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Journal: MaterialsVolume: 14Number: 6570
Article: Contact Reactive Brazing of TC4 Alloy to Al7075 Alloy with Deposited Cu Interlayer
  • Authors:
  • Mengjuan Yang1,
  • Chaonan Niu2 and
  • Shengpeng Hu2
  • et al.
Link: https://www.mdpi.com/1996-1944/14/21/6570

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