Zheng, T.; Xu, Y.; Mei, C.; Chen, Y.; Chang, L.; Yang, G.; Hu, Q.; Shi, T.; Yuan, Y.; Yu, Z.;
et al. Post-Bonding Crack-Induced Di-Cantilever Bending (PBC-DCB): A Novel Method for Quantitative Evaluation of Bonding Strength for Wafer-to-Wafer and Die-to-Wafer Hybrid Bonding. Micromachines 2025, 16, 1304.
https://doi.org/10.3390/mi16121304
AMA Style
Zheng T, Xu Y, Mei C, Chen Y, Chang L, Yang G, Hu Q, Shi T, Yuan Y, Yu Z,
et al. Post-Bonding Crack-Induced Di-Cantilever Bending (PBC-DCB): A Novel Method for Quantitative Evaluation of Bonding Strength for Wafer-to-Wafer and Die-to-Wafer Hybrid Bonding. Micromachines. 2025; 16(12):1304.
https://doi.org/10.3390/mi16121304
Chicago/Turabian Style
Zheng, Tianze, Yuan Xu, Cong Mei, Yingjie Chen, Liu Chang, Gangli Yang, Qiuhan Hu, Tailong Shi, Yuan Yuan, Zongguang Yu,
and et al. 2025. "Post-Bonding Crack-Induced Di-Cantilever Bending (PBC-DCB): A Novel Method for Quantitative Evaluation of Bonding Strength for Wafer-to-Wafer and Die-to-Wafer Hybrid Bonding" Micromachines 16, no. 12: 1304.
https://doi.org/10.3390/mi16121304
APA Style
Zheng, T., Xu, Y., Mei, C., Chen, Y., Chang, L., Yang, G., Hu, Q., Shi, T., Yuan, Y., Yu, Z., & Li, L.
(2025). Post-Bonding Crack-Induced Di-Cantilever Bending (PBC-DCB): A Novel Method for Quantitative Evaluation of Bonding Strength for Wafer-to-Wafer and Die-to-Wafer Hybrid Bonding. Micromachines, 16(12), 1304.
https://doi.org/10.3390/mi16121304
