Time-Efficient High-Resolution Large-Area Nano-Patterning of Silicon Dioxide
AbstractA nano-patterning approach on silicon dioxide (SiO2) material, which could be used for the selective growth of III-V nanowires in photovoltaic applications, is demonstrated. In this process, a silicon (Si) stamp with nanopillar structures was first fabricated using electron-beam lithography (EBL) followed by a dry etching process. Afterwards, the Si stamp was employed in nanoimprint lithography (NIL) assisted with a dry etching process to produce nanoholes on the SiO2 layer. The demonstrated approach has advantages such as a high resolution in nanoscale by EBL and good reproducibility by NIL. In addition, high time efficiency can be realized by one-spot electron-beam exposure in the EBL process combined with NIL for mass production. Furthermore, the one-spot exposure enables the scalability of the nanostructures for different application requirements by tuning only the exposure dose. The size variation of the nanostructures resulting from exposure parameters in EBL, the pattern transfer during nanoimprint in NIL, and subsequent etching processes of SiO2 were also studied quantitatively. By this method, a hexagonal arranged hole array in SiO2 with a hole diameter ranging from 45 to 75 nm and a pitch of 600 nm was demonstrated on a four-inch wafer. View Full-Text
Share & Cite This Article
Lin, L.; Ou, Y.; Aagesen, M.; Jensen, F.; Herstrøm, B.; Ou, H. Time-Efficient High-Resolution Large-Area Nano-Patterning of Silicon Dioxide. Micromachines 2017, 8, 13.
Lin L, Ou Y, Aagesen M, Jensen F, Herstrøm B, Ou H. Time-Efficient High-Resolution Large-Area Nano-Patterning of Silicon Dioxide. Micromachines. 2017; 8(1):13.Chicago/Turabian Style
Lin, Li; Ou, Yiyu; Aagesen, Martin; Jensen, Flemming; Herstrøm, Berit; Ou, Haiyan. 2017. "Time-Efficient High-Resolution Large-Area Nano-Patterning of Silicon Dioxide." Micromachines 8, no. 1: 13.
Note that from the first issue of 2016, MDPI journals use article numbers instead of page numbers. See further details here.