Lei, M.; Gao, W.; Li, G.; Wu, X.; Li, B.; Wang, X.; Wang, J.
Good-Quality and High-Efficiency Dicing for Thick LiNbO3 Wafers Using Picosecond Laser Pulses. Micromachines 2020, 11, 51.
https://doi.org/10.3390/mi11010051
AMA Style
Lei M, Gao W, Li G, Wu X, Li B, Wang X, Wang J.
Good-Quality and High-Efficiency Dicing for Thick LiNbO3 Wafers Using Picosecond Laser Pulses. Micromachines. 2020; 11(1):51.
https://doi.org/10.3390/mi11010051
Chicago/Turabian Style
Lei, Mingwei, Wenyan Gao, Guang Li, Xinping Wu, Benhai Li, Xuefeng Wang, and Junlong Wang.
2020. "Good-Quality and High-Efficiency Dicing for Thick LiNbO3 Wafers Using Picosecond Laser Pulses" Micromachines 11, no. 1: 51.
https://doi.org/10.3390/mi11010051
APA Style
Lei, M., Gao, W., Li, G., Wu, X., Li, B., Wang, X., & Wang, J.
(2020). Good-Quality and High-Efficiency Dicing for Thick LiNbO3 Wafers Using Picosecond Laser Pulses. Micromachines, 11(1), 51.
https://doi.org/10.3390/mi11010051