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Journal: Materials, 2025
Volume: 18
Number: 2480
2480
Article: Evaluation of Adhesion Properties of Electrodeposited Copper Thin Films: Theoretical and Experimental Approach
Authors: by Ivana O. Mladenović, Jelena S. Lamovec, Dana G. Vasiljević-Radović, Rastko Vasilić, Vesna J. Radojević and Nebojša D. Nikolić
Link: https://www.mdpi.com/1996-1944/18/11/2480

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