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Journal: Polymers, 2021
Volume: 13
Number: 147
147
Article: Enhanced Thermal Conductivity of Epoxy Composites Filled with Al₂O₃/Boron Nitride Hybrids for Underfill Encapsulation Materials
Authors: by William Anderson Lee Sanchez, Chen-Yang Huang, Jian-Xun Chen, Yu-Chian Soong, Ying-Nan Chan, Kuo-Chan Chiou, Tzong-Ming Lee, Chih-Chia Cheng and Chih-Wei Chiu
Link: https://www.mdpi.com/2073-4360/13/1/147

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