Kao, C.-W.; Kung, P.-Y.; Chang, C.-C.; Huang, W.-C.; Chang, F.-L.; Kao, C.R.
Highly Robust Ti Adhesion Layer during Terminal Reaction in Micro-Bumps. Materials 2022, 15, 4297.
https://doi.org/10.3390/ma15124297
AMA Style
Kao C-W, Kung P-Y, Chang C-C, Huang W-C, Chang F-L, Kao CR.
Highly Robust Ti Adhesion Layer during Terminal Reaction in Micro-Bumps. Materials. 2022; 15(12):4297.
https://doi.org/10.3390/ma15124297
Chicago/Turabian Style
Kao, Chen-Wei, Po-Yu Kung, Chih-Chia Chang, Wei-Chen Huang, Fu-Ling Chang, and C. R. Kao.
2022. "Highly Robust Ti Adhesion Layer during Terminal Reaction in Micro-Bumps" Materials 15, no. 12: 4297.
https://doi.org/10.3390/ma15124297
APA Style
Kao, C.-W., Kung, P.-Y., Chang, C.-C., Huang, W.-C., Chang, F.-L., & Kao, C. R.
(2022). Highly Robust Ti Adhesion Layer during Terminal Reaction in Micro-Bumps. Materials, 15(12), 4297.
https://doi.org/10.3390/ma15124297