Next Article in Journal
Self-Supporting Microchannel Liquid-Cooled Plate for T/R Modules Based on Additive Manufacturing: Study on Its Pass Design, Formation Process and Boiling Heat Transfer Performance
Next Article in Special Issue
Challenges and Latest Developments in Diffusion Bonding of High-Magnesium Aluminium Alloy (Al-5056/Al-5A06) to Stainless Steels
Previous Article in Journal
Understanding the High Creep Resistance of MRI 230D Magnesium Alloy through Nanoindentation and Atom Probe Tomography
Previous Article in Special Issue
Fail-Safe Joints between Copper Alloy (C18150) and Nickel-Based Superalloy (GH4169) Made by Transient Liquid Phase (TLP) Bonding and Using Boron-Nickel (BNi-2) Interlayer

Joining Ti6Al4V to Alumina by Diffusion Bonding Using Titanium Interlayers

Department of Mechanical Engineering, Federal University of Amazonas, General Rodrigo Octavio Jordão Ramos ST, Manaus 69067-005, Brazil
DEMM, Department of Metallurgical and Materials Engineering, University of Porto, R. Dr. Roberto Frias, 4200-465 Porto, Portugal
LAETA/INEGI, Institute of Science and Innovation in Mechanical and Industrial Engineering, R. Dr. Roberto Frias, 4200-465 Porto, Portugal
University of Coimbra, CEMMPRE, Department of Mechanical Engineering, R. Luís Reis Santos, 3030-788 Coimbra, Portugal
Author to whom correspondence should be addressed.
Academic Editor: Daolun Chen
Metals 2021, 11(11), 1728;
Received: 28 September 2021 / Revised: 11 October 2021 / Accepted: 25 October 2021 / Published: 29 October 2021
(This article belongs to the Special Issue Advances in Technology and Applications of Diffusion Bonding)
This work aims to investigate the joining of Ti6Al4V alloy to alumina by diffusion bonding using titanium interlayers: thin films (1 µm) and commercial titanium foils (5 µm). The Ti thin films were deposited by magnetron sputtering onto alumina. The joints were processed at 900, 950, and 1000 °C, dwell time of 10 and 60 min, under contact pressure. Experiments without interlayer were performed for comparison purposes. Microstructural characterization of the interfaces was conducted by optical microscopy (OM), scanning electron microscopy (SEM) with energy dispersive X-ray spectroscopy (EDS), and electron backscatter diffraction (EBSD). The mechanical characterization of the joints was performed by nanoindentation to obtain hardness and reduced Young’s modulus distribution maps and shear strength tests. Joints processed without interlayer have only been achieved at 1000 °C. Conversely, joints processed using Ti thin films as interlayer showed promising results at temperatures of 950 °C for 60 min and 1000 °C for 10 and 60 min, under low pressure. The Ti adhesion to the alumina is a critical aspect of the diffusion bonding process and the joints produced with Ti freestanding foils were unsuccessful. The nanoindentation results revealed that the interfaces show hardness and reduced Young modulus, which reflect the observed microstructure. The average shear strength values are similar for all joints tested (52 ± 14 MPa for the joint processed without interlayer and 49 ± 25 MPa for the joint processed with interlayer), which confirms that the use of the Ti thin film improves the diffusion bonding of the Ti6Al4V alloy to alumina, enabling a decrease in the joining temperature and time. View Full-Text
Keywords: diffusion bonding; thin film; titanium; Al2O3; sputtering diffusion bonding; thin film; titanium; Al2O3; sputtering
Show Figures

Figure 1

MDPI and ACS Style

Silva, M., Jr.; Ramos, A.S.; Simões, S. Joining Ti6Al4V to Alumina by Diffusion Bonding Using Titanium Interlayers. Metals 2021, 11, 1728.

AMA Style

Silva M Jr., Ramos AS, Simões S. Joining Ti6Al4V to Alumina by Diffusion Bonding Using Titanium Interlayers. Metals. 2021; 11(11):1728.

Chicago/Turabian Style

Silva, Marcionilo, Jr., Ana S. Ramos, and Sónia Simões. 2021. "Joining Ti6Al4V to Alumina by Diffusion Bonding Using Titanium Interlayers" Metals 11, no. 11: 1728.

Find Other Styles
Note that from the first issue of 2016, MDPI journals use article numbers instead of page numbers. See further details here.

Article Access Map by Country/Region

Back to TopTop