11104358

Chicago/Turabian Style

Cho, Hanchul, Taekyung Lee, Doyeon Kim, and Hyoungjae Kim. 2021. "Kinematic Prediction and Experimental Demonstration of Conditioning Process for Controlling the Profile Shape of a Chemical Mechanical Polishing Pad" Applied Sciences 11, no. 10: 4358. https://doi.org/10.3390/app11104358

APA Style

Cho, H., Lee, T., Kim, D., & Kim, H. (2021). Kinematic Prediction and Experimental Demonstration of Conditioning Process for Controlling the Profile Shape of a Chemical Mechanical Polishing Pad. Applied Sciences, 11(10), 4358. https://doi.org/10.3390/app11104358

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