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Good-Quality and High-Efficiency Dicing for Thick LiNbO3 Wafers Using Picosecond Laser Pulses

Beijing Institute of Aerospace Control Devices, Beijing 100094, China
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Micromachines 2020, 11(1), 51; https://doi.org/10.3390/mi11010051
Received: 29 November 2019 / Revised: 21 December 2019 / Accepted: 27 December 2019 / Published: 31 December 2019
(This article belongs to the Section D:Materials and Processing)
Lithium niobate (LiNbO3) has become popular with applications in electronics and communication industries due to its excellent electro-optical and nonlinear properties. This paper presents the influence of laser power, repetition frequency, number of subpulses, depth of each pass, and scanning velocity in picosecond laser dicing on multiple characteristics of LiNbO3 using the Taguchi method. By means of analysis of variance and analysis of relations between the characteristics, the optimal ps-laser-dicing parameter is obtained with good quality and high efficiency, which is applied to LiNbO3 products. The result indicates that picosecond laser dicing provides an alternative to machine thick LiNbO3 wafers with narrow kerf width, micro chipping, smooth surface, and high productivity. View Full-Text
Keywords: laser dicing; picosecond laser; dicing quality optimization; thick lithium niobate (LiNbO3) wafers laser dicing; picosecond laser; dicing quality optimization; thick lithium niobate (LiNbO3) wafers
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Lei, M.; Gao, W.; Li, G.; Wu, X.; Li, B.; Wang, X.; Wang, J. Good-Quality and High-Efficiency Dicing for Thick LiNbO3 Wafers Using Picosecond Laser Pulses. Micromachines 2020, 11, 51.

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