Reprint
Simulation and Reliability Assessment of Advanced Packaging
Edited by
April 2024
296 pages
- ISBN978-3-7258-0972-1 (Hardback)
- ISBN978-3-7258-0971-4 (PDF)
This book is a reprint of the Special Issue Simulation and Reliability Assessment of Advanced Packaging that was published in
Chemistry & Materials Science
Engineering
Physical Sciences
Summary
Topics covered in this reprint include material characterization, theoretical and empirical methods, modeling, simulation technology, design and validation, and AI-assisted design-on-simulation technology for electronic packaging. Package design engineers, researchers, and graduate students involved in thermal/mechanical modeling, package design, material selection, qualification, and reliability assessment of advanced packaging will benefit from this reprint.
Format
- Hardback
License and Copyright
© 2024 by the authors; CC BY-NC-ND license
Keywords
flip-chip package; 2.5D package; thermal warpage; strain gauge; electronic packaging; dynamic storage modulus; loss tangent; optimization; bivariate cut-HDMR; semiconductor packaging; central composite design; R-squared; relative average absolute error; flip chip package on package; finite element analysis; viscoelastic behavior; process-induced warpage; trace mapping; effective modeling; solder joint fatigue risk estimation; wafer level chip-scaled packaging; artificial neural network; recurrent neural network; generic algorithm; principle component analysis; time/temperature-dependent nonlinearity; MOSFET; TSV; annealing process; finite element analysis; carrier mobility estimation; FEM simulation; WLP; AI; machine learning; ANN; RNN; SVR; KRR; KNN; RF; regression model; electro-thermal coupling analysis; power MOSFET inverter; power loss; circuit simulation; computational fluid dynamics; Foster thermal network; Micro-Electro-Mechanical Systems; moisture sensitivity level test; reflow process; finite element method; cohesive zone model; bonding strength; precondition test; low-temperature co-fired ceramics (LTCCs); dielectric constant; dissipation factor; machine learning; numerical simulation; thermal design; thermal stress; PVT growth; AlN single crystals; flip-chip process; strip warpage; bump; Ag–In alloy pastes; mechanical alloying; power semiconductor packaging; die attachment; mechanical properties; oxidation mechanism; multiple reflows; synchrotron; composite solder; Wafer-Level Package (WLP); Finite Element Analysis (FEA); machine learning; Kernel Ridge Regression (KRR); Cluster algorithm; micro-joints; solid-state reaction; intermetallic; adhesion layer; Equation-Informed Neural Networks; advanced electronic packaging; numerical Bayesian Inference; constitutive equations; Pb-free SAC305 solders