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Implementation of a CMOS/MEMS Accelerometer with ASIC Processes

Institute of Electronic Engineering, National Chiao Tung University, Hsinchu 300, Taiwan
Author to whom correspondence should be addressed.
Micromachines 2019, 10(1), 50;
Received: 17 December 2018 / Revised: 7 January 2019 / Accepted: 8 January 2019 / Published: 12 January 2019
(This article belongs to the Special Issue MEMS/NEMS Sensors: Fabrication and Application)
PDF [11715 KB, uploaded 12 January 2019]


This paper presents the design, simulation and mechanical characterization of a newly proposed complementary metal-oxide semiconductor (CMOS)/micro-electromechanical system (MEMS) accelerometer. The monolithic CMOS/MEMS accelerometer was fabricated using the 0.18 μm application-specific integrated circuit (ASIC)-compatible CMOS/MEMS process. An approximate analytical model for the spring design is presented. The experiments showed that the resonant frequency of the proposed tri-axis accelerometer was around 5.35 kHz for out-plane vibration. The tri-axis accelerometer had an area of 1096 μm × 1256 μm. View Full-Text
Keywords: accelerometer design; spring design; analytical model accelerometer design; spring design; analytical model

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Liu, Y.-S.; Wen, K.-A. Implementation of a CMOS/MEMS Accelerometer with ASIC Processes. Micromachines 2019, 10, 50.

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