Choi, H.-S.; Park, J.-W.; Lee, K.-S.; Kim, S.-W.; Suh, S.-J.
Thermal Conductivity and Electromagnetic Interference (EMI) Absorbing Properties of Composite Sheets Composed of Dry Processed Core–Shell Structured Fillers and Silicone Polymers. Polymers 2020, 12, 2318.
https://doi.org/10.3390/polym12102318
AMA Style
Choi H-S, Park J-W, Lee K-S, Kim S-W, Suh S-J.
Thermal Conductivity and Electromagnetic Interference (EMI) Absorbing Properties of Composite Sheets Composed of Dry Processed Core–Shell Structured Fillers and Silicone Polymers. Polymers. 2020; 12(10):2318.
https://doi.org/10.3390/polym12102318
Chicago/Turabian Style
Choi, Hyun-Seok, Ji-Won Park, Kyung-Sub Lee, Sang-Woo Kim, and Su-Jeong Suh.
2020. "Thermal Conductivity and Electromagnetic Interference (EMI) Absorbing Properties of Composite Sheets Composed of Dry Processed Core–Shell Structured Fillers and Silicone Polymers" Polymers 12, no. 10: 2318.
https://doi.org/10.3390/polym12102318
APA Style
Choi, H.-S., Park, J.-W., Lee, K.-S., Kim, S.-W., & Suh, S.-J.
(2020). Thermal Conductivity and Electromagnetic Interference (EMI) Absorbing Properties of Composite Sheets Composed of Dry Processed Core–Shell Structured Fillers and Silicone Polymers. Polymers, 12(10), 2318.
https://doi.org/10.3390/polym12102318