Article Versions Notes

Zhao J, Zhang J, Su H, Zhang Y, Li K, Mei H, Wu C, Zhu Q, Gong W. Multiscale Finite Element Analysis of Warping Suppression in Microelectronics with Graded SiC/Al Composites. Materials. 2025; 18(16):3788. https://doi.org/10.3390/ma18163788

Zhao, Junfeng, Junliang Zhang, Hao Su, Yu Zhang, Kai Li, Haijuan Mei, Changwei Wu, Qingfeng Zhu, and Weiping Gong. 2025. "Multiscale Finite Element Analysis of Warping Suppression in Microelectronics with Graded SiC/Al Composites" Materials 18, no. 16: 3788. https://doi.org/10.3390/ma18163788

Zhao, J., Zhang, J., Su, H., Zhang, Y., Li, K., Mei, H., Wu, C., Zhu, Q., & Gong, W. (2025). Multiscale Finite Element Analysis of Warping Suppression in Microelectronics with Graded SiC/Al Composites. Materials, 18(16), 3788. https://doi.org/10.3390/ma18163788